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TNETX15VEPGE

Texas Instruments

TNETX15VEPGE by Texas Instruments

TNETX15VEPGE by Texas Instruments is a MICROPROCESSOR CIRCUIT with 144 terminals, operating at 3-5V. It features a FLATPACK package style, 0.5mm terminal pitch, and CMOS technology. Ideal for applications requiring low profile and fine pitch components in the temperature range of 0-95°C.

Median Price

$19.100

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$15.280

1k+ parts

$13.670

10k+ parts

$12.860

520

-

$15.280

$13.670

$12.860

DigiKey

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$20.100

1k+ parts

-

10k+ parts

-

520

-

$20.100

-

-

Verical

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$19.100

1k+ parts

$17.087

10k+ parts

$16.075

520

-

$19.100

$17.087

$16.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 42 parts In-Stock

1+ parts

$16.013

100+ parts

$15.396

1k+ parts

-

10k+ parts

-

42

$16.013

$15.396

-

-

Digiode

USA . 952 parts In-Stock

1+ parts

$16.122

100+ parts

-

1k+ parts

-

10k+ parts

-

952

$16.122

-

-

-

Vyrian

USA . 7,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,631

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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906

-

-

-

-

Legend Electronics Inc.

USA . 855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

855

-

-

-

-

DigiKey Marketplace

USA . 520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

520

-

-

-

-

Dan-Mar Components

USA . 42 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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42

-

-

-

-

DF Sales Co.

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20

-

-

-

-

DF Sales Co.

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Connector Distribution Corp

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Right Parts Inc.

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,129 parts In-Stock

1+ parts

$15.130

100+ parts

-

1k+ parts

-

10k+ parts

-

2,129

$15.130

-

-

-

Corphita

USA . 1,784 parts In-Stock

1+ parts

$15.273

100+ parts

-

1k+ parts

-

10k+ parts

-

1,784

$15.273

-

-

-

Parana Technologies

USA . 635 parts In-Stock

1+ parts

$23.114

100+ parts

$2,146.503

1k+ parts

$20.803

10k+ parts

-

635

$23.114

$2,146.503

$20.803

-

DigiPath Technology Company

USA . 1,483 parts In-Stock

1+ parts

$25.452

100+ parts

$23.415

1k+ parts

-

10k+ parts

-

1,483

$25.452

$23.415

-

-

IDEA Electronic Components Group

UK . 1,885 parts In-Stock

1+ parts

$25.971

100+ parts

$24.672

1k+ parts

$23.374

10k+ parts

-

1,885

$25.971

$24.672

$23.374

-

ChromeModa Solutions

Germany . 907 parts In-Stock

1+ parts

$25.971

100+ parts

$21.296

1k+ parts

-

10k+ parts

-

907

$25.971

$21.296

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$34.143

100+ parts

$31.070

1k+ parts

$27.997

10k+ parts

-

2,500

$34.143

$31.070

$27.997

-

A-Z Elektronik GmbH

Germany . 5,841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,841

-

-

-

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Kepictronics

USA . 63 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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63

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-

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-

Overview

Unlock the power of cutting-edge technology with the TNETX15VEPGE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. The TNETX15VEPGE falls under the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for a wide range of applications. Experience the unparalleled value and benefits this product offers, from its reliable performance to its innovative design. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material can provide good durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

Can operate efficiently within the specified voltage range, ensuring stable performance.

Package Shape: SQUARE

Square package shape can help in better utilization of PCB space and alignment during assembly.

Power Supplies (V): 3.3,5

Support for multiple power supply options gives flexibility in designing and compatibility with different systems.

No. of Terminals: 144

Higher number of terminals allow for more connectivity options and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Various package styles provide versatility in design and compatibility with different PCB layouts.

Minimum Supply Voltage: 3 V

Can operate at lower supply voltage, allowing for energy-efficient performance.

Maximum Operating Temperature: 95 °C

High operating temperature range ensures reliability in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Low operating temperature range allows for operation in a wide range of environments.

Terminal Position: QUAD

Quad terminal position provides stable connection and can help optimize PCB layout.

Maximum Seated Height: 1.6 mm

Low seated height allows for compact design and can be suitable for applications with space constraints.

Width: 20 mm

Standard width dimensions provide compatibility with common PCB designs and assembly processes.

Length: 20 mm

Standard length dimensions provide compatibility with common PCB designs and assembly processes.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit offers advanced processing capabilities suitable for a wide range of applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connections during assembly.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and compact PCB design, suitable for small form factor applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TNETX15VEPGE attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of Terminals:

144

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TNETX15VEPGE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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