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TMSDM6467CCUT6TAN

Texas Instruments

TMSDM6467CCUT6TAN by Texas Instruments

TMSDM6467CCUT6TAN by Texas Instruments is a MICROPROCESSOR CIRCUIT with 529 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V, making it ideal for high-performance computing applications.

Median Price

$82.440

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 116 parts In-Stock

1+ parts

-

100+ parts

$73.280

1k+ parts

$65.570

10k+ parts

$61.710

116

-

$73.280

$65.570

$61.710

DigiKey

USA . 116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

116

-

-

-

-

Verical

USA . 116 parts In-Stock

1+ parts

-

100+ parts

$91.600

1k+ parts

$81.963

10k+ parts

$77.138

116

-

$91.600

$81.963

$77.138

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,929 parts In-Stock

1+ parts

$77.358

100+ parts

-

1k+ parts

-

10k+ parts

-

3,929

$77.358

-

-

-

Vyrian

USA . 6,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,663

-

-

-

-

DigiKey Marketplace

USA . 116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

116

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 934 parts In-Stock

1+ parts

$31.957

100+ parts

-

1k+ parts

$92.825

10k+ parts

-

934

$31.957

-

$92.825

-

Corohmni

South Africa . 531 parts In-Stock

1+ parts

$32.339

100+ parts

-

1k+ parts

-

10k+ parts

-

531

$32.339

-

-

-

ChromeModa Solutions

Germany . 5,978 parts In-Stock

1+ parts

$35.907

100+ parts

$29.444

1k+ parts

-

10k+ parts

-

5,978

$35.907

$29.444

-

-

IDEA Electronic Components Group

UK . 1,574 parts In-Stock

1+ parts

$35.907

100+ parts

$34.112

1k+ parts

$32.316

10k+ parts

-

1,574

$35.907

$34.112

$32.316

-

Corphita

USA . 3,913 parts In-Stock

1+ parts

$73.287

100+ parts

-

1k+ parts

-

10k+ parts

-

3,913

$73.287

-

-

-

Vigor

Singapore . 116 parts In-Stock

1+ parts

$78.170

100+ parts

-

1k+ parts

-

10k+ parts

-

116

$78.170

-

-

-

Component Stockers USA

USA . 142 parts In-Stock

1+ parts

$84.260

100+ parts

$79.210

1k+ parts

-

10k+ parts

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142

$84.260

$79.210

-

-

Microchip USA

USA . 2,648 parts In-Stock

1+ parts

$136.350

100+ parts

$133.980

1k+ parts

$132.790

10k+ parts

$131.610

2,648

$136.350

$133.980

$132.790

$131.610

DigiPath Technology Company

USA . 822 parts In-Stock

1+ parts

-

100+ parts

$32.374

1k+ parts

-

10k+ parts

-

822

-

$32.374

-

-

Overview

Experience the cutting-edge technology of the TMSDM6467CCUT6TAN by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This versatile microprocessor circuit offers endless possibilities in various applications, providing customers with unbeatable value and exceptional performance. With advanced features and reliable functionality, this product is a game-changer in the world of Other Function uPs,uCs & Peripheral ICs. Trust in Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage capability ensures stable operation and compatibility with different power sources.

Package Shape: SQUARE

The square package shape provides a compact form factor, saving space on the PCB and making it suitable for compact designs.

No. of Terminals: 529

The high number of terminals allows for a greater number of connections, enabling more complex circuit designs and functionalities.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style paired with a heat sink/slug design helps in efficient heat dissipation, ensuring optimal performance under high operating temperatures.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage requirement allows for energy-efficient operation and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and prolonged use without overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this product suitable for a wide range of industrial and commercial applications, even in cold environments.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finish materials ensures good conductivity, corrosion resistance, and durability for reliable connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy PCB mounting and soldering, improving the overall assembly process.

Maximum Seated Height: 3.3 mm

The relatively low maximum seated height allows for a slim profile and space-saving installation, ideal for applications with limited vertical clearance.

Width: 19 mm

The compact width dimension makes this product suitable for designs where space is a constraint, fitting well within tight layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering processes during manufacturing, reducing production time.

Peak Reflow Temperature °C: 245

The high peak reflow temperature capability allows for reliable solder joints and robust connections even in demanding thermal conditions.

Length: 19 mm

The compact length dimension further contributes to the space-saving design of this product, making it suitable for constrained layouts.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities and functionalities, making it versatile and suitable for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high speed operation, and compatibility with a wide range of digital systems, enhancing the overall performance.

Terminal Form: BALL

The use of ball terminals facilitates reliable and efficient connections, ensuring good signal integrity and robust performance in various applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage specification ensures optimal performance and compatibility with standard power sources, making integration easier.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm enables dense packing of terminals, allowing for more connections in a limited space and supporting high functionality.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product is less susceptible to moisture-induced damage during storage, handling, and assembly, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMSDM6467CCUT6TAN attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMSDM6467CCUT6TAN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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