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XC7S25-L1CSGA324I

Xilinx

XC7S25-L1CSGA324I by Xilinx

Xilinx XC7S25-L1CSGA324I FPGA offers 23360 logic cells, 1825 CLBs, and 1098 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with -40 to 100 °C operating temp range. Features low profile grid array package with 0.8 mm terminal pitch.

Median Price

$71.270

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Mouser Electronics

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$55.650

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Overview

Unleash the power of cutting-edge technology with the XC7S25-L1CSGA324I by Xilinx, a leading manufacturer in the field of Field Programmable Gate Arrays (FPGA). This innovative product boasts 23360 logic cells and 1825 CLBs, making it a versatile solution for a wide range of applications. With a maximum clock frequency of 1098 MHz and a temperature range suitable for industrial use, this FPGA offers unparalleled performance and reliability. Elevate your projects to new heights with the XC7S25-L1CSGA324I and experience the difference that top-quality technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FPGA, ensuring it can withstand various environmental conditions.

No. of Logic Cells: 23360

High number of logic cells allows for complex logic operations to be implemented efficiently.

Surface Mount: YES

Ease of installation and integration into circuit boards.

Maximum Supply Voltage: 0.98 V

Efficient power consumption with low voltage requirement.

No. of CLBs: 1825

Provides flexibility in designing custom logic functions.

No. of Inputs: 150

High number of inputs allows for versatile input configurations.

Package Shape: SQUARE

Space-efficient design for compact circuit board layouts.

Form Of Terminal: BALL

Ease of soldering and connection to other components.

Nominal Supply Voltage (V): 0.95

Stable supply voltage for consistent performance.

No. of Terminals: 324

Sufficient number of terminals for connecting to other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Flexibility in reprogramming the FPGA for different functionalities.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhanced connectivity and compact design for efficient circuit board layout.

Minimum Supply Voltage: 0.92 V

Allows for operation at lower power consumption levels.

Maximum Operating Temperature: 100 °C

Suitable for industrial applications with high operating temperatures.

Pitch Of Terminal: 0.8 mm

Fine pitch terminals allow for high-density connections.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low delay for efficient logic operations.

Organization: 1825 CLBS

Organized structure for easy management of logic functions.

Minimum Operating Temperature: -40 °C

Suitable for operation in harsh cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Resistant to corrosion and provides reliable connections.

Position Of Terminal: BOTTOM

Facilitates easy mounting and soldering on circuit boards.

Maximum Seated Height: 1.5 mm

Low-profile design for space-constrained applications.

Width: 15 mm

Compact form factor for efficient circuit board integration.

Maximum Clock Frequency: 1098 MHz

High clock frequency for fast processing of logic operations.

No. of Outputs: 150

Versatile output options for various applications.

Length: 15 mm

Symmetrical dimensions for uniform circuit board design.

Grading Of Temperature: INDUSTRIAL

Designed to withstand industrial temperature ranges for reliable operation.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7S25-L1CSGA324I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

23360

No. of Inputs:

150

No. of Outputs:

150

No. of CLBs:

1825

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Organization:

1825 CLBS

Power Characteristics

Nominal Supply Voltage:

0.95

Minimum Supply Voltage:

.92 V

Maximum Supply Voltage:

.98 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Trade Compliance

XC7S25-L1CSGA324I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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