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XC7S6-1FTGB196I

Xilinx

XC7S6-1FTGB196I by Xilinx

Xilinx XC7S6-1FTGB196I FPGA offers 6000 logic cells, 469 CLBs, and 1098 MHz clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.

Median Price

$24.100

Lifecycle Status

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8

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Farnell

UK . 200 parts In-Stock

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$12.980

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DigiKey

USA . 298 parts In-Stock

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Element14

Singapore . 200 parts In-Stock

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$25.850

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Digiode

USA . 147 parts In-Stock

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$16.654

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VNN

France . 473 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Chip Stock

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Vyrian

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Semicontronic

India . 426 parts In-Stock

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$14.900

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$14.528

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$14.453

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Corphita

USA . 206 parts In-Stock

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Microchip USA

USA . 2,388 parts In-Stock

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$22.410

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$20.910

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Continental Prestige Electronics

USA . 4,713 parts In-Stock

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$23.055

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Netroflash

USA . 50 parts In-Stock

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Corohmni

South Africa . 102 parts In-Stock

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$26.157

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MARBEL Systems

Belgium . 675 parts In-Stock

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Texas Native Microelectronics

USA . 75 parts In-Stock

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Ampacity Inc.

Singapore . 223 parts In-Stock

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$32.430

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Advanced Electronics

New Zealand . 85 parts In-Stock

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$31.224

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$28.136

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Kenton Components

USA . 3,328 parts In-Stock

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Modulus Dynamics

Lithuania . 59 parts In-Stock

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Qasali Group International

UK . 70 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,722 parts In-Stock

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$106.280

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Vigor

Singapore . 100 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Robosynatics

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Lucentia Tech

USA . 5,000 parts In-Stock

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Supply Digital

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Argo Parts USA

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Overview

Unlock endless possibilities with the XC7S6-1FTGB196I by Xilinx, a top-tier manufacturer in the Field Programmable Gate Array (FPGA) category. With 6000 logic cells and 469 CLBs, this FPGA offers unparalleled performance and flexibility for a wide range of applications. Whether you're working on IoT devices, industrial automation, or telecommunications systems, this FPGA's low profile, fine pitch package style and industrial grading temperature ensure reliability and efficiency. Embrace innovation and elevate your projects with the XC7S6-1FTGB196I from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material choice for packaging, ensuring reliability and affordability of the product.

No. of Logic Cells: 6000

High number of logic cells provide flexibility and capability for complex programmable designs.

Surface Mount: YES

Surface mount design allows for easy installation and saves space on PCB boards.

Maximum Supply Voltage: 1.05 V

Efficient power consumption with a low maximum supply voltage, contributing to energy savings.

No. of CLBs: 469

A high number of Configurable Logic Blocks (CLBs) provide ample resources for logic customization.

No. of Inputs: 100

Sufficient number of inputs for accepting various input signals in a design.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easier integration into systems.

Form Of Terminal: BALL

Ball terminals enable secure connection and are well-suited for small pitch and space-saving designs.

No. of Terminals: 196

A moderate number of terminals provides connectivity options without excessive complexity.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology offers flexibility and reconfigurability for rapid prototyping and design iteration.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design enhances signal integrity and thermal performance.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage supports power efficiency and extends the lifespan of the product.

Maximum Operating Temperature: 100 °C

Wide operating temperature range allows for reliable performance in diverse environmental conditions.

Pitch Of Terminal: 1 mm

Small pitch size of terminals enables compact design and efficient routing of signals.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low combinatorial delay ensures fast signal processing and high-speed operation.

Organization: 469 CLBS

Organized structure with a large number of CLBs offers flexibility and scalability for complex designs.

Minimum Operating Temperature: -40 °C

Wide range of temperatures supported allows for reliable operation in harsh environments.

Finishing Of Terminal Used: MATTE TIN

Matte tin finish on terminals provides good solderability and corrosion resistance for long-lasting connections.

Position Of Terminal: BOTTOM

Bottom terminal positioning enables easy access and efficient layout on PCB boards.

Maximum Seated Height: 1.55 mm

Low seated height contributes to space-saving design and allows for compact system integration.

Width: 15 mm

Compact width dimension makes it suitable for applications with space constraints.

Maximum Clock Frequency: 1098 MHz

High clock frequency capability supports rapid data processing and high-performance applications.

No. of Outputs: 100

Sufficient number of outputs for driving external devices and delivering processed signals.

Length: 15 mm

Compact length dimension enables space-efficient design and versatile mounting options.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding industrial environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7S6-1FTGB196I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

6000

No. of Inputs:

100

No. of Outputs:

100

No. of CLBs:

469

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Organization:

469 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA196,14X14,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

1 mm

No. of Terminals:

196

Standards

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e3

Trade Compliance

XC7S6-1FTGB196I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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