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XC3S200-4TQG144C

Xilinx

XC3S200-4TQG144C by Xilinx

XC3S200-4TQG144C by Xilinx is a FPGA with 4320 logic cells, 480 CLBs, and 200000 gates. It operates at max frequency of 630 MHz and has 97 inputs/outputs. Ideal for applications requiring high-speed processing like telecommunications and signal processing.

Median Price

$40.030

Lifecycle Status

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Advanced Electronics

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Overview

Experience the cutting-edge technology of Xilinx with the XC3S200-4TQG144C Field Programmable Gate Array. Boasting high-quality construction and advanced CMOS technology, this FPGA offers a myriad of applications for your projects. With 480 CLBs and 200000 equivalent gates, this versatile device provides optimal performance for a wide range of tasks. Trust in Xilinx's reputation for innovation and reliability to take your designs to the next level. Unlock new possibilities and unleash your creativity with the XC3S200-4TQG144C by Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the FPGA.

No. of Logic Cells: 4320

High number of logic cells allow for complex programmable logic designs to be implemented on the FPGA.

Surface Mount: YES

Surface mount capability makes it easier to integrate the FPGA into electronic systems.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 480

Large number of Configurable Logic Blocks provide flexibility in design implementation.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 97

Sufficient number of inputs allow for versatile input/output configurations.

Package Shape: SQUARE

Square package shape facilitates easier layout on circuit boards.

Form Of Terminal: GULL WING

Gull wing terminals make soldering easier and provide reliable electrical connections.

No. of Equivalent Gates: 200000

Large number of equivalent gates enable complex logic functions to be implemented.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures consistent performance of the FPGA.

Power Supplies (V): 1.2,1.2/3.3,2.5

Multiple power supply options provide flexibility in powering the FPGA.

No. of Terminals: 144

Sufficient number of terminals for connectivity with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, it allows for custom logic implementations to be loaded onto the FPGA.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Multiple package styles offer flexibility in mounting and integration options.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage allows for operation in low power environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in harsh environments.

Pitch Of Terminal: 0.5 mm

Fine pitch terminals enable high density mounting on circuit boards.

Maximum Combinatorial Delay of a CLB: 0.61 ns

Low combinatorial delay in CLBs allows for high speed logic operations.

Organization: 480 CLBS, 200000 GATES

Well-structured organization of CLBs and gates for efficient logic implementation.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures operation in wide temperature range.

Finishing Of Terminal Used: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance to the terminals.

Position Of Terminal: QUAD

Quad position terminals offer stable electrical connections for the FPGA.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling precautions.

Maximum Seated Height: 1.6 mm

Low seated height allows for compact board designs when mounting the FPGA.

Width: 20 mm

Compact width dimensions for space-efficient integration into electronic systems.

Maximum Clock Frequency: 630 MHz

High maximum clock frequency enables high-speed operations in digital systems.

No. of Outputs: 97

A sufficient number of outputs allow for versatile output configurations in digital designs.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time at peak temperature for reliable soldering of the FPGA.

Peak Reflow Temperature °C: 260

High reflow temperature ensures proper soldering and reliability during assembly.

Length: 20 mm

Compact length dimension for space-efficient board layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S200-4TQG144C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

4320

No. of Inputs:

97

No. of Outputs:

97

No. of CLBs:

480

No. of Equivalent Gates:

200000

Maximum Clock Frequency:

630 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

480 CLBS, 200000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

20 mm

Width:

20 mm

Maximum Seated Height:

1.6 mm

Package Equivalence Code:

QFP144,.87SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

144

Standards

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

XC3S200-4TQG144C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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