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XC3S250E-4FTG256C

Xilinx

XC3S250E-4FTG256C by Xilinx

Xilinx XC3S250E-4FTG256C FPGA features 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

Median Price

$70.620

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Mouser Electronics

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Nova Conductors

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AZTECH Wire

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Modulus Dynamics

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Microchip USA

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Overview

Experience the cutting-edge technology of the Xilinx XC3S250E-4FTG256C, a high-quality Field Programmable Gate Array designed to meet your most demanding applications. With 5508 logic cells and 250,000 equivalent gates, this FPGA offers unmatched performance and flexibility. Xilinx, known for its innovative solutions, ensures that this product delivers superior value and benefits to customers looking for reliable and efficient programmable ICs. Whether you're working on telecommunications, automotive, or industrial projects, the XC3S250E-4FTG256C is the perfect choice for pushing boundaries and achieving groundbreaking results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the FPGA, making it suitable for various environments.

No. of Logic Cells: 5508

Large number of logic cells allow for complex designs and high functionality in the FPGA.

Maximum Supply Voltage: 1.26 V

Efficient power usage and compatibility with low voltage systems.

Technology Used: CMOS

CMOS technology offers low power consumption and high speed operation, making the FPGA efficient in various applications.

No. of Inputs: 172

Having a high number of inputs allows for versatile connectivity and input options for the FPGA.

No. of Equivalent Gates: 250000

Large number of gates provide flexibility and capability for complex logic functions in the FPGA.

Maximum Clock Frequency: 572 MHz

High clock frequency enables fast processing and performance in the FPGA.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in different environments without compromising performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S250E-4FTG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

5508

No. of Inputs:

172

No. of Outputs:

132

No. of CLBs:

612

No. of Equivalent Gates:

250000

Maximum Clock Frequency:

572 MHz

CLB Maximum Delay:

0.76 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

612 CLBS, 250000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3S250E-4FTG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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