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XC7K325T-3FFG900E

Xilinx

XC7K325T-3FFG900E by Xilinx

Xilinx XC7K325T-3FFG900E is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1412 MHz. It uses CMOS technology and has 500 inputs/outputs. Ideal for high-performance computing applications requiring fast processing speeds.

Median Price

$3,681.790

Lifecycle Status

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Digiode

USA . 384 parts In-Stock

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France . 272 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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Sensible Micro Corp

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Cyclops Electronics Ltd

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Touchstone Systems

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AZTECH Wire

Italy . 303 parts In-Stock

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$12.656

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Aztec Data Supply Inc.

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Corohmni

South Africa . 95 parts In-Stock

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Modulus Dynamics

Lithuania . 1,118 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 450 parts In-Stock

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$215.022

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$206.421

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$189.219

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Qasali Group International

UK . 4,697 parts In-Stock

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Ampacity Inc.

Singapore . 4 parts In-Stock

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Semicontronic

India . 2 parts In-Stock

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$3,050.600

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Corphita

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Aranea Global

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Argo Parts USA

USA . 4,195 parts In-Stock

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$3,681.180

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$3,644.368

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$3,607.556

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$3,570.745

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Continental Prestige Electronics

USA . 3,169 parts In-Stock

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Perfect Parts

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Lixinc

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Futuretech Components

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GreenTree Electronics

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Overview

Unlock the endless possibilities of advanced technology with the XC7K325T-3FFG900E by Xilinx. Designed with precision and expertise, this Field Programmable Gate Array (FPGA) stands out for its unmatched quality and reliability. From cutting-edge electronics to innovative industrial applications, this FPGA offers unparalleled performance and flexibility. Experience seamless functionality and superior value with the XC7K325T-3FFG900E, setting new standards in the world of programmable ICs. Elevate your projects with Xilinx, where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides a good balance of durability and cost-effectiveness.

No. of Logic Cells: 326080

With a high number of logic cells, this FPGA is capable of handling complex computations and tasks efficiently.

Surface Mount: YES

Being surface mountable makes the FPGA easy to integrate into electronic circuits and saves valuable PCB space.

Maximum Supply Voltage: 1.03 V

Operating at a maximum supply voltage of 1.03 V ensures low power consumption and better efficiency.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA reliable and energy-efficient.

No. of Inputs: 500

Having a high number of inputs allows for connectivity with a wide range of external devices and sensors.

Form Of Terminal: BALL

The ball terminal form factor simplifies the assembly process and ensures secure connections.

Power Supplies (V): 1,1.8,3.3

Support for multiple power supply voltages allows for flexible voltage compatibility in diverse electronic systems.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals enables high-density mounting, saving space on the PCB.

Maximum Clock Frequency: 1412 MHz

The high maximum clock frequency enables fast processing and data throughput, suitable for demanding applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K325T-3FFG900E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

326080

No. of Inputs:

500

No. of Outputs:

500

No. of CLBs:

25475

Maximum Clock Frequency:

1412 MHz

CLB Maximum Delay:

0.58 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

25475 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8,3.3 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

3.35 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7K325T-3FFG900E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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