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10M25DAF256I7G

Intel

10M25DAF256I7G by Intel

The Intel 10M25DAF256I7G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at temperatures from -40 to 100 °C and has a supply voltage range of 1.15-1.25 V. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package with grid array style terminals.

Median Price

$104.208

Lifecycle Status

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Verical

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Nova Conductors

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Digiode

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$9.187

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AZTECH Wire

Italy . 189 parts In-Stock

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Corohmni

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Modulus Dynamics

Lithuania . 1,201 parts In-Stock

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MARBEL Systems

Belgium . 928 parts In-Stock

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Aztec Data Supply Inc.

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Vigor

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Continental Prestige Electronics

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Ampacity Inc.

Singapore . 89 parts In-Stock

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Semicontronic

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Corphita

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Component Stockers USA

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Kenton Components

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Texas Native Microelectronics

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Qasali Group International

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Supply Digital

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Overview

Unlock unlimited possibilities with the 10M25DAF256I7G by Intel, a cutting-edge Field Programmable Gate Array that offers unmatched quality and versatility. Manufactured by Intel, a trusted leader in semiconductor technology, this FPGA boasts 25000 logic cells and 1563 CLBs, making it ideal for a wide range of applications. From consumer electronics to industrial automation, this FPGA delivers exceptional performance and reliability. Experience seamless integration, enhanced flexibility, and accelerated development cycles with the 10M25DAF256I7G. Choose Intel for innovation that empowers you to achieve more.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions

No. of Logic Cells: 25000

High number of logic cells for complex programmable functions

Surface Mount: YES

Easy to mount on circuit boards

Maximum Supply Voltage: 1.25 V

Efficient power consumption with low voltage requirement

No. of CLBs: 1563

Sufficient number of Configurable Logic Blocks for versatile programming

No. of Inputs: 360

Allows for multiple input signals to be processed

Package Shape: SQUARE

Space-efficient design for fitting into compact electronic devices

Form Of Terminal: BALL

Ball terminals provide reliable connectivity

Nominal Supply Voltage (V): 1.2

Stable supply voltage for consistent performance

Power Supplies (V): 1.2

Consistent power supply for efficient operation

No. of Terminals: 256

Plenty of terminals for connectivity options

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Versatile programmable integrated circuit for various applications

Package Style (Meter): GRID ARRAY

Grid array package style for organized layout and easy installation

Minimum Supply Voltage: 1.15 V

Low minimum supply voltage for energy efficiency

Maximum Operating Temperature: 100 °C

High maximum operating temperature for reliability in different environments

Pitch Of Terminal: 1 mm

Close terminal pitch for efficient signal transmission

Organization: 1563 CLBS

Well-organized Configurable Logic Blocks for complex programming

Minimum Operating Temperature: -40 °C

Low minimum operating temperature for versatility in various conditions

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finishing for reliable connections

Position Of Terminal: BOTTOM

Bottom terminal position for convenient mounting

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for protection against environmental elements

Maximum Seated Height: 1.55 mm

Low seated height for slim electronic device designs

Width: 17 mm

Compact width for space-saving integration

No. of Outputs: 360

Multiple output options for versatile signal processing

Length: 17 mm

Compact length for fitting into small electronic devices

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating for rugged use

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M25DAF256I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

25000

No. of Inputs:

360

No. of Outputs:

360

No. of CLBs:

1563

Sub-Category:

Field Programmable Gate Arrays

Organization:

1563 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

10M25DAF256I7G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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