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DM6446GB6C0121MV

Texas Instruments

DM6446GB6C0121MV by Texas Instruments

DM6446GB6C0121MV by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C, with supply voltage range of 1.14-1.26 V. Ideal for applications requiring low profile and fine pitch technology.

Median Price

$56.043

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 93 parts In-Stock

1+ parts

$56.043

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93

$56.043

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Vyrian

USA . 4,556 parts In-Stock

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4,556

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Digiode

USA . 4,531 parts In-Stock

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4,531

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,321 parts In-Stock

1+ parts

$6.000

100+ parts

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1,321

$6.000

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AZTECH Wire

Italy . 602 parts In-Stock

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$6.603

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602

$6.603

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One Stop Electronics

USA . 443 parts In-Stock

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$18.000

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443

$18.000

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Semicontronic

India . 623 parts In-Stock

1+ parts

$21.000

100+ parts

$20.475

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$20.370

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623

$21.000

$20.475

$20.370

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Corohmni

South Africa . 2,397 parts In-Stock

1+ parts

$56.043

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2,397

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Continental Prestige Electronics

USA . 5,814 parts In-Stock

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$56.043

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$54.922

5,814

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$54.922

Netroflash

USA . 100 parts In-Stock

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$56.043

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100

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Parana Technologies

USA . 1,727 parts In-Stock

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$74.073

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DigiPath Technology Company

USA . 1,834 parts In-Stock

1+ parts

$81.563

100+ parts

$75.038

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1,834

$81.563

$75.038

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ChromeModa Solutions

Germany . 5,055 parts In-Stock

1+ parts

$83.228

100+ parts

$68.247

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5,055

$83.228

$68.247

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IDEA Electronic Components Group

UK . 326 parts In-Stock

1+ parts

$83.228

100+ parts

$79.067

1k+ parts

$74.905

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326

$83.228

$79.067

$74.905

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Microchip USA

USA . 1,039 parts In-Stock

1+ parts

$108.490

100+ parts

$106.600

1k+ parts

$105.660

10k+ parts

$104.720

1,039

$108.490

$106.600

$105.660

$104.720

Corphita

USA . 1,873 parts In-Stock

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Argo Parts USA

USA . 352 parts In-Stock

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352

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Overview

Experience superior performance and reliability with the DM6446GB6C0121MV by Texas Instruments. Known for their high-quality products, Texas Instruments has once again delivered a top-of-the-line solution in the category of Other Function uPs, uCs & Peripheral ICs. This versatile product offers customers a wide range of applications, from microprocessor circuits to various peripheral functions. With its cutting-edge technology and innovative design, the DM6446GB6C0121MV provides exceptional value and benefits to users, making it the ideal choice for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage provides flexibility in power requirements for various applications.

Package Shape: SQUARE

The square shape allows for efficient use of PCB space and easy integration into compact designs.

No. of Terminals: 361

The high number of terminals provides ample connectivity options for complex circuit designs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures high density and reliability in circuit connections.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures usability in a wide range of temperature environments.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure soldering during assembly.

Maximum Seated Height: 1.4 mm

The low maximum seated height enables slim and compact device designs.

Width: 16 mm

The compact width enables space-efficient PCB layout and integration.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures proper soldering without damaging the components.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliability during the soldering process.

Length: 16 mm

The compact length allows for space-saving and efficient PCB integration.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type provides advanced processing capabilities for complex applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient devices.

Terminal Form: BALL

The ball terminal form ensures reliable connections and facilitates easy rework if needed.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable operating voltage for consistent performance.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density integration and precise soldering.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM6446GB6C0121MV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM6446GB6C0121MV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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