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TNETV6446AINZWT

Texas Instruments

TNETV6446AINZWT by Texas Instruments

TNETV6446AINZWT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C with supply voltage range of 1.14-1.26 V, making it ideal for low profile applications requiring high processing power and fine pitch connections.

Median Price

$56.043

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$56.043

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550

$56.043

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Vyrian

USA . 4,838 parts In-Stock

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4,838

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Digiode

USA . 3,214 parts In-Stock

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3,214

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 441 parts In-Stock

1+ parts

$10.000

100+ parts

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441

$10.000

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AZTECH Wire

Italy . 673 parts In-Stock

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$11.515

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673

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Semicontronic

India . 1,098 parts In-Stock

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$16.000

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$15.600

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$15.520

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1,098

$16.000

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$15.520

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Parana Technologies

USA . 786 parts In-Stock

1+ parts

$33.355

100+ parts

$3,097.557

1k+ parts

$30.020

10k+ parts

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786

$33.355

$3,097.557

$30.020

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One Stop Electronics

USA . 1,137 parts In-Stock

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$34.000

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DigiPath Technology Company

USA . 622 parts In-Stock

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$36.728

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622

$36.728

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ChromeModa Solutions

Germany . 5,561 parts In-Stock

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$37.478

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$30.732

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IDEA Electronic Components Group

UK . 2,297 parts In-Stock

1+ parts

$37.478

100+ parts

$35.604

1k+ parts

$33.730

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2,297

$37.478

$35.604

$33.730

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Corohmni

South Africa . 1,992 parts In-Stock

1+ parts

$56.043

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Continental Prestige Electronics

USA . 5,481 parts In-Stock

1+ parts

$56.043

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$54.922

5,481

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$54.922

Netroflash

USA . 1,000 parts In-Stock

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$56.043

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$56.043

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Microchip USA

USA . 1,058 parts In-Stock

1+ parts

$108.490

100+ parts

$106.600

1k+ parts

$105.660

10k+ parts

$104.720

1,058

$108.490

$106.600

$105.660

$104.720

Corphita

USA . 1,682 parts In-Stock

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Argo Parts USA

USA . 1,627 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TNETV6446AINZWT microprocessor circuit. This cutting-edge product offers a wide range of applications in the field of Other Function uPs,uCs & Peripheral ICs, providing exceptional performance and versatility. With its advanced technology and innovative design, this product delivers superior value and benefits to customers seeking high-quality solutions for their electronic devices. Trust Texas Instruments to provide you with the best in class products for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the integrated circuits within, making the product resistant to mechanical damage and environmental factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.26 V

With a high maximum supply voltage of 1.26V, this product can handle higher power requirements and voltages, providing flexibility in various applications.

Terminal Finish: TIN SILVER COPPER

The Tin Silver Copper terminal finish ensures good electrical conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making this product energy-efficient and versatile.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TNETV6446AINZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV6446AINZWT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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