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TMSDM6467TCUT1TAN

Texas Instruments

TMSDM6467TCUT1TAN by Texas Instruments

TMSDM6467TCUT1TAN by Texas Instruments is a MICROPROCESSOR CIRCUIT with 529 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w 0-85 °C with supply voltage range of 1.235-1.365 V, making it ideal for high-performance computing applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,144 parts In-Stock

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Digiode

USA . 2,992 parts In-Stock

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2,992

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Distributors (Availability)

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AZTECH Wire

Italy . 246 parts In-Stock

1+ parts

$7.462

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246

$7.462

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One Stop Electronics

USA . 302 parts In-Stock

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$32.000

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302

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Parana Technologies

USA . 1,355 parts In-Stock

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$71.061

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$71.061

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Corohmni

South Africa . 2,366 parts In-Stock

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$77.027

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2,366

$77.027

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ChromeModa Solutions

Germany . 5,132 parts In-Stock

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$79.844

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$65.472

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5,132

$79.844

$65.472

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IDEA Electronic Components Group

UK . 264 parts In-Stock

1+ parts

$79.844

100+ parts

$75.852

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$71.860

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264

$79.844

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$71.860

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Corphita

USA . 3,859 parts In-Stock

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DigiPath Technology Company

USA . 364 parts In-Stock

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$71.987

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364

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Overview

Experience unparalleled performance and reliability with the TMSDM6467TCUT1TAN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge solutions for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. This product offers exceptional value, benefits, and advantages to customers looking for top-quality components. Trust Texas Instruments for superior technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.365 V

Provides a sufficient maximum supply voltage for reliable operation.

Package Shape: SQUARE

Square shape allows for a compact design and optimal use of space on the circuit board.

No. of Terminals: 529

Having a high number of terminals allows for connecting various components efficiently.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high density and precise connections.

Minimum Supply Voltage: 1.235 V

Provides a minimum supply voltage to ensure stable operation.

Maximum Operating Temperature: 85 °C

Can operate at relatively high temperatures without compromising performance.

Minimum Operating Temperature: 0 °C

Can also operate effectively at low temperatures, adding to its versatility.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and durability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connection and maintenance.

Maximum Seated Height: 3.3 mm

With a maximum seated height of 3.3 mm, it can fit into compact spaces.

Width: 19 mm

With a moderate width of 19 mm, it can be easily integrated into various applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliability during assembly.

Peak Reflow Temperature °C: 245

Can handle peak reflow temperatures of 245°C, meeting industry standards.

Length: 19 mm

Has a length of 19 mm, making it suitable for compact designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, it offers advanced processing capabilities for various applications.

Technology: CMOS

CMOS technology ensures low power consumption and reliable performance.

Terminal Form: BALL

Having a ball terminal form allows for easy soldering and connectivity.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V is suitable for most applications, providing stable operation.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, it allows for precise connections and space-saving layout.

Moisture Sensitivity Level (MSL): 4

MSL level of 4 indicates that the product can withstand moderate moisture exposure during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMSDM6467TCUT1TAN attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMSDM6467TCUT1TAN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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