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OMAPL138EZCEA3R

Texas Instruments

OMAPL138EZCEA3R by Texas Instruments

OMAPL138EZCEA3R by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 105 °C, making it suitable for various applications requiring high-speed processing and reliable performance. With compatibility for I2C, SPI, UART, and USB buses, this device is ideal for industrial automation systems and embedded computing solutions.

Median Price

$19.293

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$19.293

100+ parts

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10

$19.293

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Vyrian

USA . 6,015 parts In-Stock

1+ parts

-

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6,015

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Chip Stock

USA . 2,777 parts In-Stock

1+ parts

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2,777

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Digiode

USA . 499 parts In-Stock

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499

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,248 parts In-Stock

1+ parts

$6.000

100+ parts

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1,248

$6.000

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One Stop Electronics

USA . 679 parts In-Stock

1+ parts

$8.000

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679

$8.000

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AZTECH Wire

Italy . 849 parts In-Stock

1+ parts

$16.919

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849

$16.919

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Corohmni

South Africa . 2,880 parts In-Stock

1+ parts

$22.050

100+ parts

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2,880

$22.050

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Parana Technologies

USA . 673 parts In-Stock

1+ parts

$49.588

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673

$49.588

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Microchip USA

USA . 3,116 parts In-Stock

1+ parts

$54.020

100+ parts

$53.250

1k+ parts

$52.860

10k+ parts

$52.480

3,116

$54.020

$53.250

$52.860

$52.480

DigiPath Technology Company

USA . 1,241 parts In-Stock

1+ parts

$54.603

100+ parts

$50.234

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1,241

$54.603

$50.234

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ChromeModa Solutions

Germany . 4,737 parts In-Stock

1+ parts

$55.717

100+ parts

$45.688

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4,737

$55.717

$45.688

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IDEA Electronic Components Group

UK . 1,948 parts In-Stock

1+ parts

$55.717

100+ parts

$52.931

1k+ parts

$50.145

10k+ parts

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1,948

$55.717

$52.931

$50.145

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Perfect Parts

USA . 7,840 parts In-Stock

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7,840

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A-Z Elektronik GmbH

Germany . 1,181 parts In-Stock

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1,181

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Corphita

USA . 504 parts In-Stock

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504

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Bastille Electronics

Australia . 49 parts In-Stock

1+ parts

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49

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Overview

Unlock limitless possibilities with the OMAPL138EZCEA3R by Texas Instruments. Crafted with precision and expertise, this cutting-edge microprocessor circuit is designed to revolutionize your projects with its superior performance and reliability. Perfect for a wide range of applications, from IoT devices to industrial automation, this innovative solution offers unparalleled value and benefits to customers seeking top-notch quality and efficiency. Experience the power of Texas Instruments and elevate your creations to new heights with the OMAPL138EZCEA3R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a reliable performance over time.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.35 V

Provides sufficient power for the device to operate at its optimum level without the risk of overloading.

Package Shape: SQUARE

Facilitates a compact and efficient design, saving space on the circuit board for other components.

No. of Terminals: 361

Offers a high level of connectivity options, enabling the device to interface with a wide range of other components or peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Ensures a streamlined and efficient layout, enhancing the overall performance and functionality of the device.

Minimum Supply Voltage: 1.25 V

Allows the device to operate efficiently even under low power conditions, making it suitable for energy-saving applications.

Maximum Operating Temperature: 105 °C

Ensures the device can withstand high temperatures, making it suitable for industrial or harsh environments.

Minimum Operating Temperature: -40 °C

Ensures the device can operate in extremely cold conditions, increasing its versatility across different settings.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and corrosion-resistant finish for the terminals, ensuring a stable connection over time.

Terminal Position: BOTTOM

Facilitates easy and secure installation on the circuit board, enhancing the overall stability of the device.

Maximum Seated Height: 1.3 mm

Enables a compact and low-profile design, making it suitable for space-constrained applications.

Width: 13 mm

Allows for a compact form factor, saving space on the circuit board and enabling a more streamlined design.

External Data Bus Width: 32

Provides a wide data bus width, allowing for fast and efficient data transfer between components.

Maximum Clock Frequency: 50 MHz

Enables fast processing and data retrieval, improving the overall performance of the device.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for easy and efficient soldering during assembly, reducing the risk of damage to the device.

Peak Reflow Temperature °C: 260

Ensures the device can withstand high-temperature soldering processes, providing a durable and reliable connection.

Length: 13 mm

Contributes to a compact and space-efficient design, enhancing the overall versatility of the device.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments, where temperature fluctuations and harsh conditions are common.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes advanced processing capabilities, enabling the device to perform complex tasks with efficiency and speed.

Technology: CMOS

Utilizes low power consumption and provides high-speed performance, making it suitable for a wide range of applications.

Terminal Form: BALL

Offers a secure and reliable connection between the device and the circuit board, ensuring stable performance over time.

Nominal Supply Voltage: 1.3 V

Provides a stable power source for the device, ensuring consistent performance in various operating conditions.

Bus Compatibility: I2C; SPI; UART; USB

Supports multiple communication protocols, enabling the device to interface with a wide range of external components and peripherals.

Terminal Pitch: 0.65 mm

Provides a fine pitch for the terminals, enabling a high level of connectivity in a compact form factor.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring the device can operate reliably in various environmental conditions.

Speed: 456 rpm

Provides high processing speed, enabling the device to handle complex tasks and data-intensive operations with efficiency.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138EZCEA3R attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

OMAPL138EZCEA3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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