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DM8147SCIS0

Texas Instruments

DM8147SCIS0 by Texas Instruments

The Texas Instruments DM8147SCIS0 is a MICROPROCESSOR CIRCUIT with 684 terminals in a GRID ARRAY package. It operates b/w 0-90 °C, with a supply voltage range of 3.14-3.47 V. Suitable for applications requiring ETHERNET, I2C, SPI, UART, USB compatibility at speeds up to 1000 rpm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,332 parts In-Stock

1+ parts

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8,332

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Digiode

USA . 3,477 parts In-Stock

1+ parts

-

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3,477

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 795 parts In-Stock

1+ parts

$0.619

100+ parts

-

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795

$0.619

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Northwest PG Solutions

USA . 972 parts In-Stock

1+ parts

$0.681

100+ parts

-

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972

$0.681

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AZTECH Wire

Italy . 867 parts In-Stock

1+ parts

$12.294

100+ parts

-

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867

$12.294

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One Stop Electronics

USA . 866 parts In-Stock

1+ parts

$15.000

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866

$15.000

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Parana Technologies

USA . 488 parts In-Stock

1+ parts

$31.565

100+ parts

-

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$82.710

10k+ parts

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488

$31.565

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$82.710

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DigiPath Technology Company

USA . 433 parts In-Stock

1+ parts

$34.757

100+ parts

$31.976

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433

$34.757

$31.976

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IDEA Electronic Components Group

UK . 2,321 parts In-Stock

1+ parts

$35.466

100+ parts

$33.693

1k+ parts

$31.919

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2,321

$35.466

$33.693

$31.919

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ChromeModa Solutions

Germany . 469 parts In-Stock

1+ parts

$35.466

100+ parts

$29.082

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469

$35.466

$29.082

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Corohmni

South Africa . 900 parts In-Stock

1+ parts

$64.782

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900

$64.782

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Corphita

USA . 1,702 parts In-Stock

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1,702

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Overview

Experience superior performance and reliability with the Texas Instruments DM8147SCIS0, a cutting-edge microprocessor circuit designed for a wide range of applications. With advanced technology and a durable package body material, this product offers unmatched quality and value to customers. From Ethernet to USB compatibility, this versatile device is perfect for various functions. Trust in Texas Instruments for top-notch solutions that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and enhancing overall design aesthetics.

Maximum Supply Voltage: 3.47 V

The higher maximum supply voltage provides flexibility in power requirements and allows for compatibility with a wider range of systems.

Package Shape: SQUARE

The square shape of the package ensures efficient use of space on the circuit board, enabling compact and streamlined designs.

No. of Terminals: 684

The high number of terminals allows for a greater level of connectivity and functionality, making the product versatile and capable of accommodating various input/output configurations.

Width: 23 mm

The relatively narrow width of the product contributes to its space-saving design, making it suitable for compact electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Bus Compatibility: ETHERNET; I2C; SPI; UART; USB

The wide range of bus compatibility options ensures seamless integration with different communication protocols, expanding the product's compatibility and versatility.

Speed: 1000 rpm

The high speed of operation enhances the overall performance and responsiveness of the product, making it suitable for demanding applications that require quick processing.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM8147SCIS0 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY

Bus Compatibility:

ETHERNET; I2C; SPI; UART; USB

External Data Bus Width:

48

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.14 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

DM8147SCIS0 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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