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DM368ZCEZ

Texas Instruments

DM368ZCEZ by Texas Instruments

The Texas Instruments DM368ZCEZ is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it suitable for various applications requiring low profile, fine pitch GRID ARRAY packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,472 parts In-Stock

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Digiode

USA . 2,679 parts In-Stock

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2,679

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Distributors (Availability)

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One Stop Electronics

USA . 661 parts In-Stock

1+ parts

$5.000

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661

$5.000

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AZTECH Wire

Italy . 689 parts In-Stock

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$10.646

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689

$10.646

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Corohmni

South Africa . 984 parts In-Stock

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$35.282

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984

$35.282

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Parana Technologies

USA . 110 parts In-Stock

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$52.072

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110

$52.072

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ChromeModa Solutions

Germany . 3,161 parts In-Stock

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$58.508

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$47.977

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3,161

$58.508

$47.977

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IDEA Electronic Components Group

UK . 1,815 parts In-Stock

1+ parts

$58.508

100+ parts

$55.583

1k+ parts

$52.657

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1,815

$58.508

$55.583

$52.657

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Microchip USA

USA . 1,112 parts In-Stock

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$71.005

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1,112

$71.005

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Corphita

USA . 2,500 parts In-Stock

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2,500

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DigiPath Technology Company

USA . 1,682 parts In-Stock

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$52.751

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1,682

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$52.751

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Northwest PG Solutions

USA . 573 parts In-Stock

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$3.968

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573

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$3.968

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Native Components

USA . 232 parts In-Stock

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$3.927

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232

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$3.927

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Overview

Discover the cutting-edge technology of the Texas Instruments DM368ZCEZ, a versatile microprocessor circuit designed for a wide range of applications. With a focus on quality and innovation, Texas Instruments ensures that this product meets the highest standards in the industry. Whether you're looking to enhance your IoT device or streamline your industrial automation system, this package offers exceptional value and performance. Experience the benefits of seamless integration, reliable operation, and superior functionality with the DM368ZCEZ. Elevate your projects with this top-of-the-line solution from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the design.

Maximum Supply Voltage: 1.42 V

The high maximum supply voltage ensures reliable operation and flexibility in power supply options.

Package Shape: SQUARE

The square package shape offers a compact footprint, ideal for space-constrained applications.

No. of Terminals: 338

The high number of terminals allows for a wide range of connectivity options and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables high-density mounting and efficient signal routing.

Minimum Supply Voltage: 1.28 V

The low minimum supply voltage ensures power efficiency and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation even in cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates easy and secure soldering for robust connections.

Maximum Seated Height: 1.3 mm

The low maximum seated height allows for a slim profile and efficient PCB stacking.

Width: 13 mm

The compact width of 13 mm enables the product to fit into tight spaces and compact designs.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for thorough soldering and robust connections.

Length: 13 mm

The compact length of 13 mm complements the width to provide a space-saving design.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The peripheral IC type of microprocessor circuit offers advanced processing capabilities and functionality for high-performance applications.

Technology: CMOS

The CMOS technology ensures low power consumption and high-speed operation for efficient performance.

Terminal Form: BALL

The terminal form of balls provides reliable connections and easy soldering for enhanced durability.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage provides a stable power source for consistent performance and reliability.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density packaging and efficient signal routing.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures that the product can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM368ZCEZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

DM368ZCEZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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