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10M08SAM153C8G

Intel

10M08SAM153C8G by Intel

The Intel 10M08SAM153C8G is a Field Programmable Gate Array (FPGA) with 8000 logic cells and 500 configurable logic blocks (CLBs). It has a max supply voltage of 3.15V and is suitable for applications requiring programmable ICs in various industries.

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$36.610

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DigiKey

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Nova Conductors

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Semicontronic

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Corohmni

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Qasali Group International

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Lucentia Tech

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Overview

Discover the 10M08SAM153C8G by Intel, a top-quality Field Programmable Gate Array (FPGA) that brings unparalleled performance to your projects. With its 8000 logic cells and 500 CLBs, this FPGA offers endless possibilities for customization and innovation. Whether you're working on IoT devices, industrial automation, or high-speed networking solutions, the 10M08SAM153C8G is designed to exceed your expectations. Experience the unmatched value of Intel's manufacturing expertise combined with the flexibility and power of this FPGA. Unlock new levels of productivity and efficiency with the Intel 10M08SAM153C8G. Get started today and revolutionize your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This FPGA uses a plastic/epoxy package body material, which provides durability and protection, making it suitable for a wide range of applications.

No. of Logic Cells: 8000

With a high number of logic cells, this FPGA offers ample resources for complex digital designs, allowing for the implementation of advanced functionalities.

Surface Mount: YES

Being surface mountable, this FPGA can be easily mounted on a PCB, simplifying the manufacturing process and enabling compact and space-efficient designs.

Maximum Supply Voltage: 3.15 V

With a relatively high maximum supply voltage, this FPGA can operate reliably in applications that require higher voltage levels, expanding its usability.

No. of CLBs: 500

This FPGA features 500 Configurable Logic Blocks (CLBs), giving users the flexibility to create custom logic functions tailored to their specific requirements.

No. of Inputs: 250

Equipped with 250 input pins, this FPGA allows for the integration of numerous external signals, facilitating connectivity with other components or systems.

Package Shape: SQUARE

The square package shape of this FPGA helps optimize board space utilization, enabling efficient placement and reducing wasted area.

Form Of Terminal: BALL

The use of ball terminals simplifies the assembly process, facilitating soldering and ensuring reliable electrical connections.

Nominal Supply Voltage (V): 3

With a nominal supply voltage of 3V, this FPGA can be easily integrated into systems with standard power supplies, enhancing compatibility and ease of use.

No. of Terminals: 153

This FPGA boasts 153 terminals, providing sufficient interface options for connecting to various other components, ensuring versatility in system integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this IC offers immense flexibility, allowing users to reconfigure and modify the logic functions as needed.

Package Style (Meter): GRID ARRAY

The grid array package style offers a high-density interconnection, enabling efficient signal routing and minimizing signal propagation delays.

Minimum Supply Voltage: 2.85 V

The FPGA's low minimum supply voltage requirement of 2.85V allows for operation in power-constrained environments, making it suitable for portable applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand higher temperature environments, expanding its potential use in industrial settings.

Pitch Of Terminal: 0.5 mm

The 0.5mm terminal pitch allows for fine-pitch soldering, enabling the integration of this FPGA into densely packed circuit boards.

Organization: 500 CLBS

With an organizational structure consisting of 500 Configurable Logic Blocks (CLBs), this FPGA provides a sufficient number of building blocks for implementing complex digital designs.

Minimum Operating Temperature: 0 °C

The FPGA's minimum operating temperature of 0°C ensures reliable operation even in cold environments, enhancing its suitability for a wide range of applications.

Position Of Terminal: BOTTOM

With the terminal positioned at the bottom, this FPGA can be easily mounted and connected to the PCB, simplifying the manufacturing and assembly process.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3, this FPGA is designed to withstand moderate moisture exposure, ensuring its reliability in various environments.

Maximum Seated Height: 1 mm

The FPGA's maximum seated height of 1mm allows for low-profile designs, minimizing the overall height of the system and enabling compact integration.

Width: 8 mm

With a compact width of 8mm, this FPGA can be easily accommodated in space-restricted applications, providing flexibility in design.

No. of Outputs: 250

Offering 250 output pins, this FPGA allows for the retrieval and transmission of multiple signals, making it suitable for applications requiring extensive output capabilities.

Length: 8 mm

With a length of 8mm, this FPGA can be integrated into small form factor devices, ensuring compatibility with compact design requirements.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M08SAM153C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

8000

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

500

Organization:

500 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

8 mm

Width:

8 mm

Maximum Seated Height:

1 mm

Package Equivalence Code:

BGA153,15X15,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

153

Standards

JESD-30 Code:

S-PBGA-B153

Trade Compliance

10M08SAM153C8G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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