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XC3S200AN-4FTG256C

Xilinx

XC3S200AN-4FTG256C by Xilinx

Xilinx XC3S200AN-4FTG256C is a FPGA with 4032 logic cells, 448 CLBs, and 195 inputs. It operates at max frequency of 667 MHz and has 160 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.

Median Price

$61.870

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Future Electronics

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Mouser Electronics

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DigiKey

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Element14

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Component Electronics Inc.

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Vigor

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Ampacity Inc.

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Semicontronic

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Continental Prestige Electronics

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Aztec Data Supply Inc.

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Microchip USA

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Aranea Global

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Texas Native Microelectronics

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Modulus Dynamics

Lithuania . 1,667 parts In-Stock

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Kenton Components

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Advanced Electronics

New Zealand . 325 parts In-Stock

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RC Electronics

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Qasali Group International

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Overview

Discover the power of the XC3S200AN-4FTG256C by Xilinx, a top-of-the-line Field Programmable Gate Array that offers unmatched quality and performance. With 4032 logic cells and 448 CLBs, this FPGA is perfect for a wide range of applications. From aerospace to telecommunications, this versatile technology can handle it all. Trust in Xilinx's reputation for excellence and innovation, and experience the value and benefits that the XC3S200AN-4FTG256C brings to your projects. Upgrade to Xilinx and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable.

No. of Logic Cells: 4032

With a high number of logic cells, this FPGA offers great flexibility and processing power for complex applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into existing electronic systems.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation.

No. of CLBs: 448

The high number of Configurable Logic Blocks (CLBs) provides ample resources for implementing various functions.

Technology Used: CMOS

The CMOS technology ensures low power consumption and high noise immunity.

No. of Inputs: 195

With a high number of inputs, this FPGA can handle complex input/output requirements.

Package Shape: SQUARE

The square shape of the package makes it easy to handle and place on a PCB.

Form Of Terminal: BALL

The ball terminals provide a reliable connection and allow for easy soldering during assembly.

No. of Equivalent Gates: 200000

The high number of equivalent gates allows for the implementation of complex logic functions.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V is ideal for low-power applications.

Power Supplies (V): 1.2,1.2/3.3,3.3

The multiple power supply options offer flexibility in designing and integrating this FPGA into different systems.

No. of Terminals: 256

With a high number of terminals, this FPGA can support various connections and interfaces.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for versatile and customizable applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array style and low profile design make this FPGA suitable for space-constrained environments.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in challenging environments.

Pitch Of Terminal: 1 mm

The 1mm pitch of the terminals allows for easy placement and routing on a PCB.

Maximum Combinatorial Delay of a CLB: 0.71 ns

The low maximum delay of a CLB ensures fast processing and high-speed performance.

Organization: 448 CLBS, 200000 GATES

The organizational structure of 448 CLBs and 200,000 gates offers a balanced combination of flexibility and processing power.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of environmental conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The finishing of terminals with tin, silver, and copper ensures good conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

The bottom position of the terminals allows for efficient heat dissipation and easier routing on a PCB.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this FPGA can withstand moderate moisture exposure during storage and handling.

Maximum Seated Height: 1.55 mm

The low maximum seated height allows for compact assembly and integration into device designs.

Width: 17 mm

The compact width makes this FPGA suitable for space-constrained applications.

Maximum Clock Frequency: 667 MHz

The high maximum clock frequency enables high-speed operation and real-time processing capabilities.

No. of Outputs: 160

With a high number of outputs, this FPGA can support multiple data streams and signal processing requirements.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures a reliable and efficient soldering process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and reliability of the connections.

Length: 17 mm

The compact length of this FPGA makes it suitable for space-saving designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S200AN-4FTG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

4032

No. of Inputs:

195

No. of Outputs:

160

No. of CLBs:

448

No. of Equivalent Gates:

200000

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.71 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

448 CLBS, 200000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3S200AN-4FTG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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