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OMAPL138EZWTA4

Texas Instruments

OMAPL138EZWTA4 by Texas Instruments

OMAPL138EZWTA4 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.25V to 1.35V, making it ideal for industrial applications requiring high performance in a compact GRID ARRAY package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,405 parts In-Stock

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Vyrian

USA . 1,987 parts In-Stock

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1,987

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EPE Components Inc.

USA . 65 parts In-Stock

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65

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Bristol Electronics

USA . 65 parts In-Stock

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65

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One Stop Electronics

USA . 805 parts In-Stock

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$4.000

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805

$4.000

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AZTECH Wire

Italy . 632 parts In-Stock

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$13.388

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632

$13.388

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Parana Technologies

USA . 524 parts In-Stock

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$39.520

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$3,669.991

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$35.568

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524

$39.520

$3,669.991

$35.568

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DigiPath Technology Company

USA . 702 parts In-Stock

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$43.516

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$40.035

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702

$43.516

$40.035

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ChromeModa Solutions

Germany . 1,037 parts In-Stock

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$44.404

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$36.411

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$44.404

$36.411

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IDEA Electronic Components Group

UK . 110 parts In-Stock

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$44.404

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$42.184

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$39.964

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110

$44.404

$42.184

$39.964

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Corohmni

South Africa . 123 parts In-Stock

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$55.590

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Lixinc

USA . 11,269 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 619 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Microchip USA

USA . 279 parts In-Stock

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Overview

Elevate your projects with the OMAPL138EZWTA4 by Texas Instruments, a top-tier manufacturer known for producing high-quality Other Function uPs,uCs & Peripheral ICs. This cutting-edge device boasts a range of applications in various industries, delivering unparalleled performance and reliability. With its advanced technology and industrial-grade design, this product offers exceptional value, benefits, and advantages to customers seeking superior solutions for their projects. Experience the difference with the OMAPL138EZWTA4 and unlock endless possibilities for innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the product is lightweight and durable, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly processes, leading to cost savings and improved reliability.

Maximum Supply Voltage: 1.35 V

With a high maximum supply voltage, this product can handle higher power requirements, providing flexibility in design and application.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, maximizing layout options and minimizing footprint.

No. of Terminals: 361

The high number of terminals enables the product to interface with a wide range of components and peripherals, enhancing connectivity and functionality.

Minimum Supply Voltage: 1.25 V

The low minimum supply voltage ensures efficient power consumption, leading to energy savings and longer battery life in portable devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes the product suitable for industrial environments where temperature extremes are common, ensuring reliable performance under challenging conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to operate in cold environments without performance degradation, making it versatile and reliable in various settings.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for efficient heat dissipation and improved signal integrity, leading to better overall product performance.

Maximum Seated Height: 1.4 mm

The low maximum seated height minimizes the overall profile of the product, allowing for compact and space-saving designs in electronic devices.

Width: 16 mm

The compact width of 16 mm enables the product to be used in small form factor devices, providing versatility in design and integration.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature allows for quick and efficient soldering processes during assembly, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder joints and good thermal stability, enhancing the overall quality and durability of the product.

Length: 16 mm

The compact length of 16 mm complements the width and seated height, offering a balanced and space-efficient package for various electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh environmental conditions commonly found in industrial settings, providing long-term reliability and durability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC type enhances the capabilities and processing power of the product, making it suitable for complex tasks and applications.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high speed, and compatibility with a wide range of electronic systems, making it a versatile and efficient choice.

Terminal Form: BALL

The ball terminal form provides reliable connections and excellent thermal characteristics, ensuring stable performance and longevity in demanding environments.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V strikes a balance between power efficiency and performance, making the product suitable for a wide range of applications with varying power requirements.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm allows for high-density packaging and efficient use of space on a circuit board, enabling complex designs and miniaturization.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the product can withstand moderate exposure to humidity during storage and handling, ensuring reliability and performance under normal operating conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138EZWTA4 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138EZWTA4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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