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EP4CE55F23I7N

Intel

EP4CE55F23I7N by Intel

EP4CE55F23I7N by Intel is a FPGA with 55856 logic cells, 3491 CLBs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities, such as telecommunications equipment and industrial automation systems.

Median Price

$268.930

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Mouser Electronics

USA . 899 parts In-Stock

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DigiKey

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Verical

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Digiode

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Nova Conductors

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Cyclops Electronics Ltd

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Modulus Dynamics

Lithuania . 1,858 parts In-Stock

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Texas Native Microelectronics

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Vigor

Singapore . 468 parts In-Stock

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Corphita

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Semicontronic

India . 354 parts In-Stock

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Ampacity Inc.

Singapore . 128 parts In-Stock

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Corohmni

South Africa . 314 parts In-Stock

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Advanced Electronics

New Zealand . 187 parts In-Stock

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Aranea Global

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Continental Prestige Electronics

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Microchip USA

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Qasali Group International

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Alle Elektronik GmbH

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Lucentia Tech

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iodParts Technologies Inc.

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Kenton Components

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Overview

Unlock endless possibilities with the EP4CE55F23I7N by Intel, a high-quality Field Programmable Gate Array that boasts 55856 logic cells and 3491 CLBs. From rapid prototyping to advanced digital signal processing, this FPGA offers unmatched flexibility and performance for your design needs. With Intel's reputation for reliability and innovation, you can trust that you're getting a top-of-the-line product that will exceed your expectations. Experience seamless integration, superior functionality, and unparalleled value with the EP4CE55F23I7N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the FPGA, making it suitable for various applications.

No. of Logic Cells: 55856

Offers a large number of logic cells for complex programmable logic designs.

Surface Mount: YES

Allows for easy installation and implementation on circuit boards.

Maximum Supply Voltage: 1.25 V

Ensures safe operation within specified voltage limits.

No. of CLBs: 3491

Provides a high number of Configurable Logic Blocks for flexibility in design.

No. of Inputs: 327

Offers a large number of input ports for connecting external signals.

Package Shape: SQUARE

Facilitates easy integration into square grid layouts for efficient board design.

Form Of Terminal: BALL

Ball terminals simplify the assembly process and ensure reliable connections.

Nominal Supply Voltage (V): 1.2

Maintains stable voltage supply for consistent performance.

Power Supplies (V): 1.2,1.2/3.3,2.5

Supports multiple power supply options for versatile applications.

No. of Terminals: 484

Provides a sufficient number of terminals for connection to external circuitry.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Offers programmable logic capabilities for flexibility in application design.

Package Style (Meter): GRID ARRAY

Grid array package style simplifies the mounting process on circuit boards.

Minimum Supply Voltage: 1.15 V

Has a low minimum supply voltage for power efficiency.

Pitch Of Terminal: 1 mm

Close terminal pitch allows for compact board layout and efficient routing.

Organization: 3491 CLBS

Organized into 3491 Configurable Logic Blocks for efficient logic design.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

Utilizes high-quality terminal finishes for reliable electrical connections.

Position Of Terminal: BOTTOM

Bottom-mount terminals enable easy and secure soldering on circuit boards.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure during handling and storage.

Maximum Seated Height: 2.4 mm

Low profile design for space-constrained applications.

Width: 23 mm

Compact width for efficient board space utilization.

Maximum Clock Frequency: 472.5 MHz

Supports high-speed operation for demanding applications.

No. of Outputs: 327

Provides a high number of output ports for transmitting processed signals.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration during assembly.

Peak Reflow Temperature °C: 260

Ability to withstand high-temperature reflow processes during assembly.

Length: 23 mm

Compact length for space-efficient board layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP4CE55F23I7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

55856

No. of Inputs:

327

No. of Outputs:

327

No. of CLBs:

3491

Maximum Clock Frequency:

472.5 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

3491 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.4 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP4CE55F23I7N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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