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EP4CE15F23C8N

Intel

EP4CE15F23C8N by Intel

EP4CE15F23C8N by Intel is a FPGA with 15408 logic cells, 963 CLBs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable IC functionality. With a package style of GRID ARRAY and surface mount capability, it offers versatility in design implementations.

Median Price

$52.576

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DigiKey

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Nova Conductors

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AZTECH Wire

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Advanced Electronics

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Continental Prestige Electronics

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Corphita

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Microchip USA

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Modulus Dynamics

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Texas Native Microelectronics

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Kenton Components

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Aztec Data Supply Inc.

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Supply Digital

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RC Electronics

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A-Z Elektronik GmbH

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Netroflash

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Lucentia Tech

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Overview

Unlock limitless possibilities with the EP4CE15F23C8N by Intel, a state-of-the-art Field Programmable Gate Array offering unrivaled performance and reliability. Manufactured by industry giant Intel, this FPGA boasts 15408 logic cells and 963 CLBs, making it perfect for a wide range of applications. Whether you're designing cutting-edge electronics or optimizing complex systems, this FPGA delivers exceptional value, benefits, and advantages. Trust Intel to provide you with the tools you need to bring your innovations to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

No. of Logic Cells: 15408

With a high number of logic cells, this FPGA can handle complex logic functions and algorithms efficiently.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto a PCB, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA energy-efficient.

No. of Inputs: 346

Having a large number of inputs allows for versatile connectivity and data processing capabilities in the FPGA.

Package Shape: SQUARE

The square package shape facilitates easy integration into circuit boards and helps optimize space utilization.

Form Of Terminal: BALL

Ball terminals simplify the mounting and connection process, offering good electrical performance and reliability.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V is commonly used in many electronic systems, ensuring compatibility and ease of integration.

Power Supplies (V): 1.2,1.2/3.3,2.5

Multiple power supply options provide flexibility in design and operation, catering to various voltage requirements in different applications.

No. of Terminals: 484

Having a high number of terminals enables greater connectivity and interface options for the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for customization and reprogramming of logic functions, adapting to changing requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density interconnections, facilitating efficient routing and signal integrity in the FPGA.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures reliable operation even under low power conditions, enhancing the FPGA's performance and versatility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range provides resilience and stability in challenging environmental conditions.

Pitch Of Terminal: 1 mm

The terminal pitch of 1mm enables fine pitch connections, enhancing signal integrity and reducing crosstalk in the FPGA.

Organization: 963 CLBS

The organizational structure of 963 CLBs offers a balance between complexity and flexibility, catering to a wide range of design requirements.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in cold environments, expanding the FPGA's applicability.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The use of high-quality finishing materials for terminals ensures good solderability, electrical conductivity, and long-term reliability.

Position Of Terminal: BOTTOM

Bottom positioning of terminals simplifies PCB layout and assembly, enhancing ease of integration and reducing signal routing complexities.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates good moisture resistance, ensuring reliability in humid or damp environments.

Maximum Seated Height: 2.4 mm

The low maximum seated height helps in compact PCB design and efficient use of space in tight enclosures.

Width: 23 mm

The width of 23mm offers a compact form factor, suitable for space-constrained applications without compromising performance.

Maximum Clock Frequency: 472.5 MHz

The high maximum clock frequency allows for fast data processing and real-time operations, meeting high-performance computing requirements.

No. of Outputs: 346

Having a large number of outputs enables multiple data streams and signal processing capabilities in the FPGA, enhancing its functionality.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30s ensures proper soldering and thermal management during assembly, contributing to overall reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures effective soldering and bonding of components, maintaining strong connections in the FPGA.

Length: 23 mm

The length of 23mm complements the square package shape, offering a balanced form factor for easy integration and efficient PCB design.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP4CE15F23C8N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

15408

No. of Inputs:

346

No. of Outputs:

346

No. of CLBs:

963

Maximum Clock Frequency:

472.5 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

963 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.4 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP4CE15F23C8N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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