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1SG250HU2F50E1VG

Intel

1SG250HU2F50E1VG by Intel

The Intel 1SG250HU2F50E1VG is a Field Programmable Gate Array (FPGA) with 2422000 logic cells and 302750 CLBs. It features 736 inputs/outputs, operates b/w 0-100°C, and has a package size of 50x50mm. Ideal for applications requiring high-speed data processing and complex algorithm implementations in various industries.

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Vyrian

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Digiode

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Nova Conductors

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Ampacity Inc.

Singapore . 614 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 500 parts In-Stock

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Semicontronic

India . 789 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,731 parts In-Stock

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Corohmni

South Africa . 838 parts In-Stock

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Texas Native Microelectronics

USA . 849 parts In-Stock

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Qasali Group International

UK . 166 parts In-Stock

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Microchip USA

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MARBEL Systems

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Argo Parts USA

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Bastille Electronics

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Kenton Components

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Continental Prestige Electronics

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Corphita

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Overview

Unlock the power of cutting-edge technology with the 1SG250HU2F50E1VG by Intel. This Field Programmable Gate Array (FPGA) offers unparalleled quality and performance, thanks to Intel's reputation as a leading manufacturer in the industry. With endless applications in various fields, this product provides customers with unmatched value, flexibility, and reliability. Experience seamless integration and superior functionality with the 1SG250HU2F50E1VG, your gateway to innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FPGA, ensuring a longer lifespan for the product.

No. of Logic Cells: 2422000

With a high number of logic cells, this FPGA offers high flexibility and capability to handle complex programmable logic tasks.

Surface Mount: YES

Being surface-mountable makes this FPGA easy to integrate into electronic circuits, saving space and simplifying the assembly process.

No. of CLBs: 302750

The large number of Configurable Logic Blocks (CLBs) allows for extensive customization and optimization of logic functions within the FPGA.

No. of Inputs: 736

Having a high number of inputs enables the FPGA to interface with multiple external devices or sensors, increasing its versatility.

Package Shape: SQUARE

The square shape of the package allows for easier placement and alignment on circuit boards, optimizing space utilization.

Form Of Terminal: BALL

Ball terminals provide a reliable and secure connection with the PCB, ensuring stable electrical contact for the FPGA.

No. of Terminals: 2397

The abundance of terminals offers flexibility in connectivity options and supports various input/output configurations for the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a FPGA, this product offers reprogrammable logic and routing, allowing for quick prototyping and flexibility in design iterations.

Package Style (Meter): GRID ARRAY

The grid array package style provides a high-density interconnect structure, facilitating efficient signal routing and minimizing signal delays.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand a wide range of environmental conditions, ensuring reliable performance.

Pitch Of Terminal: 1 mm

The small terminal pitch allows for compact integration and efficient routing of signals within the FPGA, improving overall system performance.

Organization: 302750 CLBS

The well-organized structure with a large number of Configurable Logic Blocks (CLBs) enhances the FPGA's ability to handle complex logic operations.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the FPGA can function reliably even in colder environments, making it suitable for a wide range of applications.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom of the FPGA simplifies the PCB layout and allows for easier routing of signals, improving overall system design.

Maximum Seated Height: 3.881 mm

With a relatively low maximum seated height, this FPGA can be easily accommodated in compact devices or tight spaces, enhancing design flexibility.

Width: 50 mm

The moderate width of the FPGA makes it suitable for a wide range of PCB sizes, providing compatibility with various electronic systems.

No. of Outputs: 736

The ample number of outputs allows the FPGA to drive multiple external components or devices, enabling complex signal processing and control capabilities.

Length: 50 mm

The standard length of the FPGA ensures compatibility with common PCB dimensions, simplifying integration into existing electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 1SG250HU2F50E1VG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

2422000

No. of Inputs:

736

No. of Outputs:

736

No. of CLBs:

302750

Organization:

302750 CLBS

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

50 mm

Width:

50 mm

Maximum Seated Height:

3.881 mm

Package Equivalence Code:

BGA2397,49X49,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B2397

Trade Compliance

1SG250HU2F50E1VG Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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