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EP4CE10F17C8N

Intel

EP4CE10F17C8N by Intel

EP4CE10F17C8N by Intel is a FPGA with 10320 logic cells and 179 inputs/outputs. Operating at a max frequency of 472.5 MHz, it's ideal for applications requiring high-speed processing like telecommunications and signal processing. With a low profile grid array package style, it offers flexibility in design and integration.

Median Price

$41.830

Lifecycle Status

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12

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Arrow

USA . 6,108 parts In-Stock

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DigiKey

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Verical

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Digiode

USA . 1,118 parts In-Stock

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Nova Conductors

Japan . 42 parts In-Stock

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Schukat

Germany . 169 parts In-Stock

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Chip Stock

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Dynamic Solutions

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Touchstone Systems

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Vyrian

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VRG Components

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ComSIT Distribution GmbH

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Semicontronic

India . 2,420 parts In-Stock

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$30.220

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$29.464

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Ampacity Inc.

Singapore . 2,417 parts In-Stock

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Corohmni

South Africa . 137 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$30.452

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Continental Prestige Electronics

USA . 1,755 parts In-Stock

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$37.330

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$36.583

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Netroflash

USA . 1,000 parts In-Stock

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$37.330

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Microchip USA

USA . 1,179 parts In-Stock

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$39.610

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Vigor

Singapore . 20 parts In-Stock

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MARBEL Systems

Belgium . 540 parts In-Stock

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Texas Native Microelectronics

USA . 8,693 parts In-Stock

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Modulus Dynamics

Lithuania . 582 parts In-Stock

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Kenton Components

USA . 65 parts In-Stock

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Aztec Data Supply Inc.

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Authorized Procurement Solutions

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Lixinc

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Alle Elektronik GmbH

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Perfect Parts

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A-Z Elektronik GmbH

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Glotronic Ltd.

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Supply Digital

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Argo Parts USA

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Infinite Electronics LLP (Excess)

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GreenTree Electronics

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Kepictronics

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Qasali Group International

UK . 1,463 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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RC Electronics

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Futuretech Components

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Overview

Unlock endless possibilities with the Intel EP4CE10F17C8N Field Programmable Gate Array. Designed with top-tier quality and reliability, this FPGA offers unmatched flexibility for a wide range of applications. From automotive to industrial automation, this product delivers exceptional value by providing customers with the power to customize and optimize their designs effortlessly. Stay ahead of the curve and unleash your creativity with the EP4CE10F17C8N by Intel.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides a durable and cost-effective solution for the package body, ensuring reliability and longevity.

No. of Logic Cells: 10320

Large number of logic cells allows for complex programmable logic designs to be implemented efficiently.

Surface Mount: YES

Surface mount compatibility enables easy and convenient integration into electronic circuits and PCBs.

Maximum Supply Voltage: 1.03 V

Low maximum supply voltage reduces power consumption and heat dissipation, making the FPGA more energy efficient.

No. of CLBs: 10320

The high number of Configurable Logic Blocks (CLBs) allows for flexible and customizable logic functions to be implemented in the FPGA.

No. of Inputs: 179

The large number of inputs enables the FPGA to interface with multiple external devices and input signals.

Package Shape: SQUARE

Square package shape provides efficient use of space and easy integration into PCB layouts.

Form Of Terminal: BALL

Ball terminals offer reliable connections and facilitate easy soldering during PCB assembly.

Power Supplies (V): 1.2,1.2/3.3,2.5

Support for multiple power supply voltages allows for compatibility with various system requirements and operating conditions.

No. of Terminals: 256

A high number of terminals provide ample connectivity options and flexibility in designing the PCB layout for the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA, it offers the flexibility of reprogramming the logic functions and configurations, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array package style with low profile design enables efficient heat dissipation and compact integration into electronic systems.

Minimum Supply Voltage: 0.97 V

Low minimum supply voltage allows for operation in low-power or battery-powered applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance even in demanding environmental conditions.

Pitch Of Terminal: 1 mm

Terminal pitch of 1mm provides precise and reliable connections on the PCB.

Organization: 10320 CLBS

Organized into 10320 Configurable Logic Blocks (CLBs), enabling complex logic functions and designs to be implemented efficiently.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the FPGA can operate in a wide range of temperature conditions without performance issues.

Finishing Of Terminal Used: TIN SILVER COPPER

Terminal finishing of tin, silver, copper provides good conductivity and corrosion resistance for reliable connections.

Position Of Terminal: BOTTOM

Bottom position of terminals facilitates easier PCB layout and routing of connections for efficient design.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates the level of protection against moisture, ensuring the FPGA's reliability in humid environments.

Maximum Seated Height: 1.55 mm

Low maximum seated height allows for slim and compact design of the overall electronic system.

Width: 17 mm

Compact width of 17mm enables efficient use of space on the PCB and easy integration into electronic systems.

Maximum Clock Frequency: 472.5 MHz

High maximum clock frequency allows for fast processing of logic functions and real-time operations in the FPGA.

No. of Outputs: 179

The large number of outputs enables the FPGA to drive multiple external devices and provide feedback signals efficiently.

Length: 17 mm

Compact length of 17mm enables efficient use of space on the PCB and easy integration into electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP4CE10F17C8N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

10320

No. of Inputs:

179

No. of Outputs:

179

No. of CLBs:

10320

Maximum Clock Frequency:

472.5 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

10320 CLBS

Additional Features:

It can also operate at 1.2 V supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP4CE10F17C8N Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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