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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
10M02SCU324C8G by Intel

10M02SCU324C8G

Intel

The Intel 10M02SCU324C8G is a FPGA with 2000 logic cells, 125 CLBs, and 246 inputs/outputs. It operates at supply voltages b/w 2.85V to 3.15V and temperatures from 0°C to 85°C. This versatile chip is ideal for applications requiring programmable ICs in commercial extended temperature environments.

FPGA

2000

246

246

125

125 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M04SAU324I7G by Intel

10M04SAU324I7G

Intel

Intel's 10M04SAU324I7G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a package style of grid array, it is ideal for industrial applications requiring high performance in a compact form factor. Operating b/w -40 to 100 °C, this FPGA offers versatility and reliability for various electronic designs.

FPGA

4000

246

246

250

250 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M04SCU324C8G by Intel

10M04SCU324C8G

Intel

Intel's 10M04SCU324C8G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a package style of grid array and low profile, it is suitable for commercial extended temperature applications requiring high-performance programmable ICs.

FPGA

4000

246

246

250

250 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M08DAF484I7P by Intel

10M08DAF484I7P

Intel

The Intel 10M08DAF484I7P FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with surface mount capability.

FPGA

8000

250

250

500

500 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2 mm

BGA484,22X22,40

Bottom

Ball

1 mm

484

S-PBGA-B484

10M08SAE144I7P by Intel

10M08SAE144I7P

Intel

Intel's 10M08SAE144I7P FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with gull wing terminals.

FPGA

8000

250

250

500

500 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HLFQFP

Square

20 mm

20 mm

1.65 mm

HQFP144,.87SQ,20

Quad

Gull Wing

.5 mm

144

S-PQFP-G144

10M08SAU169I7P by Intel

10M08SAU169I7P

Intel

The Intel 10M08SAU169I7P is an FPGA with 8000 logic cells, 500 CLBs, and 250 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of -40°C to 100°C. This FPGA is ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

8000

250

250

500

500 CLBS

Also Operates at 3.135 V min 3.3 V nominal and 3.465 max VCC

3

2.85 V

3.15 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

11 mm

11 mm

1.55 mm

BGA169,13X13,32

Bottom

Ball

.8 mm

169

S-PBGA-B169

10M08SAU324C8G by Intel

10M08SAU324C8G

Intel

Intel's 10M08SAU324C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a package style of grid array and low profile, it is ideal for applications requiring high-speed processing in commercial extended temperature environments.

FPGA

8000

250

250

500

500 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M08SAU324I7G by Intel

10M08SAU324I7G

Intel

The Intel 10M08SAU324I7G is an FPGA with 8000 logic cells, 500 CLBs, and 250 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of -40°C to 100°C. This FPGA is ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

8000

250

250

500

500 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M08SCU324C8G by Intel

10M08SCU324C8G

Intel

Intel's 10M08SCU324C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. Ideal for applications requiring high-speed data processing in commercial extended temperature environments.

FPGA

8000

250

250

500

500 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M16DAF484I7P by Intel

10M16DAF484I7P

Intel

Intel's 10M16DAF484I7P FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. Ideal for industrial applications requiring high performance in a compact form factor with a max operating temperature of 100°C.

FPGA

16000

320

320

1000

1000 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2 mm

BGA484,22X22,40

Bottom

Ball

1 mm

484

S-PBGA-B484

10M16DAU324I7P by Intel

10M16DAU324I7P

Intel

Intel's 10M16DAU324I7P FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with fine pitch terminals.

FPGA

16000

320

320

1000

1000 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M16SAU324C8G by Intel

10M16SAU324C8G

Intel

Intel's 10M16SAU324C8G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a package style of grid array and low profile, it is ideal for applications requiring high-speed processing in commercial extended temperature environments.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M16SAU324I7G by Intel

10M16SAU324I7G

Intel

The Intel 10M16SAU324I7G is a Field Programmable Gate Array (FPGA) with 16000 logic cells. It has a max supply voltage of 3.15V and can operate in temperatures ranging from -40 to 100 °C. This FPGA is suitable for industrial applications requiring high-performance programmable ICs.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M16SCU169A7P by Intel

10M16SCU169A7P

Intel

Intel's 10M16SCU169A7P FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for automotive applications requiring high-performance and low-profile grid array packaging. Operating b/w -40 to 125°C, this FPGA offers versatility in various temperature conditions.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

11 mm

11 mm

1.55 mm

BGA169,13X13,32

Bottom

Ball

.8 mm

169

S-PBGA-B169

10M16SCU169I7P by Intel

10M16SCU169I7P

Intel

Intel's 10M16SCU169I7P FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with ball terminals.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

11 mm

11 mm

1.55 mm

BGA169,13X13,32

Bottom

Ball

.8 mm

169

S-PBGA-B169

10M16SCU324C8G by Intel

10M16SCU324C8G

Intel

Intel's 10M16SCU324C8G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance computing in commercial extended temperature environments. The package style is grid array with low profile and fine pitch terminals, making it suitable for compact designs.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M16SCU324I7G by Intel

10M16SCU324I7G

Intel

Intel's 10M16SCU324I7G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with ball terminals.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M25DAF256I7P by Intel

10M25DAF256I7P

Intel

Intel's 10M25DAF256I7P FPGA boasts 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. Ideal for industrial applications requiring high performance in a compact form factor with a max operating temperature of 100°C.

