Loading...

TMSDM6446AZWT-COM

Texas Instruments

TMSDM6446AZWT-COM by Texas Instruments

TMSDM6446AZWT-COM by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C with supply voltage range of 1.14-1.26 V, suitable for applications requiring low profile and fine pitch components.

Median Price

$56.043

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$56.043

100+ parts

-

1k+ parts

-

10k+ parts

-

86

$56.043

-

-

-

Vyrian

USA . 4,246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,246

-

-

-

-

Digiode

USA . 887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

887

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,461 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,461

$3.000

-

-

-

AZTECH Wire

Italy . 703 parts In-Stock

1+ parts

$6.802

100+ parts

-

1k+ parts

-

10k+ parts

-

703

$6.802

-

-

-

One Stop Electronics

USA . 572 parts In-Stock

1+ parts

$32.000

100+ parts

-

1k+ parts

-

10k+ parts

-

572

$32.000

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$46.328

100+ parts

$42.158

1k+ parts

$37.989

10k+ parts

-

5,000

$46.328

$42.158

$37.989

-

Continental Prestige Electronics

USA . 6,158 parts In-Stock

1+ parts

$56.043

100+ parts

-

1k+ parts

-

10k+ parts

$54.922

6,158

$56.043

-

-

$54.922

Netroflash

USA . 100 parts In-Stock

1+ parts

$56.043

100+ parts

-

1k+ parts

$53.241

10k+ parts

$52.120

100

$56.043

-

$53.241

$52.120

Parana Technologies

USA . 278 parts In-Stock

1+ parts

$69.086

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$69.086

-

-

-

DigiPath Technology Company

USA . 1,275 parts In-Stock

1+ parts

$76.072

100+ parts

$69.987

1k+ parts

-

10k+ parts

-

1,275

$76.072

$69.987

-

-

ChromeModa Solutions

Germany . 1,256 parts In-Stock

1+ parts

$77.625

100+ parts

$63.652

1k+ parts

-

10k+ parts

-

1,256

$77.625

$63.652

-

-

IDEA Electronic Components Group

UK . 72 parts In-Stock

1+ parts

$77.625

100+ parts

$73.744

1k+ parts

$69.862

10k+ parts

-

72

$77.625

$73.744

$69.862

-

Corohmni

South Africa . 5,158 parts In-Stock

1+ parts

$77.689

100+ parts

-

1k+ parts

-

10k+ parts

-

5,158

$77.689

-

-

-

Microchip USA

USA . 2,561 parts In-Stock

1+ parts

$108.490

100+ parts

$106.600

1k+ parts

$105.660

10k+ parts

$104.720

2,561

$108.490

$106.600

$105.660

$104.720

Argo Parts USA

USA . 4,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,004

-

-

-

-

Corphita

USA . 2,945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,945

-

-

-

-

Overview

Discover the innovative TMSDM6446AZWT-COM by Texas Instruments, a high-quality microprocessor circuit that offers exceptional performance and reliability. With Texas Instruments' renowned reputation for excellence, this product is designed to meet the demands of various applications in the field of Other Function uPs,uCs & Peripheral ICs. Experience the value and benefits of this cutting-edge technology, providing customers with a competitive edge in their projects. Trust in Texas Instruments for superior quality and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for efficient assembly and space-saving on the PCB.

Maximum Supply Voltage: 1.26 V

This ensures safe operation within the specified voltage range, protecting the components from damage.

Package Shape: SQUARE

Square packages are easier to handle and align on the PCB, simplifying the assembly process.

No. of Terminals: 361

Having a high number of terminals allows for more connectivity options, making the product versatile for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design, efficient heat dissipation, and precise alignment on the PCB.

Minimum Supply Voltage: 1.14 V

Having a low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing flexibility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature enables reliable performance in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality even in cold environments, making the product suitable for diverse applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and prevents interference with other components on the PCB.

Maximum Seated Height: 1.4 mm

The low seated height allows for a slim profile, saving space on the PCB and enabling compact designs.

Width: 16 mm

The moderate width makes the product suitable for various PCB layouts and mechanical designs.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the product can withstand reflow soldering processes without degradation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates the product's reliability and durability during soldering.

Length: 16 mm

The compact length allows for efficient use of space on the PCB, enabling dense component placement.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities and functionality.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: BALL

Ball terminals provide reliable connections and enable quick and efficient soldering during assembly.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable and efficient operation within the specified voltage range.

Terminal Pitch: 0.8 mm

The fine terminal pitch enables high-density mounting on the PCB, saving space and facilitating intricate designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product has moderate sensitivity to moisture, allowing for safe storage and handling in standard environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMSDM6446AZWT-COM attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMSDM6446AZWT-COM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 5