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M1A3P1000-PQG208M

Microchip Technology

M1A3P1000-PQG208M by Microchip Technology

M1A3P1000-PQG208M by Microchip Technology is a CMOS FPGA with 24576 logic cells and 1000000 equivalent gates. Operating at up to 350 MHz, it has 154 inputs/outputs and supports supply voltages of 1.425V to 1.575V. Ideal for military-grade applications requiring high-speed processing in compact form factors.

Median Price

$355.430

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 272 parts In-Stock

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$299.800

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$299.800

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Arrow

USA . 40 parts In-Stock

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$411.060

100+ parts

$377.430

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$375.140

10k+ parts

$375.140

40

$411.060

$377.430

$375.140

$375.140

Distributors (In-Stock)

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$274.351

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550

$274.351

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Digiode

USA . 239 parts In-Stock

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$284.810

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$284.810

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Vyrian

USA . 5,911 parts In-Stock

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Chip Stock

USA . 1,086 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 746 parts In-Stock

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$13.047

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$13.047

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Corohmni

South Africa . 531 parts In-Stock

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$54.363

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531

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$72.573

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$68.944

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$68.944

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$72.573

$68.944

$68.944

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Aztec Data Supply Inc.

USA . 4,659 parts In-Stock

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$122.560

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Corphita

USA . 495 parts In-Stock

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$269.820

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$269.820

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Continental Prestige Electronics

USA . 205 parts In-Stock

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$270.355

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$264.948

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$270.355

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$264.948

Component Stockers USA

USA . 92 parts In-Stock

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$295.990

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Semicontronic

India . 40 parts In-Stock

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$349.400

100+ parts

$340.665

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$338.918

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$349.400

$340.665

$338.918

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Marpe Global Electronics

Taiwan . 8,300 parts In-Stock

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QualityLine Systems

Poland . 8,300 parts In-Stock

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XL Components Corporation

Australia . 8,300 parts In-Stock

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Microchip USA

USA . 521 parts In-Stock

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521

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Argo Parts USA

USA . 355 parts In-Stock

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355

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Overview

Unleash the power of cutting-edge technology with the M1A3P1000-PQG208M by Microchip Technology. This Field Programmable Gate Array (FPGA) boasts 24576 logic cells and 1000000 equivalent gates, delivering unmatched performance for a wide range of applications. With a maximum clock frequency of 350 MHz and a MILITARY grading of temperature, this FPGA is designed to exceed expectations in even the most demanding environments. Trust in the quality and reliability of Microchip Technology as you experience the value and benefits that the M1A3P1000-PQG208M brings to your projects. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 24576

Offers a high level of programmable logic for complex applications.

Surface Mount: YES

Allows for easy and secure mounting on PCBs.

Maximum Supply Voltage: 1.575 V

Provides flexibility in power supply options.

Technology Used: CMOS

Utilizes low power consumption and high noise immunity.

No. of Inputs: 154

Enables input flexibility for various data and signals.

Nominal Supply Voltage (V): 1.5

Standard voltage for stable operation.

Power Supplies (V): 1.5,1.5/3.3

Supports multiple power supply configurations.

Maximum Operating Temperature: 125 °C

Ensures reliability in high-temperature environments.

Organization: 24576 CLBS, 1000000 GATES

Offers a large number of resources for complex designs.

Minimum Operating Temperature: -55 °C

Suitable for a wide range of operating conditions.

Maximum Clock Frequency: 350 MHz

Supports high-speed processing for real-time applications.

Grading Of Temperature: MILITARY

Meets stringent temperature requirements for military applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M1A3P1000-PQG208M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

24576

No. of Inputs:

154

No. of Outputs:

154

No. of CLBs:

24576

No. of Equivalent Gates:

1000000

Maximum Clock Frequency:

350 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

24576 CLBS, 1000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Power Supplies:

1.5,1.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Fine Pitch

Package Code:

Package Shape:

Length:

28 mm

Width:

28 mm

Maximum Seated Height:

4.1 mm

Packing Method:

Tray

Package Equivalence Code:

QFP208,1.2SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

208

Standards

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

M1A3P1000-PQG208M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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