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XC7A35T-1FTG256C

Xilinx

XC7A35T-1FTG256C by Xilinx

Xilinx XC7A35T-1FTG256C is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. Package style: Grid Array, low profile, fine pitch.

Median Price

$48.970

Lifecycle Status

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Element14

Singapore . 34 parts In-Stock

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Farnell

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DigiKey

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Mouser Electronics

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Newark

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Digiode

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Bristol Electronics

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Nova Conductors

Japan . 450 parts In-Stock

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Vyrian

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LIBRA Elektronik GmbH

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Quantum Digital Technology

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Prism Electronics

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AZTECH Wire

Italy . 653 parts In-Stock

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Ampacity Inc.

Singapore . 169 parts In-Stock

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Vigor

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Corphita

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Continental Prestige Electronics

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Microchip USA

USA . 3,558 parts In-Stock

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$45.020

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Aztec Data Supply Inc.

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Semicontronic

India . 292 parts In-Stock

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Advanced Electronics

New Zealand . 15 parts In-Stock

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Modulus Dynamics

Lithuania . 552 parts In-Stock

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Corohmni

South Africa . 409 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 164 parts In-Stock

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Qasali Group International

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Robosynatics

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Lucentia Tech

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Supply Digital

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Netroflash

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iodParts Technologies Inc.

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Overview

Unleash the power of cutting-edge technology with the XC7A35T-1FTG256C by Xilinx, a leader in Field Programmable Gate Arrays (FPGA). With 33280 logic cells and a maximum clock frequency of 1098 MHz, this FPGA offers unparalleled performance and versatility for a wide range of applications. Whether you're designing advanced electronics or pushing the boundaries of innovation, this product delivers exceptional value, benefits, and advantages to meet your needs. Upgrade to the XC7A35T-1FTG256C and experience the difference that quality engineering can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FPGA, ensuring it can withstand environmental factors during operation.

No. of Logic Cells: 33280

High number of logic cells allows for complex processing and versatile functionality within the FPGA.

Surface Mount: YES

Ease of installation and integration into circuit boards for efficient use of space and reduced assembly time.

Maximum Supply Voltage: 1.05 V

Efficient power usage and compatibility with low voltage systems for energy savings.

No. of CLBs: 2600

Abundance of Configurable Logic Blocks enables flexible design and implementation of various functions.

No. of Inputs: 250

High number of inputs allows for extensive connectivity and input options for complex operations.

Package Shape: SQUARE

Uniform shape and dimensions for easier handling and organization in electronic systems.

Form Of Terminal: BALL

Ball terminals provide secure connections and efficient signal transmission for reliable performance.

No. of Terminals: 256

Sufficient number of terminals for versatile connectivity options and integration into circuit designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Field programmability enables customization and flexibility for various applications and requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Optimal package style for efficient routing, compact size, and high-density integration in electronic systems.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage allows for energy-efficient operation and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in diverse environmental conditions.

Pitch Of Terminal: 1 mm

Standard terminal pitch for compatibility with common connectors and ease of installation.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low combinatorial delay enables fast processing and efficient execution of logic functions within CLBs.

Organization: 2600 CLBS

Organized structure with 2600 CLBs allows for systematic design and implementation of logic functions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature tolerance ensures reliable performance even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

High-quality terminal finishing for improved conductivity, durability, and resistance to corrosion.

Position Of Terminal: BOTTOM

Bottom terminal position for easy access, connectivity, and efficient routing within electronic systems.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level suitable for standard handling and storage procedures.

Maximum Seated Height: 1.55 mm

Low seated height for compact design and space-saving integration in electronic assemblies.

Width: 17 mm

Optimal width dimension for compatibility with standard board layouts and efficient space utilization.

Maximum Clock Frequency: 1098 MHz

High maximum clock frequency allows for fast data processing and efficient operation in high-speed applications.

No. of Outputs: 250

Abundance of output options for extensive signal processing and versatile connectivity in electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature for secure solder connections and reliable solder joints during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for effective soldering and durable connections during assembly processes.

Length: 17 mm

Optimal length dimension for compatibility with standard board layouts and efficient space utilization in electronic designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A35T-1FTG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

33280

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

2600

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

2600 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A35T-1FTG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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