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OMAPL132EZWTA2E

Texas Instruments

OMAPL132EZWTA2E by Texas Instruments

OMAPL132EZWTA2E by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at speeds up to 200 rpm and has a low profile GRID ARRAY package style. Ideal for industrial applications requiring a supply voltage range of 1.14V to 1.32V and operating temperatures from -40°C to 105°C.

Median Price

$18.084

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 688 parts In-Stock

1+ parts

$13.539

100+ parts

$11.826

1k+ parts

$8.156

10k+ parts

-

688

$13.539

$11.826

$8.156

-

Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$22.630

100+ parts

$13.820

1k+ parts

$13.630

10k+ parts

-

7

$22.630

$13.820

$13.630

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,775 parts In-Stock

1+ parts

$12.862

100+ parts

-

1k+ parts

-

10k+ parts

-

2,775

$12.862

-

-

-

Vyrian

USA . 3,284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,284

-

-

-

-

Velocity Electronics

USA . 1,666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,666

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 348 parts In-Stock

1+ parts

$11.510

100+ parts

-

1k+ parts

-

10k+ parts

-

348

$11.510

-

-

-

Corphita

USA . 1,787 parts In-Stock

1+ parts

$12.185

100+ parts

-

1k+ parts

-

10k+ parts

-

1,787

$12.185

-

-

-

Corohmni

South Africa . 4,993 parts In-Stock

1+ parts

$15.640

100+ parts

-

1k+ parts

-

10k+ parts

-

4,993

$15.640

-

-

-

Microchip USA

USA . 3,552 parts In-Stock

1+ parts

$38.318

100+ parts

-

1k+ parts

-

10k+ parts

-

3,552

$38.318

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-

-

Parana Technologies

USA . 965 parts In-Stock

1+ parts

$48.674

100+ parts

-

1k+ parts

-

10k+ parts

-

965

$48.674

-

-

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DigiPath Technology Company

USA . 654 parts In-Stock

1+ parts

$53.596

100+ parts

$49.309

1k+ parts

-

10k+ parts

-

654

$53.596

$49.309

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-

ChromeModa Solutions

Germany . 2,805 parts In-Stock

1+ parts

$54.690

100+ parts

$44.846

1k+ parts

-

10k+ parts

-

2,805

$54.690

$44.846

-

-

IDEA Electronic Components Group

UK . 933 parts In-Stock

1+ parts

$54.690

100+ parts

$51.956

1k+ parts

$49.221

10k+ parts

-

933

$54.690

$51.956

$49.221

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

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Overview

Unleash the power of cutting-edge technology with the OMAPL132EZWTA2E by Texas Instruments. Designed to deliver top-notch performance and reliability, this product is a game-changer in the world of Other Function uPs,uCs & Peripheral ICs. With its advanced features and state-of-the-art design, it opens up a whole new realm of possibilities for various applications. Trust in Texas Instruments' reputation for excellence and innovation, and experience the unmatched value and benefits that this product brings to the table. Elevate your projects to the next level with the OMAPL132EZWTA2E and stay ahead of the curve in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options for the product.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy placement on a PCB.

No. of Terminals: 361

The high number of terminals provides a wide range of connectivity options for the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style allows for high density mounting and efficient use of PCB space.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures energy efficiency and can extend battery life in portable devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes the product suitable for industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the product.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and PCB mounting.

Maximum Seated Height: 1.4 mm

Low seated height allows for compact design and reduces the overall profile of the product.

Width: 16 mm

Compact width allows for dense packing of components on a PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Quick reflow time ensures efficient and reliable soldering during production.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability of the product.

Length: 16 mm

Compact length allows for efficient use of PCB space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh environmental conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit allows for advanced processing capabilities in the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for improved performance.

Terminal Form: BALL

Ball terminal form allows for easy soldering and reliable connections.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures compatibility with standard power sources and provides stable operation.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting of components on a PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product is less sensitive to moisture, reducing the risk of damage during storage and handling.

Speed: 200 rpm

High speed operation allows for fast data processing and improved overall performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL132EZWTA2E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL132EZWTA2E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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