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DM6446ANB6C2127VC

Texas Instruments

DM6446ANB6C2127VC by Texas Instruments

DM6446ANB6C2127VC by Texas Instruments is a microprocessor circuit with a package style of grid array, low profile, fine pitch. It operates at a max supply voltage of 1.26V and has a min operating temperature of 0°C. This IC is commonly used in various applications requiring high-performance processing capabilities.

Median Price

$56.043

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$56.043

100+ parts

-

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750

$56.043

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Vyrian

USA . 4,355 parts In-Stock

1+ parts

-

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4,355

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Digiode

USA . 1,242 parts In-Stock

1+ parts

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1,242

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 247 parts In-Stock

1+ parts

$3.000

100+ parts

-

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247

$3.000

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Semicontronic

India . 409 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

10k+ parts

-

409

$9.000

$8.775

$8.730

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$13.417

100+ parts

$12.209

1k+ parts

$11.002

10k+ parts

-

200

$13.417

$12.209

$11.002

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AZTECH Wire

Italy . 367 parts In-Stock

1+ parts

$18.329

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367

$18.329

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Ampacity Inc.

Singapore . 1,437 parts In-Stock

1+ parts

$19.000

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1,437

$19.000

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Parana Technologies

USA . 824 parts In-Stock

1+ parts

$19.045

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$19.100

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824

$19.045

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$19.100

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ChromeModa Solutions

Germany . 5,564 parts In-Stock

1+ parts

$21.399

100+ parts

$17.547

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5,564

$21.399

$17.547

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IDEA Electronic Components Group

UK . 2,322 parts In-Stock

1+ parts

$21.399

100+ parts

$20.329

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$19.259

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2,322

$21.399

$20.329

$19.259

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Corohmni

South Africa . 3,095 parts In-Stock

1+ parts

$56.043

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3,095

$56.043

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Continental Prestige Electronics

USA . 242 parts In-Stock

1+ parts

$56.043

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$54.922

242

$56.043

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$54.922

Netroflash

USA . 100 parts In-Stock

1+ parts

$56.043

100+ parts

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1k+ parts

$53.241

10k+ parts

$52.120

100

$56.043

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$53.241

$52.120

Microchip USA

USA . 1,499 parts In-Stock

1+ parts

$108.490

100+ parts

$106.600

1k+ parts

$105.660

10k+ parts

$104.720

1,499

$108.490

$106.600

$105.660

$104.720

Argo Parts USA

USA . 1,735 parts In-Stock

1+ parts

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1,735

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DigiPath Technology Company

USA . 1,562 parts In-Stock

1+ parts

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100+ parts

$19.293

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1,562

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$19.293

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Corphita

USA . 1,230 parts In-Stock

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1,230

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Overview

Experience true excellence with the DM6446ANB6C2127VC by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications. What sets the DM6446ANB6C2127VC apart is its exceptional value and numerous benefits for customers. With its compact design and advanced technology, this microprocessor circuit provides unparalleled performance. Whether you're looking to enhance your electronic devices or streamline your systems, the DM6446ANB6C2127VC is the perfect choice. Trust Texas Instruments for excellence and unlock limitless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and reducing overall product size.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for flexibility in power input options, accommodating a wide range of power sources.

Package Shape: SQUARE

The square package shape is efficient for space utilization on circuit boards, maximizing component density and minimizing wasted space.

No. of Terminals: 361

With a high number of terminals, this product can support complex and advanced functionalities, making it suitable for sophisticated electronic applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures efficient power consumption and operation, making the product energy-efficient and cost-effective.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in harsh environmental conditions, ensuring the product's durability and longevity.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate in a wide range of temperature environments, enhancing its versatility.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure soldering onto circuit boards, simplifying assembly and ensuring proper connection.

Maximum Seated Height: 1.4 mm

The low maximum seated height minimizes the overall profile of the component, making it suitable for applications with space constraints or height limitations.

Width: 16 mm

The compact width of 16 mm enables easy integration into tight spaces on circuit boards, optimizing layout and design efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures efficient and reliable soldering during assembly, reducing the risk of overheating or damage to the component.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for robust soldering processes, ensuring strong and durable connections for long-lasting performance.

Length: 16 mm

The compact length of 16 mm enables flexible placement and layout options on circuit boards, enhancing design versatility and space optimization.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of microprocessor circuitry enhances the product's processing capabilities, enabling advanced functionality and performance in electronic systems.

Technology: CMOS

The use of CMOS technology offers low power consumption, high-speed operation, and compatibility with a wide range of devices and applications, making the product efficient and versatile.

Terminal Form: BALL

The use of ball terminals provides reliable connections and allows for easy rework or replacement, ensuring flexibility and ease of maintenance for the product.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V is commonly used in many electronic devices, ensuring compatibility and interoperability with various systems and components.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting on circuit boards, maximizing component placement and optimizing overall board space.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the product has moderate sensitivity to moisture, requiring standard handling and storage precautions to maintain component integrity and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM6446ANB6C2127VC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM6446ANB6C2127VC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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