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XC7A35T-1CSG324C

Xilinx

XC7A35T-1CSG324C by Xilinx

Xilinx XC7A35T-1CSG324C FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor with low power consumption.

Median Price

$57.523

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Overview

Unlock the power of innovation with the XC7A35T-1CSG324C by Xilinx. As a leading manufacturer in Field Programmable Gate Arrays (FPGA), Xilinx delivers exceptional quality and reliability. This FPGA boasts 33280 logic cells, 2600 CLBs, and 250 inputs/outputs making it perfect for a wide range of applications. From telecommunications to automotive, this versatile product offers unmatched value, benefits, and advantages to customers looking to push the boundaries of technology. Experience the future with Xilinx's XC7A35T-1CSG324C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the FPGA, making it suitable for various applications.

No. of Logic Cells: 33280

High number of logic cells allows for complex programmable logic designs to be implemented efficiently.

Surface Mount: YES

Allows for easy installation on a PCB, simplifying the manufacturing process.

Maximum Supply Voltage: 1.05 V

Low supply voltage helps in reducing power consumption and heat dissipation, making the FPGA more energy-efficient.

No. of CLBs: 2600

Abundance of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic circuits.

No. of Inputs: 250

High number of inputs allow for a wide range of external signals to be processed by the FPGA.

Package Shape: SQUARE

Square shape facilitates efficient use of PCB space and easy alignment during assembly.

Form Of Terminal: BALL

Ball terminals enable secure connections and good electrical conductivity, ensuring reliable performance.

No. of Terminals: 324

Sufficient number of terminals for interfacing with external components and connections.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA allows for reprogramming of the logic and functionality as needed, offering flexibility for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This packaging style offers high interconnect density, low profile for space-saving, and fine pitch for efficient signal routing.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage provides a wide operating voltage range for different power supply setups.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable operation even in challenging thermal conditions.

Pitch Of Terminal: 0.8 mm

Narrow terminal pitch enables high-density mounting and space-saving on the PCB.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low combinatorial delay ensures fast processing of logic operations, contributing to high performance.

Organization: 2600 CLBS

Organized structure with 2600 CLBs allows for efficient configuration and utilization of logic resources.

Minimum Operating Temperature: 0 °C

Operational at low temperatures makes it suitable for diverse environments and applications.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The finishing provides good reliability, corrosion resistance, and solderability for the terminal connections.

Position Of Terminal: BOTTOM

Bottom terminal placement eases PCB routing and allows for compact design layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring proper handling during storage and assembly.

Maximum Seated Height: 1.5 mm

Low seated height facilitates slim and compact PCB designs, suitable for space-constrained applications.

Width: 15 mm

Compact width size enables efficient PCB integration without sacrificing functionality.

Maximum Clock Frequency: 1098 MHz

High maximum clock frequency allows for fast processing and high-speed data transfers.

No. of Outputs: 250

Abundance of outputs allows for driving multiple external components and interfacing with various systems.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate time for reflow soldering process ensures proper soldering of the FPGA onto the PCB.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables reliable soldering in lead-free and high-temperature assembly processes.

Length: 15 mm

Compact length size contributes to space-saving design considerations and efficient PCB layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A35T-1CSG324C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

33280

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

2600

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

2600 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A35T-1CSG324C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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