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OMAPL138EZCEA3E

Texas Instruments

OMAPL138EZCEA3E by Texas Instruments

OMAPL138EZCEA3E by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature grade range from -40 to 105 °C and has a low profile GRID ARRAY package style. With a max supply voltage of 1.35 V, it is suitable for various applications requiring high-performance processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,806 parts In-Stock

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Digiode

USA . 2,304 parts In-Stock

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Nova Conductors

Japan . 69 parts In-Stock

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AZTECH Wire

Italy . 478 parts In-Stock

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$6.159

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478

$6.159

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Ampacity Inc.

Singapore . 1,333 parts In-Stock

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$17.000

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One Stop Electronics

USA . 1,055 parts In-Stock

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$32.000

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Corohmni

South Africa . 2,563 parts In-Stock

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$38.202

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Parana Technologies

USA . 1,936 parts In-Stock

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$41.389

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ChromeModa Solutions

Germany . 4,848 parts In-Stock

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$46.505

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$38.134

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IDEA Electronic Components Group

UK . 2,351 parts In-Stock

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$46.505

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$44.180

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$41.854

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$41.854

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Microchip USA

USA . 1,867 parts In-Stock

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Corphita

USA . 1,523 parts In-Stock

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DigiPath Technology Company

USA . 1,242 parts In-Stock

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$41.929

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the OMAPL138EZCEA3E by Texas Instruments, a top-of-the-line microprocessor circuit designed to meet industrial standards with cutting-edge CMOS technology. This high-quality product boasts a compact square shape with 361 terminals in a grid array, offering customers unparalleled performance and reliability for a wide range of applications. With a low profile design and fine pitch package style, this peripheral IC is perfect for those seeking advanced solutions for their electronic projects. Trust Texas Instruments to deliver excellence in every component, providing you with the value and benefits you need to take your innovations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for a variety of applications while ensuring longevity.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the product onto a circuit board, saving time and effort during production.

Maximum Supply Voltage: 1.35 V

This high maximum supply voltage allows for flexibility in power requirements, ensuring compatibility with different power sources.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the circuit board and allowing for more components to be added.

No. of Terminals: 361

Having a high number of terminals allows for more connections to other components, increasing the functionality and versatility of the product.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a low profile design with fine pitch, enhancing the overall performance and reliability of the product.

Minimum Supply Voltage: 1.25 V

The low minimum supply voltage ensures efficient power usage and extends the product's battery life, making it ideal for portable devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product is suitable for use in industrial settings where extreme conditions are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold environments, making it versatile for various applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring a stable and long-lasting connection within the circuit.

Terminal Position: BOTTOM

The bottom terminal position simplifies the assembly process and improves signal integrity, leading to better overall performance of the product.

Maximum Seated Height: 1.3 mm

The low maximum seated height allows for a slim and compact design, making the product ideal for applications where space is limited.

Width: 13 mm

With a moderate width, the product can easily fit into standard circuit board layouts, providing compatibility with existing systems.

Maximum Time At Peak Reflow Temperature (s): 30

This short time at peak reflow temperature ensures proper soldering without damaging the components, ensuring reliability and durability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for a strong and secure solder joint, preventing any issues with connectivity or performance.

Length: 13 mm

The moderate length of the product ensures a balanced design that can easily fit into various applications without taking up too much space.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature requirements, the product can withstand harsh conditions and ensure reliable operation in demanding environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type enhances the product's processing capabilities, enabling efficient and advanced functionalities.

Technology: CMOS

Utilizing CMOS technology results in low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form offers a reliable and secure connection, ensuring stable performance and reducing the risk of signal loss or interference.

Nominal Supply Voltage: 1.3 V

Having a nominal supply voltage of 1.3 V ensures compatibility with standard power sources, making it easy to integrate the product into various systems.

Terminal Pitch: 0.65 mm

The fine terminal pitch enables a higher density of connections, allowing for more functionality in a compact design and improving overall performance.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product can withstand exposure to moderate levels of moisture during storage and assembly, ensuring reliability in various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138EZCEA3E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

OMAPL138EZCEA3E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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