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AM6251ATCGHAALW

Texas Instruments

AM6251ATCGHAALW by Texas Instruments

AM6251ATCGHAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. This IC is ideal for applications requiring a very thin profile and fine pitch grid array package style.

Median Price

$21.436

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,878 parts In-Stock

1+ parts

$15.531

100+ parts

$13.566

1k+ parts

$9.356

10k+ parts

-

1,878

$15.531

$13.566

$9.356

-

Mouser Electronics

USA . 117 parts In-Stock

1+ parts

$27.340

100+ parts

$20.430

1k+ parts

$17.170

10k+ parts

-

117

$27.340

$20.430

$17.170

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 670 parts In-Stock

1+ parts

$14.754

100+ parts

-

1k+ parts

-

10k+ parts

-

670

$14.754

-

-

-

Vyrian

USA . 5,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,083

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 486 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$1.330

-

-

-

Northwest PG Solutions

USA . 1,701 parts In-Stock

1+ parts

$1.463

100+ parts

-

1k+ parts

-

10k+ parts

-

1,701

$1.463

-

-

-

Semicontronic

India . 847 parts In-Stock

1+ parts

$13.200

100+ parts

$12.870

1k+ parts

$12.804

10k+ parts

-

847

$13.200

$12.870

$12.804

-

Ampacity Inc.

Singapore . 600 parts In-Stock

1+ parts

$13.200

100+ parts

-

1k+ parts

-

10k+ parts

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600

$13.200

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-

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Corphita

USA . 3,843 parts In-Stock

1+ parts

$13.978

100+ parts

-

1k+ parts

-

10k+ parts

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3,843

$13.978

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-

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Corohmni

South Africa . 118 parts In-Stock

1+ parts

$15.531

100+ parts

-

1k+ parts

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10k+ parts

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118

$15.531

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Overview

Unlock the power of cutting-edge technology with the AM6251ATCGHAALW by Texas Instruments. Manufactured by the industry leader in semiconductor solutions, this product belongs to the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for a wide range of applications. With its high-quality construction and advanced features, this product offers unmatched value to customers seeking reliable performance and innovation. Experience the benefits and advantages that only Texas Instruments can deliver with the AM6251ATCGHAALW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the integrated circuits inside, making the product suitable for various environments and handling conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the product onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 0.79 V

A high maximum supply voltage of 0.79 V allows for reliable operation under varying power input conditions, ensuring stability and performance.

Package Shape: SQUARE

A square package shape helps in efficient placement and alignment of the product on circuit boards, optimizing space utilization and making for a neat and organized design.

No. of Terminals: 425

Having a high number of terminals (425) enables the product to support a wide range of functionalities and connections, increasing its versatility and application possibilities.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact and thin profile with fine pitch, allowing for dense packing of components on a board, leading to miniaturization and improved overall system performance.

Minimum Supply Voltage: 0.715 V

With a low minimum supply voltage of 0.715 V, the product can operate efficiently even in low-power situations, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance in demanding thermal conditions, enhancing the product's durability and suitability for harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively in cold environments without compromising performance, expanding its range of possible applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering or connection to the circuit board, enhancing reliability and stability of the product during operation.

Maximum Seated Height: 0.89 mm

A low maximum seated height of 0.89 mm contributes to a slim and compact overall design, making the product ideal for space-constrained applications and enabling sleek aesthetics.

Width: 13 mm

The moderate width of 13 mm strikes a balance between compactness and ease of handling, providing versatility in installation options without compromising on stability or performance.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, the product can withstand high-temperature soldering processes without damage, ensuring reliable and robust solder joints for secure connections.

Length: 13 mm

A compact length of 13 mm contributes to the overall small form factor of the product, allowing for efficient board layout and integration in space-limited designs.

Peripheral IC Type: SoC

Being a System-on-Chip (SoC) peripheral IC type, the product integrates multiple functions into a single chip, reducing external component count, board space, and power consumption while enhancing overall system efficiency and performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and faster switching speeds, making the product energy-efficient, reliable, and suitable for a wide range of applications.

Terminal Form: BALL

Having a ball terminal form enables precise and reliable connections during soldering or mounting processes, ensuring secure attachment to circuit boards and enhancing overall system integrity.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage of 0.75 V provides a stable operating voltage for the product, ensuring consistent performance and reliability across different usage scenarios.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for high-density mounting and precise alignment of terminals on the product, facilitating efficient connections and enabling compact and space-saving designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product is resistant to moisture-related issues during storage, handling, and manufacturing processes, ensuring long-term reliability and performance in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6251ATCGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6251ATCGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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