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M2GL060-FGG676I

Microchip Technology

M2GL060-FGG676I by Microchip Technology

Microchip Technology's M2GL060-FGG676I is a PLASTIC/EPOXY FPGA with 676 terminals, operating b/w -40 to 100 °C. It has a supply voltage range of 1.14-1.26 V and can handle peak reflow at 250C. Ideal for industrial applications requiring high-performance programmable ICs in a compact GRID ARRAY package.

Median Price

$132.120

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 74 parts In-Stock

1+ parts

$132.120

100+ parts

$123.310

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74

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$123.310

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Mouser Electronics

USA . 12 parts In-Stock

1+ parts

$132.120

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$123.310

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-

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12

$132.120

$123.310

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$115.900

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300

$115.900

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Digiode

USA . 72 parts In-Stock

1+ parts

$125.514

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72

$125.514

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Vyrian

USA . 8,547 parts In-Stock

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8,547

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Chip Stock

USA . 1,039 parts In-Stock

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1,039

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 295 parts In-Stock

1+ parts

$14.612

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295

$14.612

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Ampacity Inc.

Singapore . 26 parts In-Stock

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$112.300

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26

$112.300

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Semicontronic

India . 26 parts In-Stock

1+ parts

$112.300

100+ parts

$109.492

1k+ parts

$108.931

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26

$112.300

$109.492

$108.931

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Corohmni

South Africa . 309 parts In-Stock

1+ parts

$113.180

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309

$113.180

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Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$115.900

100+ parts

$110.105

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10k+ parts

$103.151

10

$115.900

$110.105

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$103.151

Continental Prestige Electronics

USA . 4,745 parts In-Stock

1+ parts

$115.900

100+ parts

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$113.582

4,745

$115.900

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$113.582

Corphita

USA . 481 parts In-Stock

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$118.908

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481

$118.908

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Aztec Data Supply Inc.

USA . 621 parts In-Stock

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$127.530

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621

$127.530

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Advanced Electronics

New Zealand . 963 parts In-Stock

1+ parts

$178.942

100+ parts

$169.995

1k+ parts

$169.995

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963

$178.942

$169.995

$169.995

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West Coast Incorporated

USA . 6,386 parts In-Stock

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6,386

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Argo Parts USA

USA . 3,081 parts In-Stock

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3,081

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Overview

Unlock the limitless possibilities of advanced technology with the M2GL060-FGG676I by Microchip Technology. As a leading manufacturer in the field, Microchip Technology delivers top-quality Field Programmable Gate Arrays (FPGA) that are designed to revolutionize your projects. With its innovative design and superior performance, this product offers unmatched value and benefits to customers seeking cutting-edge solutions in various applications. Experience the difference with Microchip Technology and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and resistance to environmental factors, making this product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.26 V

High maximum supply voltage provides flexibility in power requirements, accommodating different system configurations.

Package Shape: SQUARE

Square package shape offers efficient use of space and facilitates uniform heat dissipation for improved performance.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures consistent operation and reliable functionality of the FPGA.

Packing Method: TRAY

Tray packing method allows for convenient handling and storage of multiple units, enhancing efficiency in manufacturing and distribution.

No. of Terminals: 676

High number of terminals enables versatile connectivity options for integration into complex systems and circuits.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Field programmable gate array design offers flexibility in customization and reconfigurability, making it suitable for diverse applications.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates easy alignment and soldering of terminals, ensuring reliable electrical connections and stable performance.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage allows for efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance ensures reliability in demanding environments and under varying thermal conditions.

Pitch Of Terminal: 1 mm

Narrow pitch of terminals enables compact layout design and efficient use of PCB real estate, contributing to overall system miniaturization.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range allows for reliable performance even in extreme cold conditions, expanding the product's application scope.

Position Of Terminal: BOTTOM

Bottom terminal position simplifies PCB assembly and facilitates heat dissipation, ensuring optimal performance and longevity of the FPGA.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling precautions to maintain the product's integrity during storage and assembly.

Maximum Seated Height: 2.44 mm

Low maximum seated height allows for compatibility with compact designs and reduces the overall profile of the assembled circuit board.

Width: 27 mm

Optimal width dimension offers a balance between space efficiency and robust construction, ensuring compatibility with standard PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for thorough soldering and bonding of components, ensuring secure connections and reliable performance.

Peak Reflow Temperature °C: 250

High peak reflow temperature capability enables efficient and reliable soldering of the FPGA during assembly, ensuring strong and durable connections.

Length: 27 mm

Optimal length dimension enables compatibility with standard PCB layouts and facilitates uniform distribution of components for efficient signal transmission.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature grading ensures reliable performance in harsh operating conditions, making this FPGA suitable for a wide range of industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2GL060-FGG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

Trade Compliance

M2GL060-FGG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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