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TMS320DM6443AZWT

Texas Instruments

TMS320DM6443AZWT by Texas Instruments

TMS320DM6443AZWT by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for applications requiring MICROPROCESSOR CIRCUIT technology, such as Ethernet, I2C, SPI, UART, and USB interfaces in a compact GRID ARRAY package style.

Median Price

$49.926

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 855 parts In-Stock

1+ parts

$44.053

100+ parts

$39.158

1k+ parts

$28.793

10k+ parts

-

855

$44.053

$39.158

$28.793

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DigiKey

USA . 90 parts In-Stock

1+ parts

$55.800

100+ parts

$40.965

1k+ parts

-

10k+ parts

-

90

$55.800

$40.965

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 741 parts In-Stock

1+ parts

$37.107

100+ parts

-

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741

$37.107

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-

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Vyrian

USA . 3,119 parts In-Stock

1+ parts

-

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-

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3,119

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-

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Semtec, LLC

USA . 14 parts In-Stock

1+ parts

-

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14

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ACDS - Activité Composants Distribution Service

France . 14 parts In-Stock

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,077 parts In-Stock

1+ parts

$32.266

100+ parts

-

1k+ parts

$103.098

10k+ parts

-

2,077

$32.266

-

$103.098

-

Corphita

USA . 1,916 parts In-Stock

1+ parts

$35.154

100+ parts

-

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-

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1,916

$35.154

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-

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DigiPath Technology Company

USA . 374 parts In-Stock

1+ parts

$35.529

100+ parts

-

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-

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374

$35.529

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-

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ChromeModa Solutions

Germany . 4,724 parts In-Stock

1+ parts

$36.254

100+ parts

$29.728

1k+ parts

-

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4,724

$36.254

$29.728

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IDEA Electronic Components Group

UK . 1,565 parts In-Stock

1+ parts

$36.254

100+ parts

$34.441

1k+ parts

$32.629

10k+ parts

-

1,565

$36.254

$34.441

$32.629

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Corohmni

South Africa . 5,056 parts In-Stock

1+ parts

$55.515

100+ parts

-

1k+ parts

-

10k+ parts

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5,056

$55.515

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-

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$61.091

100+ parts

$55.593

1k+ parts

$50.095

10k+ parts

-

5,000

$61.091

$55.593

$50.095

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Microchip USA

USA . 1,876 parts In-Stock

1+ parts

$124.476

100+ parts

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1,876

$124.476

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Lixinc

USA . 17,383 parts In-Stock

1+ parts

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17,383

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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A-Z Elektronik GmbH

Germany . 231 parts In-Stock

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231

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Experience unparalleled performance and reliability with the TMS320DM6443AZWT by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that meets the highest standards of quality. This versatile microprocessor circuit offers endless possibilities in various applications, providing customers with exceptional value and benefits. Whether you're looking to enhance your Ethernet, I2C, SPI, UART, or USB systems, this product is the perfect solution. Trust Texas Instruments to deliver superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and reliable installation on PCBs, saving space and reducing production costs.

Maximum Supply Voltage: 1.26 V

Operates within a safe voltage range, protecting the components from damage.

Package Shape: SQUARE

Square packages are easy to handle and fit efficiently on circuit boards.

Bit Size: 32

32-bit processing capability allows for fast and efficient data processing.

Power Supplies (V): 1.2, 1.8, 3.3

Supports a range of power supply voltages for flexibility in different applications.

No. of Terminals: 361

Plenty of terminals for connections, enabling complex functionality and integration with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density and compactness, ideal for space-constrained designs.

Minimum Supply Voltage: 1.14 V

Can operate reliably even with lower supply voltage, increasing efficiency in power usage.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments without performance degradation.

Minimum Operating Temperature: 0 °C

Can function in cold conditions without any operational issues.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing of traces.

Maximum Seated Height: 1.4 mm

Low profile design saves space and allows for compact product designs.

RAM Words: 16384

Sufficient RAM capacity for storing and accessing data efficiently.

Width: 16 mm

Compact width for fitting in small spaces and tight layouts.

External Data Bus Width: 48

Wide data bus width allows for fast communication and data transfer rates.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly processes for reliable connections.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during manufacturing processes.

Length: 16 mm

Compact length for space-saving designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes microprocessor functionality for handling various tasks and computations effectively.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminals provide secure electrical connections and enable easy installation on PCBs.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for consistent performance and efficiency.

Bus Compatibility: ETHERNET; I2C; SPI; UART; USB

Compatible with various communication protocols for versatile connectivity options.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and space-saving PCB designs.

Format: FIXED POINT

Fixed-point format for accurate and efficient numerical processing.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates good resistance to moisture, ensuring reliability in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6443AZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Bus Compatibility:

ETHERNET; I2C; SPI; UART; USB

External Data Bus Width:

48

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6443AZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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