Loading...

DM365ZCEZ

Texas Instruments

DM365ZCEZ by Texas Instruments

The Texas Instruments DM365ZCEZ is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width, suitable for I2C, SPI, UART, and USB bus compatibility. It operates b/w 0-85 °C with a supply voltage range of 1.28-1.42 V. The package style is GRID ARRAY with 338 terminals in a SQUARE shape, making it ideal for various embedded applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,613

-

-

-

-

Digiode

USA . 2,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,788

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,558 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,558

$1.000

-

-

-

Native Components

USA . 874 parts In-Stock

1+ parts

$7.044

100+ parts

-

1k+ parts

-

10k+ parts

-

874

$7.044

-

-

-

AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$8.941

100+ parts

-

1k+ parts

-

10k+ parts

-

215

$8.941

-

-

-

Corohmni

South Africa . 2,250 parts In-Stock

1+ parts

$27.785

100+ parts

-

1k+ parts

-

10k+ parts

-

2,250

$27.785

-

-

-

Parana Technologies

USA . 940 parts In-Stock

1+ parts

$48.179

100+ parts

-

1k+ parts

-

10k+ parts

-

940

$48.179

-

-

-

DigiPath Technology Company

USA . 2,312 parts In-Stock

1+ parts

$53.051

100+ parts

-

1k+ parts

-

10k+ parts

-

2,312

$53.051

-

-

-

ChromeModa Solutions

Germany . 1,035 parts In-Stock

1+ parts

$54.134

100+ parts

$44.390

1k+ parts

-

10k+ parts

-

1,035

$54.134

$44.390

-

-

IDEA Electronic Components Group

UK . 768 parts In-Stock

1+ parts

$54.134

100+ parts

$51.427

1k+ parts

$48.721

10k+ parts

-

768

$54.134

$51.427

$48.721

-

Microchip USA

USA . 2,961 parts In-Stock

1+ parts

$55.917

100+ parts

-

1k+ parts

-

10k+ parts

-

2,961

$55.917

-

-

-

Northwest PG Solutions

USA . 1,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.904

10k+ parts

-

1,441

-

-

$6.904

-

Corphita

USA . 574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

574

-

-

-

-

Overview

Discover the Texas Instruments DM365ZCEZ, a cutting-edge peripheral IC that offers unmatched quality and reliability. Manufactured by the industry leader in semiconductor technology, this product is designed to meet the diverse needs of various applications. From advanced microprocessor circuits to I2C, SPI, UART, and USB compatibility, this versatile solution delivers exceptional performance every time. With a low profile, fine pitch package style and a maximum supply voltage of 1.42V, the DM365ZCEZ provides customers with unparalleled value, benefits, and advantages for their projects. Elevate your designs with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC material makes the product lightweight and durable, while EPOXY ensures good protection against external factors.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards.

Maximum Supply Voltage: 1.42 V

Allows for a higher voltage input without risking damage to the components.

Package Shape: SQUARE

Square package shape makes it easy to design and layout on a circuit board, optimizing space usage.

No. of Terminals: 338

A high number of terminals allow for versatile connectivity options with other components.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This style of package offers high component density in a compact space, suitable for advanced electronics applications.

Minimum Supply Voltage: 1.28 V

Allows for a stable operation even at lower voltage inputs.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for a wide range of environments.

Minimum Operating Temperature: 0 °C

Capable of functioning at low temperatures, ensuring reliable performance in diverse conditions.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal placement simplifies assembly and allows for a compact design.

Maximum Seated Height: 1.3 mm

Low seated height saves space and allows for sleek device designs.

Width: 13 mm

Compact width facilitates efficient circuit board layout and integration in tight spaces.

External Data Bus Width: 32

A wider data bus allows for faster data transfer and improved processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering process with a controlled heating duration.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes without compromising performance.

Length: 13 mm

Compact length complements the width dimension for a space-saving design.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit enhances the product's processing capabilities and functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Terminal Form: BALL

Ball terminal form allows for reliable connections and easy assembly on circuit boards.

Nominal Supply Voltage: 1.35 V

Stable nominal supply voltage ensures consistent performance under normal operating conditions.

Bus Compatibility: I2C; SPI; UART; USB

Support for multiple communication protocols enhances compatibility and connectivity options for the product.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for a high density of terminals and compact design.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product is less sensitive to moisture, contributing to its reliability in various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM365ZCEZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

DM365ZCEZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 4