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XC7A35T-1CSG325C

Xilinx

XC7A35T-1CSG325C by Xilinx

Xilinx XC7A35T-1CSG325C is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

Median Price

$65.680

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Adafruit Industries

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Farnell

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DigiKey

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Mouser Electronics

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Element14

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Digiode

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Nova Conductors

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Modulus Dynamics

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AZTECH Wire

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Semicontronic

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Corphita

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Advanced Electronics

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Vigor

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Continental Prestige Electronics

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Aranea Global

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Qasali Group International

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Ampacity Inc.

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Robosynatics

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Lucentia Tech

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RC Electronics

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Overview

Unlock limitless possibilities with the Xilinx XC7A35T-1CSG325C Field Programmable Gate Array. Crafted by industry leader Xilinx, this high-quality FPGA boasts 33280 logic cells and 2600 CLBs, offering unparalleled performance and flexibility. Whether you're developing cutting-edge IoT devices, implementing machine learning algorithms, or designing innovative automotive solutions, this FPGA empowers you to bring your visions to life. Experience enhanced productivity, reduced time to market, and unmatched reliability with the Xilinx XC7A35T-1CSG325C. Elevate your projects to new heights with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for the package body, ensuring the safety and protection of the internal components.

No. of Logic Cells: 33280

With a large number of logic cells, this FPGA offers high flexibility and capability for complex programmable logic designs.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05 V helps reduce power consumption and heat generation, making the FPGA efficient and cost-effective.

No. of CLBs: 2600

2600 Configurable Logic Blocks (CLBs) provide ample resources for implementing a wide range of logic functions and designs within the FPGA.

No. of Inputs: 250

Having 250 inputs allows for a high level of connectivity and input/output options, enabling versatile usage in various applications.

Package Shape: SQUARE

Square package shape is compact and space-efficient, making it suitable for densely populated circuit boards and compact electronic devices.

Form Of Terminal: BALL

Using ball terminals ensures secure and reliable connections, facilitating easy integration and connectivity in circuit board assemblies.

No. of Terminals: 325

The 325 terminals provide ample connection points for interfacing with external components, expanding the flexibility and functionality of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for customizable and reconfigurable logic implementations, making it adaptable to changing design requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density integration, efficient heat dissipation, and compatibility with modern circuit board layouts.

Minimum Supply Voltage: 0.95 V

Operating at a minimum supply voltage of 0.95 V allows for low-power operation and energy efficiency, reducing overall system power consumption.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the FPGA can withstand elevated temperature environments without compromising performance or reliability.

Pitch Of Terminal: 0.8 mm

The 0.8 mm pitch of the terminals enables fine pitch connections, enhancing connectivity density and enabling high-speed signal routing in the FPGA.

Maximum Combinatorial Delay of a CLB: 1.27 ns

A low maximum combinatorial delay of 1.27 ns ensures fast signal propagation and high-speed logic operations within the Configurable Logic Blocks (CLBs).

Organization: 2600 CLBS

Organized into 2600 Configurable Logic Blocks (CLBs), this FPGA provides a structured and modular design approach for implementing complex logic functions.

Minimum Operating Temperature: 0 °C

Capable of operating at minimum temperature of 0°C, making it suitable for a wide range of operating environments and temperature conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Using Tin/Silver/Copper as terminal finishing material ensures good conductivity, corrosion resistance, and solderability for reliable interconnections.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom enables easy PCB layout and routing, simplifying the assembly and integration processes.

Moisture Sensitivity Level (MSL): 3

MSL of 3 indicates moderate sensitivity to moisture, necessitating appropriate handling and storage to prevent moisture-related damage during assembly and operation.

Maximum Seated Height: 1.5 mm

With a low maximum seated height of 1.5 mm, this FPGA is suitable for applications with height constraints, enabling compact and slim electronic designs.

Width: 15 mm

Having a width of 15 mm allows for efficient space utilization on a circuit board, accommodating compact system layouts and enabling high-density integration.

Maximum Clock Frequency: 1098 MHz

Capable of operating at a maximum clock frequency of 1098 MHz, the FPGA offers high-speed performance for time-critical applications and data processing tasks.

No. of Outputs: 250

Having 250 outputs provides extensive output options and flexibility for signal routing, data processing, and interfacing with external components in the design.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient solder reflow process with a maximum time of 30 seconds at peak temperature, ensuring reliable and secure solder connections during assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding a peak reflow temperature of 260°C, ensuring robust solder joints and reliable connections during the assembly process.

Length: 15 mm

With a length of 15 mm, this FPGA offers a compact form factor suitable for space-constrained applications, enabling versatile integration within electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A35T-1CSG325C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

33280

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

2600

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

2600 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A35T-1CSG325C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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