Loading...

TMS320DM335ZCE135

Texas Instruments

TMS320DM335ZCE135 by Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$13.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 593 parts In-Stock

1+ parts

-

100+ parts

$13.080

1k+ parts

-

10k+ parts

-

593

-

$13.080

-

-

Rochester

USA . 483 parts In-Stock

1+ parts

-

100+ parts

$11.320

1k+ parts

$10.130

10k+ parts

$9.540

483

-

$11.320

$10.130

$9.540

Verical

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$14.150

1k+ parts

$12.662

10k+ parts

$11.925

160

-

$14.150

$12.662

$11.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,464 parts In-Stock

1+ parts

$11.951

100+ parts

-

1k+ parts

-

10k+ parts

-

4,464

$11.951

-

-

-

Vyrian

USA . 4,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,560

-

-

-

-

DigiKey Marketplace

USA . 593 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

593

-

-

-

-

Speed Components Ltd

Israel . 67 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

67

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,238 parts In-Stock

1+ parts

$11.322

100+ parts

-

1k+ parts

-

10k+ parts

-

3,238

$11.322

-

-

-

Corohmni

South Africa . 3,021 parts In-Stock

1+ parts

$46.763

100+ parts

-

1k+ parts

-

10k+ parts

-

3,021

$46.763

-

-

-

Parana Technologies

USA . 362 parts In-Stock

1+ parts

$68.582

100+ parts

$6,368.844

1k+ parts

$61.723

10k+ parts

-

362

$68.582

$6,368.844

$61.723

-

DigiPath Technology Company

USA . 1,707 parts In-Stock

1+ parts

$75.517

100+ parts

$69.475

1k+ parts

-

10k+ parts

-

1,707

$75.517

$69.475

-

-

IDEA Electronic Components Group

UK . 214 parts In-Stock

1+ parts

$77.058

100+ parts

$73.205

1k+ parts

$69.352

10k+ parts

-

214

$77.058

$73.205

$69.352

-

ChromeModa Solutions

Germany . 115 parts In-Stock

1+ parts

$77.058

100+ parts

$63.188

1k+ parts

-

10k+ parts

-

115

$77.058

$63.188

-

-

Microchip USA

USA . 2,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,584

-

-

-

-

Speed Components Ltd (Excess)

Israel . 67 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

67

-

-

-

-

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM335ZCE135 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM335ZCE135 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20