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XC7K325T-3FFG676E

Xilinx

XC7K325T-3FFG676E by Xilinx

The Xilinx XC7K325T-3FFG676E is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1412 MHz. It uses CMOS technology and has power supplies of 1V, 1.8V, and 3.3V. Ideal for applications requiring high-speed processing such as telecommunications equipment or industrial automation systems.

Median Price

$3,254.140

Lifecycle Status

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6

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Mouser Electronics

USA . 2 parts In-Stock

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Digiode

USA . 278 parts In-Stock

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VNN

France . 561 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Connect4Technologies Inc.

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Vyrian

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AZTECH Wire

Italy . 769 parts In-Stock

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$19.057

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MARBEL Systems

Belgium . 2,474 parts In-Stock

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$49.710

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$47.722

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Texas Native Microelectronics

USA . 50 parts In-Stock

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Modulus Dynamics

Lithuania . 1,127 parts In-Stock

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Kenton Components

USA . 15 parts In-Stock

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Corohmni

South Africa . 665 parts In-Stock

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Aztec Data Supply Inc.

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Ampacity Inc.

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Semicontronic

India . 4 parts In-Stock

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$2,639.748

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Corphita

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Aranea Global

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Argo Parts USA

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$3,201.690

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$3,169.673

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$3,137.656

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$3,105.639

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Continental Prestige Electronics

USA . 3,512 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$3,265.357

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Lixinc

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Perfect Parts

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Qasali Group International

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Overview

Unleash the power of cutting-edge technology with the XC7K325T-3FFG676E by Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). Boasting 326080 logic cells and 25475 CLBs, this FPGA is a game-changer in the world of programmable ICs. With a maximum clock frequency of 1412 MHz and a wide range of power supplies, this product offers unmatched performance and versatility. Ideal for a variety of applications, from telecommunications to industrial automation, the XC7K325T-3FFG676E delivers the value, benefits, and advantages that customers crave. Elevate your projects to new heights with Xilinx's top-of-the-line FPGA solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the FPGA suitable for a variety of environments.

No. of Logic Cells: 326080

With a large number of logic cells, this FPGA is capable of handling complex logic functions and designs.

Technology Used: CMOS

CMOS technology allows for low power consumption and high-speed operation, making the FPGA efficient and reliable.

Maximum Clock Frequency: 1412 MHz

The high clock frequency allows for fast processing and performance, making this FPGA suitable for high-speed applications.

No. of Inputs: 400

Having a large number of inputs enables the FPGA to interface with multiple external devices and sensors, increasing its versatility.

No. of Outputs: 400

The same number of outputs as inputs allows for efficient data processing and communication within the FPGA.

Power Supplies (V): 1, 1.8, 3.3

Support for multiple power supply voltages allows for flexibility in design and compatibility with different systems.

Maximum Seated Height: 3.37 mm

The compact size of the FPGA makes it suitable for space-constrained applications and facilitates integration into various systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K325T-3FFG676E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

326080

No. of Inputs:

400

No. of Outputs:

400

No. of CLBs:

25475

Maximum Clock Frequency:

1412 MHz

CLB Maximum Delay:

0.58 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

25475 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8,3.3 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.37 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7K325T-3FFG676E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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