FPGA

25000

360

360

1563

1563 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

1 mm

256

S-PBGA-B256

10M50DAF484I7P by Intel

10M50DAF484I7P

Intel

Intel's 10M50DAF484I7P FPGA features 50000 logic cells, 3125 CLBs, and 500 inputs/outputs. Ideal for industrial applications requiring high performance with a wide operating temperature range (-40 to 100°C) in a compact square package (23x23mm).

FPGA

50000

500

500

3125

3125 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2 mm

BGA484,22X22,40

Bottom

Ball

1 mm

484

S-PBGA-B484

1SG250HU2F50E1VG by Intel

1SG250HU2F50E1VG

Intel

The Intel 1SG250HU2F50E1VG is a Field Programmable Gate Array (FPGA) with 2422000 logic cells and 302750 CLBs. It features 736 inputs/outputs, operates b/w 0-100°C, and has a package size of 50x50mm. Ideal for applications requiring high-speed data processing and complex algorithm implementations in various industries.

FPGA

2422000

736

736

302750

302750 CLBS

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.881 mm

BGA2397,49X49,40

Bottom

Ball

1 mm

2397

S-PBGA-B2397

1SG250HU2F50I1VG by Intel

1SG250HU2F50I1VG

Intel

Intel's 1SG250HU2F50I1VG FPGA boasts 2422000 logic cells, 302750 CLBs, and 736 inputs/outputs. Ideal for applications requiring high-speed processing and customizable hardware acceleration in a compact form factor.

FPGA

2422000

736

736

302750

302750 CLBS

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.881 mm

BGA2397,49X49,40

Bottom

Ball

1 mm

2397

S-PBGA-B2397

1SG280HN1F43E1VG by Intel

1SG280HN1F43E1VG

Intel

Intel's 1SG280HN1F43E1VG FPGA boasts 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. Ideal for applications requiring high-speed data processing and complex algorithm implementation in industries like telecommunications, aerospace, and automotive.

FPGA

2753000

704

704

344125

344125 CLBS

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

1SG280HN1F43I1VG by Intel

1SG280HN1F43I1VG

Intel

Intel's 1SG280HN1F43I1VG FPGA boasts 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. With a package style of grid array and square shape, it is ideal for applications requiring high-performance programmable ICs in various industries.

FPGA

2753000

704

704

344125

344125 CLBS

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

1SG280HN1F43I2LG by Intel

1SG280HN1F43I2LG

Intel

Intel's 1SG280HN1F43I2LG FPGA boasts 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. Ideal for applications requiring high-speed processing and complex logic operations in a compact form factor with a package style of grid array.

FPGA

2753000

704

704

344125

344125 CLBS

0.85

.82 V

.88 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

1SG280HN3F43E3VG by Intel

1SG280HN3F43E3VG

Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

2753000

704

704

344125

344125 CLBS

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

1SG280HN3F43I3VG by Intel

1SG280HN3F43I3VG

Intel

Intel's 1SG280HN3F43I3VG FPGA boasts 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. With a package style of grid array and square shape, it is ideal for applications requiring high-performance programmable ICs in industries like telecommunications and aerospace.

FPGA

2753000

704

704

344125

344125 CLBS

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

1SG280HU1F50E1VG by Intel

1SG280HU1F50E1VG

Intel

The Intel 1SG280HU1F50E1VG is a FPGA with 2753000 logic cells and 344125 CLBs. It has 736 inputs/outputs, operates b/w 0-100°C, and features a grid array package style. Ideal for applications requiring high-speed data processing and complex algorithm implementation in various industries.

FPGA

2753000

736

736

344125

344125 CLBS

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.881 mm

BGA2397,49X49,40

Bottom

Ball

1 mm

2397

S-PBGA-B2397

1SG280HU2F50E2VG by Intel

1SG280HU2F50E2VG

Intel

Intel's 1SG280HU2F50E2VG FPGA boasts 2753000 logic cells, 344125 CLBs, and 736 inputs/outputs. Ideal for applications requiring high-speed data processing and complex algorithm implementations in fields like telecommunications, aerospace, and industrial automation.

FPGA

2753000

736

736

344125

344125 CLBS

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.881 mm

BGA2397,49X49,40

Bottom

Ball

1 mm

2397

S-PBGA-B2397

1SG280LN3F43I1VP by Intel

1SG280LN3F43I1VP

Intel

Intel 1SG280LN3F43I1VP is a FPGA with 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. It is used in applications requiring high-speed data processing and complex algorithm implementation due to its programmable nature and grid array package style. Operating temperature ranges from -40°C to 100°C, making it suitable for various environments.

FPGA

2753000

704

704

344125

344125 CLBS

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

5AGZME1H2F35I3LG by Intel

5AGZME1H2F35I3LG

Intel

Intel's 5AGZME1H2F35I3LG FPGA boasts 220,000 logic cells and 8302 CLBs. With 414 inputs/outputs, it operates b/w -40 to 100°C. Ideal for applications requiring high-performance programmable ICs in a compact square package with a grid array style.

