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M1A3P250-VQG100I

Microchip Technology

M1A3P250-VQG100I by Microchip Technology

Microchip Technology's M1A3P250-VQG100I is a CMOS FPGA with 6144 CLBs and 250000 gates. It operates at temperatures ranging from -40 to 100 °C, with a supply voltage of 1.425V to 1.575V. This field-programmable IC in a square package is ideal for industrial applications requiring high gate count and versatile programmability.

Median Price

$18.416

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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Chip Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 733 parts In-Stock

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$7.891

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Continental Prestige Electronics

USA . 6,969 parts In-Stock

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$17.880

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Netroflash

USA . 1,000 parts In-Stock

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$18.416

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$17.496

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$17.127

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Microchip USA

USA . 1,438 parts In-Stock

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$20.640

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Semicontronic

India . 802 parts In-Stock

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$26.325

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$26.190

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Ampacity Inc.

Singapore . 914 parts In-Stock

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$28.000

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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Corohmni

South Africa . 1,097 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,653 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Fulton Briggs Corp.

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Argo Parts USA

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Authorized Procurement Solutions

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Corphita

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Robosynatics

Brazil . 450 parts In-Stock

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Lucentia Tech

USA . 450 parts In-Stock

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$2.257

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Overview

Discover the cutting-edge M1A3P250-VQG100I by Microchip Technology, a top-of-the-line Field Programmable Gate Array that boasts 250,000 equivalent gates and 6,144 CLBs. With a nominal supply voltage of 1.5V and a maximum operating temperature of 100°C, this FPGA is designed to deliver superior performance and reliability. Whether you're working on telecommunications, automotive, or industrial projects, this versatile device will provide the power and flexibility you need to bring your ideas to life. Trust in Microchip Technology's reputation for quality and innovation, and unlock endless possibilities with the M1A3P250-VQG100I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material in the package body makes the FPGA lightweight and durable, ensuring easy handling and long-lasting performance.

Maximum Supply Voltage: 1.575 V

The high maximum supply voltage allows for flexibility in voltage requirements, making it suitable for a wide range of applications.

No. of CLBs: 6144

With a high number of CLBs, this FPGA offers a significant amount of logic resources, enabling complex designs and functionalities.

Technology Used: CMOS

CMOS technology provides low power consumption and high-speed operation, making the FPGA efficient and reliable for various applications.

No. of Equivalent Gates: 250000

The large number of equivalent gates allows for the implementation of intricate logic functions, making the FPGA versatile and capable of handling complex tasks.

Minimum Operating Temperature: -40 °C

The wide range of operating temperature ensures reliability in extreme conditions, making this FPGA suitable for industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M1A3P250-VQG100I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

6144

No. of Equivalent Gates:

250000

Technology:

CMOS

Organization:

6144 CLBS, 250000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.2 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

100

Standards

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

M1A3P250-VQG100I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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