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XC7A35T-2CSG325I

Xilinx

XC7A35T-2CSG325I by Xilinx

Xilinx XC7A35T-2CSG325I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in compact form factor. Operates b/w -40 to 100 °C with low profile grid array package style.

Median Price

$83.052

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Element14

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Digiode

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Modulus Dynamics

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Aztec Data Supply Inc.

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Corohmni

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Continental Prestige Electronics

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Advanced Electronics

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iBuyXS LLC

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Ampacity Inc.

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Semicontronic

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Vigor

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Microchip USA

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Texas Native Microelectronics

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Qasali Group International

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Supply Digital

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Kenton Components

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Netroflash

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Overview

Unlock the power of cutting-edge technology with the Xilinx XC7A35T-2CSG325I FPGA! Crafted by the industry leader in programmable devices, Xilinx, this FPGA boasts 33280 logic cells and a maximum clock frequency of 1286 MHz. Perfect for a wide range of applications, from telecommunications to automotive systems, this FPGA offers unparalleled flexibility and performance. Experience seamless integration and enhanced functionality with the Xilinx XC7A35T-2CSG325I - your gateway to innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides good durability and protection for the FPGA chip, making it suitable for various environments.

No. of Logic Cells: 33280

The high number of logic cells allows for complex logic functions to be implemented efficiently, making the FPGA versatile for a wide range of applications.

Surface Mount: YES

Being surface mountable makes it easier to integrate the FPGA onto circuit boards, saving space and making the manufacturing process more efficient.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA more efficient and reliable.

No. of CLBs: 2600

The high number of Configurable Logic Blocks (CLBs) allows for flexible design configurations and implementation of complex logic functions.

No. of Inputs: 250

Having a high number of inputs enables the FPGA to handle a large amount of data inputs simultaneously, enhancing its processing capabilities.

Package Shape: SQUARE

The square package shape helps in efficient placement on circuit boards and ensures uniformity in design layout.

Form Of Terminal: BALL

The ball terminal form provides reliable connectivity and ease of soldering during the manufacturing process.

No. of Terminals: 325

Having a sufficient number of terminals allows for easy integration and connectivity with other components in the system design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for reprogramming and customization of the logic functions, providing flexibility in design and prototyping.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch design ensures efficient thermal management, compact size, and high performance in the system.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for operation in low power environments while maintaining reliable performance.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range makes the FPGA suitable for industrial applications with demanding environmental conditions.

Pitch Of Terminal: 0.8 mm

The fine pitch of terminals enables high-density mounting and space-saving integration on circuit boards.

Maximum Combinatorial Delay of a CLB: 1.05 ns

The low maximum combinatorial delay of a Configurable Logic Block (CLB) ensures fast signal processing and high-speed performance of the FPGA.

Organization: 2600 CLBS

The organized structure with 2600 Configurable Logic Blocks (CLBs) provides a systematic layout for efficient design implementation and optimization.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for reliable operation in extreme cold environments without compromising performance.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals ensures good conductivity, corrosion resistance, and reliability in the connectivity of the FPGA.

Position Of Terminal: BOTTOM

The bottom position of the terminals allows for easy access and connection during the integration process onto circuit boards.

Moisture Sensitivity Level (MSL): 3

The MSL level 3 indicates a moderate sensitivity to moisture, ensuring proper handling and storage to maintain the integrity of the FPGA.

Maximum Seated Height: 1.5 mm

The low maximum seated height profile allows for slim and compact design integration in space-constrained applications.

Width: 15 mm

The 15mm width provides a compact form factor for easy placement and installation in various electronic devices and systems.

Maximum Clock Frequency: 1286 MHz

The high maximum clock frequency enables fast data processing and high-speed operations, making the FPGA suitable for real-time applications.

No. of Outputs: 250

Having a high number of outputs allows the FPGA to drive multiple components and achieve complex functionalities in the system design.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures efficient soldering and manufacturing processes for the FPGA.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures reliable soldering and durability of the FPGA during manufacturing and operation.

Length: 15 mm

The 15mm length provides a compact and standardized form factor for easy integration and compatibility with various electronic systems and designs.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance and durability of the FPGA in harsh industrial environments with temperature variations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A35T-2CSG325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

33280

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

2600

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

2600 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A35T-2CSG325I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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