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XC7A200T-1FBG676I

Xilinx

XC7A200T-1FBG676I by Xilinx

The Xilinx XC7A200T-1FBG676I is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

Median Price

$358.537

Lifecycle Status

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Farnell

UK . 14 parts In-Stock

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Element14

Singapore . 14 parts In-Stock

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Digiode

USA . 164 parts In-Stock

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VNN

France . 945 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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Corohmni

South Africa . 343 parts In-Stock

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$87.539

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Advanced Electronics

New Zealand . 47 parts In-Stock

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$88.464

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$84.040

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Modulus Dynamics

Lithuania . 1,717 parts In-Stock

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Aztec Data Supply Inc.

USA . 154 parts In-Stock

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$124.890

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Texas Native Microelectronics

USA . 848 parts In-Stock

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Kenton Components

USA . 25 parts In-Stock

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$192.228

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$176.209

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Microchip USA

USA . 4,720 parts In-Stock

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$231.060

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$230.380

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$230.040

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$229.700

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Continental Prestige Electronics

USA . 28 parts In-Stock

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Semicontronic

India . 14 parts In-Stock

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$288.370

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Ampacity Inc.

Singapore . 10 parts In-Stock

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Corphita

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Argo Parts USA

USA . 1,772 parts In-Stock

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$339.260

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$335.867

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$332.475

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$329.082

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Qasali Group International

UK . 3,168 parts In-Stock

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S.R.D Solutions

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A-Z Elektronik GmbH

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Lixinc

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Supply Digital

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Robosynatics

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Lucentia Tech

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MARBEL Systems

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Futuretech Components

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Overview

Unlock limitless possibilities with the Xilinx XC7A200T-1FBG676I FPGA, a cutting-edge solution for your programmable logic needs. Crafted by the reputable manufacturer Xilinx, this high-quality device boasts 215360 logic cells and 16825 CLBs, offering unmatched performance and flexibility. Whether you're designing advanced electronics, aerospace systems, or telecommunications equipment, this FPGA delivers exceptional value, speed, and reliability. Say hello to innovation with the XC7A200T-1FBG676I and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, allowing for easy handling and protection of the internal components.

No. of Logic Cells: 215360

With a large number of logic cells, this FPGA offers significant processing power and flexibility for implementing complex logic functions and algorithms.

Surface Mount: YES

Being surface mountable, this FPGA can be easily integrated onto printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage requirement helps in reducing power consumption and heat dissipation, making it suitable for energy-efficient applications.

Technology Used: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making this FPGA versatile and efficient.

No. of Inputs: 400

Having a high number of inputs allows for a wide range of external signals to be processed and manipulated by the FPGA, enhancing its applicability in diverse applications.

Package Shape: SQUARE

The square shape of the package makes it easy to handle and orient during installation, ensuring proper alignment with other components on the PCB.

Form Of Terminal: BALL

The ball form of terminal connections provides reliable electrical contact and mechanical support, ensuring a stable connection in high-vibration environments.

No. of Terminals: 676

Having a sufficient number of terminals allows for the FPGA to interface with other circuitry and peripherals, enabling seamless integration into complex systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA offers flexibility in design iteration and prototyping, allowing for quick customization and deployment of applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A200T-1FBG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

215360

No. of Inputs:

400

No. of Outputs:

400

No. of CLBs:

16825

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

16825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.54 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A200T-1FBG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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