Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Width: 35 mm;
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Other Function uPs,uCs & Peripheral ICs XCVE1752-2LSENSVG1369 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
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XCVE1752-2LSENSVG1369 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
LL4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
1N4148
Panjit International
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148-GS08
Vishay Telefunken
Crimson Semiconductor
SS495A-SP
Honeywell Sensing And Control
SS495A-SP by Honeywell is a magnetic field sensor with 10.5V max supply voltage, 3" body width, and 1.5% linearity. Ideal for applications requiring a Hall effect sensor with -40 to 150°C operating temperature range, such as position sensing in automotive or industrial systems.
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Bkc Semiconductors
Changzhou Starsea Electronics
Taitron Components
STM32H753BIT6
STMicroelectronics
STM32H753BIT6 by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and extensive peripherals for industrial applications like CAN, Ethernet, and USB connectivity. With a wide temperature range of -40 to +85 °C, it's ideal for demanding environments requiring high-speed processing capabilities.
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
MIMXRT106FCVL5B
NXP Semiconductors
NXP's MIMXRT106FCVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating b/w -40 to 105 °C, it has a supply voltage range of 1.15-1.26 V and can withstand peak reflow at 260 °C for up to 40 seconds. Ideal for applications requiring high-performance microcontrollers in compact form factors.
MSP430F67641AIPZ
Texas Instruments
MSP430F67641AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with 8192 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications requiring a low-profile package style with a max seated height of 1.6mm.
MCIMX7D2DVM12SD
MCIMX7D2DVM12SD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 1.2-1.25 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.
CYAT827AZA59-2200A
PSoC;
XCZU7EV-L2FFVC1156E
Xilinx
The Xilinx XCZU7EV-L2FFVC1156E is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C and has a supply voltage range of 0.698-0.742 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in various electronic systems.
USB2660I-JZX-03
Microchip Technology
USB2660I-JZX-03 by Microchip operates at 3.3V with a max supply current of 275mA. This CMOS technology microprocessor circuit has 64 terminals in a square package style, suitable for industrial applications requiring a temp range of -40 to 85 °C.
TDA8035HN/C1,118
NXP Semiconductors' TDA8035HN/C1,118 is a 32-terminal IC with a supply voltage range of 2.7V to 5.5V and operates b/w -25°C to 85°C. This MICROPROCESSOR CIRCUIT has a max supply current of 220mA and is ideal for applications requiring low power consumption in compact designs. The chip carrier package style with very thin profile makes it suitable for space-constrained environments.
TMS320DM368ZCE48
TMS320DM368ZCE48 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it ideal for applications requiring low power consumption and high performance in compact designs.
OMAPL138EZWTD4E
OMAPL138EZWTD4E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 90 °C, suitable for applications requiring high-speed processing and connectivity via I2C, SPI, UART, and USB interfaces.
DA14531MOD-00F01002
Renesas Electronics
SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;
XCZU7EG-3FFVC1156E
XCZU7EG-3FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.873-0.927 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.
MCIMX31CVMN4CR2
MCIMX31CVMN4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates at 1.22-1.47V, suitable for industrial applications. Featuring 473 terminals in a low profile grid array package, it can withstand temperatures from -40 to 85°C.
MSP430F6779AIPEU
MSP430F6779AIPEU by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, 3 DMA channels, and peripherals like BOR, RTC, and WDT. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.
TCI6630K2LCMSA2
TCI6630K2LCMSA2 by Texas Instruments is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0.902V to 0.997V and can withstand peak reflow temperature of 245°C for up to 30s. Ideal for high-performance computing applications requiring advanced processing capabilities.
MC13213R2
Freescale Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 71; Package Code: VFLGA; Package Shape: SQUARE;
CY8C4247AZS-M485
CY8C4247AZS-M485 by Infineon is a 64-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.71V to 1.89V. Ideal for applications requiring low-profile, fine-pitch ICs in automotive electronics meeting AEC-Q100 standards.
CY8CPLC10-28PVXIT
Cypress Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
NRF52832-QFAB-R7
Nordic Semiconductor Asa
NRF52832-QFAB-R7 by Nordic Semiconductor Asa is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for applications requiring low-profile, surface-mountable chips in various electronic devices.
EFR32MG21A020F512IM32-B
Silicon Labs
EFR32MG21A020F512IM32-B by Silicon Labs is a 32-terminal, square-shaped chip carrier with a supply voltage range of 1.71V to 3.8V. Operating b/w -40°C to 125°C, it's an automotive-grade System on Chip (SoC) suitable for various IoT applications due to its CMOS technology and compact dimensions of 4mm x 4mm.
XC7Z010-3CLG225E
The Xilinx XC7Z010-3CLG225E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.
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XCVE1752-1MSIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;
XCVE2002-1LSESFVA784
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
XCVE2302-1MSISFVA784
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
XCVE1752-2HSINSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
XCVE1752-1MSIVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
XCVE1752-1LSIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2197,47X47,36;
XCVE1752-1LLIVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
XCVE1752-2HSIVSVA1596
XCVE1752-1LSEVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;
XCVE1752-1MLIVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Width: 37.5 mm;
XCVE1752-1MLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVE1752-1MSINSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
XCVE1752-1LSIVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;
XCVE1752-1LSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
XCVE1752-1MSENSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
XCVE1752-1LSENSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
XCVE1752-1MSEVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
XCVE1752-1MLINSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVE1752-1LLINSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;
XCVE1752-1LLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
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