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TNETV6446AINZWT8

Texas Instruments

TNETV6446AINZWT8 by Texas Instruments

TNETV6446AINZWT8 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V, making it suitable for various applications requiring low profile, fine pitch GRID ARRAY package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,549 parts In-Stock

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8,549

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Digiode

USA . 707 parts In-Stock

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707

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One Stop Electronics

USA . 1,109 parts In-Stock

1+ parts

$6.000

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1,109

$6.000

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AZTECH Wire

Italy . 644 parts In-Stock

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$19.352

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644

$19.352

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Corohmni

South Africa . 741 parts In-Stock

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$43.133

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741

$43.133

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Parana Technologies

USA . 1,549 parts In-Stock

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$56.618

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1,549

$56.618

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DigiPath Technology Company

USA . 1,724 parts In-Stock

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$62.344

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$57.356

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1,724

$62.344

$57.356

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ChromeModa Solutions

Germany . 3,113 parts In-Stock

1+ parts

$63.616

100+ parts

$52.165

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3,113

$63.616

$52.165

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IDEA Electronic Components Group

UK . 2,026 parts In-Stock

1+ parts

$63.616

100+ parts

$60.435

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$57.254

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2,026

$63.616

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$57.254

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Microchip USA

USA . 254 parts In-Stock

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$128.320

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$126.080

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$124.970

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$123.850

254

$128.320

$126.080

$124.970

$123.850

Corphita

USA . 925 parts In-Stock

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925

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Component Stockers USA

USA . 65 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the TNETV6446AINZWT8 by Texas Instruments, a leading manufacturer in the industry. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, making it perfect for a wide range of applications. With its innovative technology and top-notch performance, this product offers exceptional value and benefits to customers. Experience seamless operation and superior functionality with the TNETV6446AINZWT8, setting a new standard in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space.

Maximum Supply Voltage: 1.26 V

This high maximum supply voltage ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

The square shape helps in compact PCB layout and efficient use of space.

No. of Terminals: 361

With a high number of terminals, this product offers versatility in connectivity options.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style allows for high-density mounting and reliable performance in tight spaces.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures efficient power consumption and flexibility in power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance even in colder environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish ensures good conductivity and reliability in electrical connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering.

Maximum Seated Height: 1.4 mm

Low seated height allows for compact designs and efficient use of space.

Width: 16 mm

The compact width of the product enables easy integration into various electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

This short reflow time helps in efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures strong and durable solder joints for long-lasting performance.

Length: 16 mm

The compact length of the product allows for space-saving and versatile mounting options.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

This type of peripheral IC provides advanced processing capabilities for complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration, making the product energy-efficient and compact.

Terminal Form: BALL

Ball terminal form offers reliable and secure connections for optimum performance.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable and consistent power input for reliable operation.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TNETV6446AINZWT8 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV6446AINZWT8 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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