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LCMXO2280C-3BN256C

Lattice Semiconductor

LCMXO2280C-3BN256C by Lattice Semiconductor

LCMXO2280C-3BN256C by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 2280 logic cells. It has a max supply voltage of 3.465V and can operate at temperatures up to 85°C. This FPGA is commonly used in applications requiring programmable ICs for various electronic systems.

Median Price

$28.600

Lifecycle Status

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Nova Conductors

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Overview

Discover the LCMXO2280C-3BN256C by Lattice Semiconductor, a top-quality Field Programmable Gate Array (FPGA) that brings unparalleled advantages to your projects. With 2280 logic cells and 285 configurable logic blocks (CLBs), this FPGA empowers you to design cutting-edge solutions with ease. Its surface mount capability and low-profile package make it ideal for space-constrained applications. Whether you're working on automotive electronics or industrial control systems, the LCMXO2280C-3BN256C offers exceptional value, benefits, and advantages. Unlock limitless possibilities and unleash your creativity with this powerful FPGA from Lattice Semiconductor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the FPGA, making it a reliable option.

No. of Logic Cells: 2280

With a high number of logic cells, this FPGA provides ample capacity for complex designs and allows for large-scale integration.

Surface Mount: YES

The surface mount capability of this FPGA facilitates easy and efficient installation onto PCBs, enhancing the overall convenience and flexibility of its implementation.

Maximum Supply Voltage: 3.465 V

The higher maximum supply voltage enables this FPGA to handle demanding power requirements, making it suitable for power-intensive applications.

No. of CLBs: 285

Having a substantial number of Configurable Logic Blocks (CLBs) allows for versatile design implementations, providing flexibility and adaptability in various circuit designs.

No. of Inputs: 211

With a significant number of inputs, this FPGA allows for the integration of numerous external signals, enabling complex system control and data processing.

Package Shape: SQUARE

The square package shape offers efficient use of space and simplifies the integration of the FPGA into the overall system design.

Form Of Terminal: BALL

The ball form of the terminal provides a reliable and well-established connection, ensuring stable electrical connections for optimal performance.

Nominal Supply Voltage (V): 1.8

The nominal supply voltage of 1.8 V ensures compatibility with a wide range of power sources, increasing the versatility and ease of use for this FPGA.

Power Supplies (V): 1.8/3.3

The availability of multiple power supply options (1.8 V and 3.3 V) provides flexibility in designing and accommodating different voltage requirements within a system.

No. of Terminals: 256

Equipped with a considerable number of terminals, this FPGA offers extensive connectivity options, enabling seamless interfacing with various peripheral devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this product offers the advantage of reconfigurability, allowing users to modify its functionality as needed without requiring hardware changes.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style, combined with a low profile and fine pitch, guarantees a compact and space-saving integration, making it ideal for applications with limited space constraints.

Minimum Supply Voltage: 1.71 V

The lower minimum supply voltage ensures compatibility with low-power systems, enabling energy-efficient operation and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can operate reliably even under demanding environmental conditions, improving its overall robustness and suitability for industrial applications.

Pitch Of Terminal: 0.8 mm

The small pitch of 0.8 mm allows for finer spacing between terminal connections, enabling compact PCB layout designs and optimizing space utilization.

Organization: 285 CLBS

The organization of 285 Configurable Logic Blocks (CLBs) provides versatility in implementing a wide range of complex circuit designs, offering the flexibility required by demanding applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making this FPGA suitable for various industrial and outdoor applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals ensures excellent conductivity, high corrosion resistance, and reliable signal transfer, contributing to the overall reliability of the FPGA.

Position Of Terminal: BOTTOM

The terminal's bottom position simplifies the insertion and connection process during assembly, enhancing the ease of integrating this FPGA onto printed circuit boards.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA has enhanced protection against moisture-related damage during storage and handling, increasing its reliability and shelf life.

Maximum Seated Height: 1.7 mm

The compact maximum seated height of 1.7 mm allows for effective space utilization, particularly in applications with strict height restrictions.

Width: 14 mm

The overall width of 14 mm ensures compatibility with standard PCB designs, facilitating easy integration and providing a suitable form factor for a wide range of applications.

No. of Outputs: 211

The FPGA's high number of outputs allows for efficient data distribution and output control, enabling complex signal routing and enhancing system functionality.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperature of 260°C ensures reliable soldering during manufacturing processes, simplifying production and improving the overall quality of the FPGA.

Length: 14 mm

The overall length of 14 mm offers compatibility with standard PCB footprints, making integration of this FPGA into existing designs more convenient and streamlined.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO2280C-3BN256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

2280

No. of Inputs:

211

No. of Outputs:

211

No. of CLBs:

285

Sub-Category:

Field Programmable Gate Arrays

Organization:

285 CLBS

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.71 V

Maximum Supply Voltage:

3.465 V

Power Supplies:

1.8/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Package Equivalence Code:

BGA256,16X16,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LCMXO2280C-3BN256C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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