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10M08SCU169I7G

Intel

10M08SCU169I7G by Intel

Intel's 10M08SCU169I7G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with ball terminals.

Median Price

$18.375

Lifecycle Status

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Arrow

USA . 220 parts In-Stock

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Verical

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Nova Conductors

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Schukat

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Digiode

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Flip Electronics

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Chip Stock

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Cyclops Electronics Ltd

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Prism Electronics

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Touchstone Systems

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Velocity Electronics

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Ampacity Inc.

Singapore . 181 parts In-Stock

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Corohmni

South Africa . 501 parts In-Stock

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Vigor

Singapore . 211 parts In-Stock

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Advanced Electronics

New Zealand . 900 parts In-Stock

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Continental Prestige Electronics

USA . 967 parts In-Stock

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Netroflash

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Corphita

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Microchip USA

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Semicontronic

India . 203 parts In-Stock

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MARBEL Systems

Belgium . 4,021 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

Lithuania . 737 parts In-Stock

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Qasali Group International

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Lixinc

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A-Z Elektronik GmbH

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GreenTree Electronics

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S.R.D Solutions

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Perfect Parts

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Argo Parts USA

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Lucentia Tech

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Supply Digital

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Formix International (Excess)

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Futuretech Components

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Overview

Unleash the power of innovation with the 10M08SCU169I7G by Intel. Crafted with precision and expertise, this Field Programmable Gate Array (FPGA) offers endless possibilities for customization and optimization in various applications. With 8000 logic cells and 500 CLBs, this FPGA boasts exceptional performance and reliability. Whether you're in the automotive, industrial, or telecommunications industry, this versatile FPGA will elevate your projects to new heights. Embrace the future of technology with Intel's cutting-edge solution that delivers unmatched value and benefits to customers seeking top-tier quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and thermal stability, making the FPGA suitable for a wide range of operating conditions.

No. of Logic Cells: 8000

With a high number of logic cells, this FPGA can handle complex logic functions and large designs effectively.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and enabling efficient assembly processes.

Maximum Supply Voltage: 3.15 V

Operating within a moderate supply voltage range ensures compatibility with various power systems and reduces the risk of damage due to voltage fluctuations.

No. of CLBs: 500

Having a high number of Configurable Logic Blocks (CLBs) enables versatile configuration options for implementing different logic functions.

No. of Inputs: 250

A large number of inputs allow for extensive data processing capabilities and connectivity with external components or devices.

Package Shape: SQUARE

The square shape of the package offers uniformity in design and facilitates efficient placement on circuit boards.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and support high-speed data transfer rates, crucial for FPGA performance.

Nominal Supply Voltage (V): 3

Operating at the nominal supply voltage ensures optimal performance and stability of the FPGA under normal operating conditions.

Power Supplies (V): 3/3.3

Support for multiple power supply voltages allows for flexibility in system integration and compatibility with different power sources.

No. of Terminals: 169

A sufficient number of terminals enable seamless connectivity and signal transmission between the FPGA and other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers reconfigurability, allowing for design changes and updates without the need for hardware replacement.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates easy mounting and soldering onto circuit boards, ensuring secure and reliable connections.

Minimum Supply Voltage: 2.85 V

The low minimum supply voltage allows for efficient power consumption and operation at lower voltage levels for energy efficiency.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range makes this FPGA suitable for industrial applications where temperature fluctuations are common.

Pitch Of Terminal: 0.8 mm

The tight pitch of the terminal layout enables compact design and efficient routing of signals within the FPGA.

Organization: 500 CLBS

The organized structure with 500 Configurable Logic Blocks (CLBs) enhances the efficiency and scalability of the FPGA in handling complex logic operations.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable performance even in extreme cold environments where other components may fail.

Position Of Terminal: BOTTOM

Having terminals at the bottom allows for easy mounting and soldering onto circuit boards, improving the overall reliability and durability of the connection.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, this FPGA can withstand typical environmental conditions without the risk of moisture-induced damage.

Maximum Seated Height: 1.55 mm

The compact maximum seated height allows for space-efficient integration into slim electronic devices or densely packed circuit board layouts.

Width: 11 mm

A moderate width dimension offers a balance between compactness and compatibility with standard board layouts, ensuring versatile integration options.

No. of Outputs: 250

A substantial number of outputs enable the FPGA to drive multiple signals and interact with various subsystems, enhancing system functionality and performance.

Length: 11 mm

The moderate length dimension provides a compact form factor while offering sufficient space for accommodating the required circuitry and connections.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh industrial environments with demanding temperature conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M08SCU169I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

8000

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

500

Sub-Category:

Field Programmable Gate Arrays

Organization:

500 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Power Supplies:

3/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA169,13X13,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

169

Standards

JESD-30 Code:

S-PBGA-B169

Qualified:

No

Trade Compliance

10M08SCU169I7G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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