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XC7A25T-2CSG325I

Xilinx

XC7A25T-2CSG325I by Xilinx

Xilinx XC7A25T-2CSG325I FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with low profile grid array style.

Median Price

$62.940

Lifecycle Status

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11

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Farnell

UK . 2 parts In-Stock

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Newark

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$62.310

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DigiKey

USA . 479 parts In-Stock

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Mouser Electronics

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Element14

Singapore . 2 parts In-Stock

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Digiode

USA . 280 parts In-Stock

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VNN

France . 776 parts In-Stock

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Nova Conductors

Japan . 85 parts In-Stock

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Cyclops Electronics Ltd

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Chip Stock

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AZTECH Wire

Italy . 649 parts In-Stock

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Ampacity Inc.

Singapore . 140 parts In-Stock

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Semicontronic

India . 132 parts In-Stock

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Corphita

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MARBEL Systems

Belgium . 40 parts In-Stock

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Continental Prestige Electronics

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Texas Native Microelectronics

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Vigor

Singapore . 458 parts In-Stock

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Aztec Data Supply Inc.

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Kenton Components

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Microchip USA

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Netroflash

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Modulus Dynamics

Lithuania . 1,423 parts In-Stock

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Corohmni

South Africa . 180 parts In-Stock

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Argo Parts USA

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Supply Digital

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Qasali Group International

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Overview

Unleash the power of innovation with the XC7A25T-2CSG325I by Xilinx, a cutting-edge Field Programmable Gate Array that pushes the boundaries of technology. With 23360 logic cells and 1825 CLBs, this FPGA offers unmatched performance for a wide range of applications. From telecommunications to automotive systems, the possibilities are endless. Trust in Xilinx's reputation for quality and reliability to deliver seamless integration and unparalleled efficiency. Elevate your projects to new heights with the XC7A25T-2CSG325I and experience a world of limitless potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body makes this FPGA lightweight and durable, ideal for portable or rugged applications.

No. of Logic Cells: 23360

With a large number of logic cells, this FPGA has the capability to handle complex and high-performance designs effectively.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration of this FPGA onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage of 1.05V makes this FPGA energy-efficient and suitable for low-power applications.

Technology Used: HKMG

The adoption of HKMG (High-K Metal Gate) technology ensures high performance, low power consumption, and increased reliability in this FPGA.

No. of Inputs: 150

With 150 inputs, this FPGA offers flexibility and versatility in designing complex circuits and systems.

Package Shape: SQUARE

The square package shape enables efficient use of board space and facilitates easy interfacing with other components on the PCB.

Form Of Terminal: BALL

The ball form of terminals simplifies the soldering process, ensuring secure connections and reliable performance in the circuit.

No. of Terminals: 325

Having 325 terminals provides ample connectivity options for interfacing with other components and devices in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA offers flexibility in design iterations and customization, making it a versatile choice for various applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A25T-2CSG325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

23360

No. of Inputs:

150

No. of Outputs:

150

No. of CLBs:

1825

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Technology:

HKMG

Organization:

1825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Trade Compliance

XC7A25T-2CSG325I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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