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DM365ZCEW

Texas Instruments

DM365ZCEW by Texas Instruments

The Texas Instruments DM365ZCEW is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it suitable for applications requiring low power consumption and high performance in various electronic devices. Its package style is GRID ARRAY, LOW PROFILE, FINE PITCH, ideal for compact designs that require surface mount technology.

Median Price

$20.600

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$20.600

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$20.600

-

-

-

Vyrian

USA . 4,497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,497

-

-

-

-

Digiode

USA . 3,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,676

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 298 parts In-Stock

1+ parts

$17.990

100+ parts

-

1k+ parts

-

10k+ parts

-

298

$17.990

-

-

-

One Stop Electronics

USA . 432 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$18.000

-

-

-

Ampacity Inc.

Singapore . 555 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

-

555

$20.000

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$20.600

100+ parts

$20.188

1k+ parts

-

10k+ parts

-

1,000

$20.600

$20.188

-

-

Corohmni

South Africa . 511 parts In-Stock

1+ parts

$25.932

100+ parts

-

1k+ parts

-

10k+ parts

-

511

$25.932

-

-

-

Microchip USA

USA . 3,136 parts In-Stock

1+ parts

$47.381

100+ parts

-

1k+ parts

-

10k+ parts

-

3,136

$47.381

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-

-

Parana Technologies

USA . 2,091 parts In-Stock

1+ parts

$75.774

100+ parts

-

1k+ parts

-

10k+ parts

-

2,091

$75.774

-

-

-

ChromeModa Solutions

Germany . 6,269 parts In-Stock

1+ parts

$85.139

100+ parts

$69.814

1k+ parts

-

10k+ parts

-

6,269

$85.139

$69.814

-

-

IDEA Electronic Components Group

UK . 749 parts In-Stock

1+ parts

$85.139

100+ parts

$80.882

1k+ parts

$76.625

10k+ parts

-

749

$85.139

$80.882

$76.625

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Corphita

USA . 3,783 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,783

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-

-

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DigiPath Technology Company

USA . 1,047 parts In-Stock

1+ parts

-

100+ parts

$76.761

1k+ parts

-

10k+ parts

-

1,047

-

$76.761

-

-

Overview

Experience the cutting-edge technology of the Texas Instruments DM365ZCEW, a powerhouse in the category of Other Function uPs,uCs & Peripheral ICs. With a commitment to quality and innovation, Texas Instruments delivers unmatched performance and reliability in every product. This versatile microprocessor circuit offers endless possibilities for applications such as I2C, SPI, UART, and USB bus compatibility. Trust in Texas Instruments to provide exceptional value and benefits with the DM365ZCEW, setting new standards in the industry. Elevate your projects with the superior advantages this product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly of electronic components, saving space and improving overall performance.

Maximum Supply Voltage: 1.42 V

This higher voltage capability allows for better power handling and performance under various operating conditions.

Package Shape: SQUARE

The square shape aids in efficient placement and alignment of the component on circuit boards, making it easier to integrate into electronic systems.

No. of Terminals: 338

With a high number of terminals, this product can support complex connections and functions, allowing for versatile applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact size with efficient grid array layout, ensuring optimal performance and reliability in electronic systems.

Minimum Supply Voltage: 1.28 V

The low minimum supply voltage allows for efficient power consumption and operation, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain stable performance in demanding applications.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures the product's reliability and functionality in a wide range of environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides corrosion resistance and strong connections, enhancing the overall durability and longevity of the product.

Terminal Position: BOTTOM

Bottom terminal position simplifies the assembly process and allows for easy integration into circuit boards, improving overall efficiency.

Maximum Seated Height: 1.3 mm

With a low seated height, this product offers a compact design that is suitable for space-constrained applications and provides optimal thermal performance.

Width: 13 mm

The compact width of the product allows for efficient placement on circuit boards and enables space-saving design solutions in electronic systems.

External Data Bus Width: 32

The wide external data bus width of 32 bits enables fast data transfer and processing capabilities, making the product suitable for high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures proper solder reflow during assembly, guaranteeing secure connections and reliable performance of the product.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the soldering process without compromising its integrity, ensuring robust performance in assembly.

Length: 13 mm

The compact length of the product allows for efficient placement on circuit boards and contributes to a space-saving design in electronic systems.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities and versatility for a wide range of applications, making it a powerful choice for electronic systems.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance, making the product energy-efficient and suitable for various electronic applications.

Terminal Form: BALL

Ball terminal form offers reliable connections and solder joints, ensuring the product's durability and long-term performance in electronic systems.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage provides optimal power efficiency and stability for the product, making it reliable for consistent performance in electronic systems.

Bus Compatibility: I2C; SPI; UART; USB

With compatibility for various communication buses like I2C, SPI, UART, and USB, this product can easily interface with other devices and systems, enhancing its connectivity and functionality.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for dense packing of the terminals on circuit boards, enabling efficient use of space and improving the overall performance of the product.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this product has moderate sensitivity to moisture, requiring proper handling and storage to ensure its reliability and functionality in electronic systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM365ZCEW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

DM365ZCEW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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