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XC7A35T-2FGG484C

Xilinx

XC7A35T-2FGG484C by Xilinx

Xilinx XC7A35T-2FGG484C FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

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$79.030

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Digiode

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Nova Conductors

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Modulus Dynamics

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Advanced Electronics

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Vigor

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Ampacity Inc.

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MARBEL Systems

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Corphita

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Continental Prestige Electronics

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Microchip USA

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Texas Native Microelectronics

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Bastille Electronics

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Kenton Components

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Aztec Data Supply Inc.

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One Stop Electronics

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Corohmni

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Qasali Group International

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Overview

Unlock endless possibilities with the Xilinx XC7A35T-2FGG484C Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA boasts cutting-edge technology and a robust package body material for ultimate reliability. With 33280 logic cells and 2600 CLBs, this versatile device is perfect for applications requiring high performance and flexibility. Experience seamless integration, rapid prototyping, and unmatched customization with this powerhouse FPGA. Elevate your projects to new heights with the XC7A35T-2FGG484C from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, ideal for portable or rugged applications.

No. of Logic Cells: 33280

With a high number of logic cells, this FPGA offers ample resources for complex designs, making it suitable for advanced projects.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 1.05 V

Operating at a low voltage of 1.05V helps reduce power consumption and heat dissipation, making it energy-efficient.

No. of CLBs: 2600

The large number of Configurable Logic Blocks (CLBs) provides flexibility in design implementation and scalability for future enhancements.

Technology Used: CMOS

Utilizing CMOS technology ensures high performance, low power consumption, and compatibility with a wide range of digital systems.

No. of Inputs: 250

With 250 input pins, this FPGA can accommodate a variety of input signals, allowing for versatile connectivity options.

Package Shape: SQUARE

The square package shape facilitates easy integration into PCB layouts, maximizing space efficiency and simplifying board design.

Form Of Terminal: BALL

The ball terminal design offers reliable electrical connections and mechanical stability, ensuring consistent performance in demanding environments.

No. of Terminals: 484

The high number of terminals provides ample connectivity options and I/O capabilities, enabling versatile interfacing with external devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for customization and reconfiguration of logic functions, making it versatile and adaptable to changing requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers high pin density and efficient routing of signals, enabling high-speed performance and optimal signal integrity.

Minimum Supply Voltage: 0.95 V

Operating at a low minimum voltage of 0.95V ensures compatibility with a wide range of power sources and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this FPGA can withstand elevated environmental temperatures, ensuring reliable operation in harsh conditions.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals provides adequate spacing for easy soldering and assembly, simplifying the manufacturing process and improving reliability.

Maximum Combinatorial Delay of a CLB: 1.05 ns

The low maximum combinatorial delay of 1.05ns ensures fast processing and response times, making it suitable for high-performance applications.

Organization: 2600 CLBs

The organization of 2600 Configurable Logic Blocks (CLBs) offers a balance between flexibility and complexity, making it suitable for a wide range of design requirements.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can function in cold environments without compromising performance, making it versatile and reliable.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing enhances conductivity, corrosion resistance, and solderability, ensuring long-term reliability and performance.

Position Of Terminal: BOTTOM

The bottom terminal position facilitates efficient PCB layout and routing of signals, optimizing signal integrity and reducing interference in high-speed designs.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling precautions during storage and assembly to prevent damage.

Maximum Seated Height: 2.6 mm

The maximum seated height of 2.6mm allows for compact and low-profile designs, optimizing space constraints in applications with limited clearance.

Width: 23 mm

The width of 23mm offers a compact footprint, making it suitable for space-constrained designs or applications where size is a critical factor.

Maximum Clock Frequency: 1286 MHz

With a high maximum clock frequency of 1286MHz, this FPGA can process data at high speeds, making it suitable for real-time applications and high-performance computing.

No. of Outputs: 250

With 250 output pins, this FPGA provides ample connectivity options for transmitting processed data to external devices, enabling versatile interfacing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature allows for efficient soldering and assembly processes, ensuring reliable electrical connections and mechanical stability.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250°C enables reliable and consistent solder joint formation during assembly, ensuring robust mechanical connections and long-term reliability.

Length: 23 mm

The length of 23mm offers a compact form factor, making this FPGA suitable for applications where space is limited or where a smaller footprint is desired.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A35T-2FGG484C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

33280

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

2600

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2600 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A35T-2FGG484C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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