FPGA

220000

414

414

8302

8302 CLBS

0.85

.82 V

.88 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP3SE80F1152C2G by Intel

EP3SE80F1152C2G

Intel

EP3SE80F1152C2G by Intel is a FPGA with 80000 logic cells, 3200 CLBs, and 744 inputs/outputs. It operates b/w -40 to 85 °C and has a package style of GRID ARRAY. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

80000

744

744

3200

3200 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP3SE80F1152C3G by Intel

EP3SE80F1152C3G

Intel

EP3SE80F1152C3G by Intel is a FPGA with 80000 logic cells, 3200 CLBs, and 744 inputs/outputs. It operates b/w -40 to 85 °C and has a package style of grid array. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

80000

744

744

3200

3200 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP3SE80F780C4LG by Intel

EP3SE80F780C4LG

Intel

EP3SE80F780C4LG by Intel is a FPGA with 80000 logic cells, 3200 CLBs, and 780 terminals. It operates b/w 0-85 °C and has a supply voltage range of 0.86V to 0.94V. This square-shaped GRID ARRAY package is ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

80000

3200

3200 CLBS

Also Operates at 1.1 V VCC nominal

.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.2 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

EP3SL110F1152C4G by Intel

EP3SL110F1152C4G

Intel

EP3SL110F1152C4G by Intel is a FPGA with 107.5K logic cells, 4300 CLBs, and 744 inputs/outputs. It operates b/w -40 to 85°C and has a package size of 35x35mm. Ideal for applications requiring high-speed data processing and customizable logic functions in compact designs.

FPGA

107500

744

744

4300

4300 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP3SL150F780C4G by Intel

EP3SL150F780C4G

Intel

EP3SL150F780C4G by Intel is a FPGA with 142.5K logic cells, 5700 CLBs, and 488 inputs/outputs. It operates b/w 0-85°C, has a supply voltage range of 0.86-0.94 V, and features a grid array package style. Ideal for applications requiring high-speed data processing and customizable logic functions in electronic systems.

FPGA

142500

488

488

5700

5700 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

EP3SL50F780C4G by Intel

EP3SL50F780C4G

Intel

EP3SL50F780C4G by Intel is a FPGA with 47500 logic cells, 1900 CLBs, and 488 inputs/outputs. It operates b/w 0-85°C, has a supply voltage range of 0.86-0.94 V, and features a square package shape with ball terminals. Ideal for applications requiring high-speed data processing and customizable logic functions in compact designs.

FPGA

47500

488

488

1900

1900 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

10CX085YF672E5G by Intel

10CX085YF672E5G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX085YF672E6G by Intel

10CX085YF672E6G

Intel

Intel's 10CX085YF672E6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for applications requiring high-speed processing and complex logic operations in a compact form factor.

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX085YF672I5G by Intel

10CX085YF672I5G

Intel

Intel's 10CX085YF672I5G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a wide operating temperature range from -40 to 100 °C.

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX085YF672I6G by Intel

10CX085YF672I6G

Intel

Intel's 10CX085YF672I6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX085YU484E6G by Intel

10CX085YU484E6G

Intel

Intel's 10CX085YU484E6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor.

FPGA

85000

188

188

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX085YU484I5G by Intel

10CX085YU484I5G

Intel

Intel's 10CX085YU484I5G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

FPGA

85000

188

188

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX105YF672E5G by Intel

10CX105YF672E5G

Intel

Intel's 10CX105YF672E5G FPGA boasts 104K logic cells, TSMC technology, and 38000 CLBs. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor. Supports various input/output configurations with a max supply voltage of 0.93V and operating temperature up to 100°C.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF672E6G by Intel

10CX105YF672E6G

Intel

The Intel 10CX105YF672E6G is a FPGA with 104,000 logic cells and 38,000 CLBs. It operates at 0.9V nominal voltage and supports up to 236 inputs/outputs. Ideal for applications requiring high-performance programmable ICs in a grid array package style.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF672I5G by Intel

10CX105YF672I5G

Intel

Intel's 10CX105YF672I5G FPGA boasts 104000 logic cells, TSMC technology, and 38000 CLBs. Ideal for industrial applications with a wide operating temperature range of -40 to 100 °C, it offers high flexibility and performance in various electronic systems.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF672I6G by Intel

10CX105YF672I6G

Intel

Intel's 10CX105YF672I6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Operating at a max temp of 100°C, it uses TSMC technology with 0.93V supply voltage. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF780E6G by Intel

10CX105YF780E6G

Intel

Intel's 10CX105YF780E6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Operating at a max temperature of 100°C, it features TSMC technology and is ideal for applications requiring high-speed data processing and complex algorithm implementations. With 284 inputs/outputs, this square-shaped grid array package supports various digital design projects.

FPGA

104000

284

284

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX105YF780I6G by Intel

10CX105YF780I6G

Intel

Intel's 10CX105YF780I6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Utilizes TSMC technology with 0.93V max supply voltage. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.

FPGA

104000

284

284

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780