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10M25DAF256C8G

Intel

10M25DAF256C8G by Intel

The Intel 10M25DAF256C8G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at a voltage range of 1.15V to 1.25V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring high-speed processing and programmable logic capabilities in various electronic systems.

Median Price

$78.152

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 33 parts In-Stock

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$71.545

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Digiode

USA . 279 parts In-Stock

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Vyrian

USA . 8,625 parts In-Stock

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VNN

France . 3,533 parts In-Stock

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Chip Stock

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AZTECH Wire

Italy . 604 parts In-Stock

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$6.271

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Modulus Dynamics

Lithuania . 336 parts In-Stock

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$58.956

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Vigor

Singapore . 930 parts In-Stock

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$63.180

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$63.180

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

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$63.740

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Corohmni

South Africa . 1,026 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$71.545

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$70.114

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Continental Prestige Electronics

USA . 395 parts In-Stock

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$71.545

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One Stop Electronics

USA . 135 parts In-Stock

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$75.840

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Ampacity Inc.

Singapore . 135 parts In-Stock

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$75.840

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Semicontronic

India . 135 parts In-Stock

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$75.840

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$73.944

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$73.565

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Corphita

USA . 801 parts In-Stock

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$80.298

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Advanced Electronics

New Zealand . 25 parts In-Stock

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$82.992

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$76.352

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Microchip USA

USA . 1,745 parts In-Stock

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$92.230

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Texas Native Microelectronics

USA . 3,852 parts In-Stock

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$167.404

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$147.316

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Qasali Group International

UK . 30 parts In-Stock

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$393.285

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MARBEL Systems

Belgium . 4,131 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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Argo Parts USA

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Lixinc

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Kenton Components

USA . 366 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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Perfect Parts

USA . 101 parts In-Stock

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Overview

Experience next-level performance with the Intel 10M25DAF256C8G Field Programmable Gate Array. Crafted by industry leader Intel, this FPGA boasts exceptional quality and reliability. Perfect for a wide range of applications, this FPGA offers unparalleled flexibility and efficiency. Unlock endless possibilities with 25,000 logic cells and 1.2V nominal supply voltage. Elevate your projects with the Intel 10M25DAF256C8G and experience the superior value and benefits it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers durability and low cost, making this FPGA a cost-effective choice.

No. of Logic Cells: 25000

With a large number of logic cells, this FPGA can handle complex logic functions efficiently.

Surface Mount: YES

Being surface mountable allows for easy integration and space-saving on PCBs.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage ensures power efficiency and compatibility with various systems.

No. of CLBs: 1563

The large number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic functions.

No. of Inputs: 360

With a high number of inputs, this FPGA can accommodate a wide range of input signals.

Package Shape: SQUARE

The square package shape simplifies PCB layout and ensures efficient use of space.

Form Of Terminal: BALL

The use of ball terminals enables secure connections and reliable performance.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V offers compatibility with standard power supplies.

Power Supplies (V): 1.2

With 1.2V power supplies, this FPGA offers consistent performance and reliability.

No. of Terminals: 256

The high number of terminals provides connectivity options for various applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for customization and flexibility in logic design.

Package Style (Meter): GRID ARRAY

The grid array package style offers easy assembly and reliable connections.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures reliable operation even in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes this FPGA suitable for industrial applications.

Pitch Of Terminal: 1 mm

The 1mm pitch of the terminals allows for compact design and efficient use of PCB space.

Organization: 1563 CLBS

The organization of 1563 Configurable Logic Blocks (CLBs) provides flexibility and versatility in logic design.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance in a wide range of environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper finishing on terminals ensures good conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Having terminals at the bottom simplifies assembly and improves thermal management.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this FPGA is suitable for a range of moisture exposure levels.

Maximum Seated Height: 1.55 mm

The low maximum seated height enables compact designs and efficient use of space.

Width: 17 mm

With a width of 17mm, this FPGA can fit into compact PCB layouts.

No. of Outputs: 360

The high number of outputs allows for driving multiple signals and peripherals.

Length: 17 mm

With a length of 17mm, this FPGA can fit into various form factors and PCB layouts.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M25DAF256C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

25000

No. of Inputs:

360

No. of Outputs:

360

No. of CLBs:

1563

Sub-Category:

Field Programmable Gate Arrays

Organization:

1563 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

10M25DAF256C8G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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