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XC3S400-4TQG144I

Xilinx

XC3S400-4TQG144I by Xilinx

The Xilinx XC3S400-4TQG144I is a FPGA with 8064 logic cells, 896 CLBs, and 400000 equivalent gates. It operates at a max clock frequency of 630 MHz and has a combinatorial delay of 0.61 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in compact designs.

Median Price

$66.980

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Mouser Electronics

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AZTECH Wire

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MARBEL Systems

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Texas Native Microelectronics

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One Stop Electronics

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Kenton Components

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Corphita

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Aranea Global

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Continental Prestige Electronics

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Microchip USA

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Modulus Dynamics

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Lixinc

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Overview

Unleash the power of innovation with the XC3S400-4TQG144I by Xilinx, a cutting-edge Field Programmable Gate Array that boasts 8064 logic cells and 896 CLBs. This versatile FPGA offers limitless possibilities for a wide range of applications, from industrial automation to consumer electronics. With the trusted quality of Xilinx behind it, customers can expect nothing but top-notch performance and reliability. Experience the seamless integration and unparalleled flexibility that this programmable IC provides, making it the ideal choice for those looking to push the boundaries of technology. Elevate your projects to new heights with the XC3S400-4TQG144I - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes this FPGA lightweight and cost-effective.

No. of Logic Cells: 8064

With 8064 logic cells, this FPGA offers high performance and flexibility for complex designs.

Surface Mount: YES

Being surface mountable, this FPGA is easy to integrate onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage of 1.26V ensures power efficiency and minimizes heat dissipation.

Technology Used: CMOS

The CMOS technology used in this FPGA provides high performance and low power consumption.

No. of Inputs: 97

With 97 inputs, this FPGA offers versatility in accepting a wide range of input signals for processing.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy integration into designs.

Form Of Terminal: GULL WING

The gull-wing form of terminals provides secure connections and ease of soldering during assembly.

No. of Equivalent Gates: 400000

With 400,000 equivalent gates, this FPGA offers ample resources for implementing complex logic functions.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures compatibility with standard power sources for reliable operation.

Power Supplies (V): 1.2,1.2/3.3,2.5

The multiple power supply options allow for flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 144

The 144 terminals provide sufficient connections for interfacing with external components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this IC offers flexibility and reconfigurability for custom applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances thermal performance and facilitates high-density mounting.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14V ensures reliable operation even at lower power levels.

Pitch Of Terminal: 0.5 mm

The 0.5mm pitch of terminals allows for high-density mounting and efficient use of board space.

Maximum Combinatorial Delay of a CLB: 0.61 ns

The low maximum combinatorial delay of 0.61ns ensures fast and efficient logic processing within the CLBs.

Organization: 896 CLBS, 400000 GATES

The organization of 896 CLBs and 400,000 gates provides a balance between logic complexity and resource availability.

Finishing Of Terminal Used: MATTE TIN

The use of matte tin finishing on terminals ensures good solderability and reliability in various operating conditions.

Position Of Terminal: QUAD

The quad position of terminals provides secure connections and minimizes the risk of signal interference.

Moisture Sensitivity Level (MSL): 3

With MSL 3, this FPGA can withstand moderate exposure to moisture during storage and assembly processes.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6mm allows for compact PCB design and efficient use of vertical space.

Width: 20 mm

With a width of 20mm, this FPGA is suitable for designs with space constraints and compact form factors.

Maximum Clock Frequency: 630 MHz

The high maximum clock frequency of 630MHz enables fast processing of logic operations and real-time applications.

No. of Outputs: 97

The 97 outputs provide ample channels for transmitting processed data to external components or other parts of the system.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures reliable soldering and assembly processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FPGA can withstand high-temperature soldering processes without damage.

Length: 20 mm

The length of 20mm makes this FPGA suitable for designs with space constraints and compact form factors.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S400-4TQG144I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

8064

No. of Inputs:

97

No. of Outputs:

97

No. of CLBs:

896

No. of Equivalent Gates:

400000

Maximum Clock Frequency:

630 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

896 CLBS, 400000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

20 mm

Width:

20 mm

Maximum Seated Height:

1.6 mm

Package Equivalence Code:

QFP144,.87SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

144

Standards

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

XC3S400-4TQG144I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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