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SN3490586

Texas Instruments

SN3490586 by Texas Instruments

SN3490586 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.15-1.25 V, making it ideal for low-power applications requiring high performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,599 parts In-Stock

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8,599

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Digiode

USA . 970 parts In-Stock

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970

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Distributors (Availability)

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One Stop Electronics

USA . 781 parts In-Stock

1+ parts

$13.000

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781

$13.000

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AZTECH Wire

Italy . 831 parts In-Stock

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$18.993

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831

$18.993

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Parana Technologies

USA . 415 parts In-Stock

1+ parts

$21.339

100+ parts

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$21.663

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415

$21.339

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$21.663

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DigiPath Technology Company

USA . 823 parts In-Stock

1+ parts

$23.496

100+ parts

$21.617

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823

$23.496

$21.617

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ChromeModa Solutions

Germany . 6,996 parts In-Stock

1+ parts

$23.976

100+ parts

$19.660

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6,996

$23.976

$19.660

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IDEA Electronic Components Group

UK . 246 parts In-Stock

1+ parts

$23.976

100+ parts

$22.777

1k+ parts

$21.578

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246

$23.976

$22.777

$21.578

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Corohmni

South Africa . 1,105 parts In-Stock

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$75.112

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1,105

$75.112

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Microchip USA

USA . 230 parts In-Stock

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$96.350

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$94.670

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$93.830

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$93.000

230

$96.350

$94.670

$93.830

$93.000

Corphita

USA . 3,676 parts In-Stock

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Overview

Discover the SN3490586 by Texas Instruments, a cutting-edge peripheral IC that redefines innovation in the industry. With a focus on quality and precision, Texas Instruments has crafted a product that exceeds expectations in performance and reliability. Ideal for a variety of applications, this microprocessor circuit offers unmatched value to customers seeking advanced solutions. Experience the benefits of superior technology and efficiency with the SN3490586, setting new standards in functionality and design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into electronic circuits, saving space and making assembly more efficient.

Maximum Supply Voltage: 1.25 V

This range of supply voltage allows for stable and reliable operation of the product within safe limits.

Package Shape: SQUARE

The square shape of the package allows for easy placement and alignment on circuit boards, improving overall system design.

No. of Terminals: 361

The high number of terminals provides the product with a large number of connectivity options, making it versatile and compatible with a wide range of applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with precise terminal spacing, allowing for high-density mounting and improved signal integrity.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage requirement ensures efficient power consumption and extends battery life in portable electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, increasing its reliability in harsh environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function effectively in cold conditions, making it suitable for a wide range of operating environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and resistance to corrosion, ensuring reliable electrical connections for the product.

Terminal Position: BOTTOM

The bottom terminal position simplifies the assembly process and improves thermal management, enhancing the overall performance of the product.

Maximum Seated Height: 1.4 mm

The low seated height of the package allows for a slimmer profile, making it suitable for space-constrained applications and enabling compact device designs.

Width: 16 mm

The compact width of the product contributes to its versatility in various system layouts and configurations, facilitating seamless integration into different designs.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering of the product during assembly, resulting in robust connections and high reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for lead-free soldering and meets industry standards for RoHS compliance, making the product environmentally friendly.

Length: 16 mm

The compact length of the product enables efficient use of space in electronic systems and provides flexibility in design layouts, enhancing overall system performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the functionality and processing capabilities of the product, making it suitable for advanced applications and tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the product energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections, improving the overall robustness and longevity of the product in demanding operating conditions.

Nominal Supply Voltage: 1.2 V

The specified nominal supply voltage ensures consistent and stable operation of the product, minimizing potential risks of voltage fluctuations and ensuring reliable performance.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting and precise connections, enabling the product to be used in compact and complex electronic devices with tight spacing requirements.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that the product has moderate sensitivity to moisture during storage and handling, requiring standard precautions to prevent potential damage or malfunction.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SN3490586 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ASLO OPERATES IN 1V MINIMUM SUPPLY

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.15 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

SN3490586 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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