Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Intel's 10M16DAF256A7G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a package style of grid array and programmable IC type, it is ideal for automotive applications requiring high performance in a compact form factor.
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This durable material ensures the FPGA is suitable for various environments and provides reliable performance.
With a large number of logic cells, this FPGA has the capability to handle complex applications and processes effectively.
The surface mount feature allows for easy installation and integration into electronic systems, saving time and effort.
This low maximum supply voltage helps in reducing power consumption and limiting heat generation for efficient operation.
The ample number of Configurable Logic Blocks (CLBs) provides flexibility and versatility in designing custom logic functions.
With a high number of inputs, this FPGA can accommodate a wide range of signals and data inputs for diverse applications.
The square shape of the package allows for efficient use of space and easy placement on circuit boards for optimized design layouts.
The ball terminal design offers a reliable connection and ease of soldering for secure and stable operation.
The nominal supply voltage of 1.2V ensures stable and consistent power delivery for reliable performance.
The abundant terminals allow for versatile connectivity options and enable the FPGA to interface with multiple components.
Being a Field Programmable Gate Array, this product offers flexibility in design and customization to suit specific application requirements.
The grid array package style provides a robust and reliable mounting solution for the FPGA, ensuring secure placement and connectivity.
The low minimum supply voltage helps in enhancing power efficiency and reducing power consumption for cost-effective operation.
With a high maximum operating temperature, this FPGA is suitable for demanding environments and ensures reliable performance under varying conditions.
The tight pitch of terminals allows for compact design layouts and efficient use of board space for optimized system integration.
The organization of 1000 Configurable Logic Blocks (CLBs) provides ample resources for implementing complex logic functions and algorithms.
The low minimum operating temperature allows for reliable performance even in extreme cold environments, making it suitable for various applications.
The use of high-quality finishing materials for terminals ensures durability and reliability in connectivity for long-lasting performance.
The bottom position of the terminals facilitates easy connection and integration into circuit boards, providing convenience during installation.
The low maximum seated height allows for slim and compact design configurations, making it suitable for space-constrained applications.
The compact width of the FPGA enables efficient placement on circuit boards and allows for flexible design layouts.
The high number of outputs allows for extensive data and signal transmission capabilities, making this FPGA suitable for demanding applications.
The compact length of the FPGA enables space-efficient design layouts and accommodates various constraints in electronic systems.
The automotive-grade temperature grading ensures the FPGA can withstand harsh automotive environments and provides reliable performance in vehicle applications.
Field Programmable Gate Arrays (FPGA) 10M16DAF256A7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
Programmable IC Type:
No. of Logic Cells:
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Organization:
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Package Body Material:
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JESD-30 Code:
JESD-609 Code:
10M16DAF256A7G Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Max10 Pin Guide 3/Dec/2021 Mult Dev Software Chgs 3/Jun/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
BAT54SLT1G
Onsemi
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
4554
Jw Miller Magnetics
Other Semiconductors;
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
Synsemi
Vishay Telefunken
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Electronic Transistors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
06035C103KAT2A
KYOCERA AVX
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
Fairchild Semiconductor
BAV99-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
SS14
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
EP2C20F256C8N
Intel
EP2C20F256C8N by Intel is a FPGA with 18752 logic cells, 1172 CLBs, and 152 inputs. It operates at a max clock frequency of 402.5 MHz and is suitable for applications requiring high-speed processing and programmable ICs in various industries. With a package style of grid array and low profile, it offers versatility in design while maintaining a compact form factor.
LCMXO2-2000HC-4TG100C
Lattice Semiconductor
LCMXO2-2000HC-4TG100C by Lattice Semiconductor is a 2112 logic cell FPGA with 79 inputs/outputs, operating at max 133 MHz. Ideal for applications requiring high-speed processing in compact designs, it features a plastic/epoxy package body and operates b/w 0-85°C temperature range.
EP1C3T100I7N
EP1C3T100I7N by Intel is a FPGA with 2910 logic cells, 291 CLBs, and max clock frequency of 320 MHz. It is used in industrial applications due to its high operating temperature range (-40 to 100 °C) and versatile programmable IC type for various electronic designs. The package style includes flatpack, thin profile, fine pitch making it suitable for compact electronic devices.
A3P250-PQG208I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
LCMXO2-640HC-6TG100I
LCMXO2-640HC-6TG100I by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 78 Inputs/Outputs. Operating at 2.5V, it's ideal for applications requiring high-speed data processing in compact electronic systems. The PLASTIC/EPOXY package makes it suitable for surface mount designs in various industries.
XC7A100T-L1FTG256I
Xilinx
Xilinx XC7A100T-L1FTG256I is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
XC7S15-2CPGA196C
Xilinx XC7S15-2CPGA196C is a 12800 logic cell FPGA with 1000 CLBs, operating at max frequency of 1286 MHz. Suitable for applications requiring high-speed processing and low power consumption in electronics industry. Features include 0.5 mm terminal pitch, 1.05 ns combinatorial delay, and thin profile grid array package style.
ICE40LP384-SG32TR
ICE40LP384-SG32TR by Lattice Semiconductor is a 384 Logic Cells FPGA with 48 CLBs, operating at 1.2V. Suitable for industrial applications, it has a max combinatorial delay of 9.36ns and can withstand temperatures from -40 to 100°C.
XC6SLX4-2TQG144C
Xilinx XC6SLX4-2TQG144C is a FPGA with 3840 logic cells, 300 CLBs, and max clock frequency of 667 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing like telecommunications and industrial automation.
XCKU060-1FFVA1517C
Xilinx XCKU060-1FFVA1517C FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
LFE5U-25F-6BG256I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
A3P125-VQG100I
Microchip Technology
A3P125-VQG100I by Microchip Technology is a CMOS FPGA with 3072 CLBs and 125000 gates. It operates at max frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a package style of flatpack, thin profile, fine pitch, it offers versatility in design and integration.
EP3C10F256C8N
EP3C10F256C8N by Intel is a FPGA with 10320 logic cells, 182 inputs/outputs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities, such as telecommunications equipment and industrial automation systems.
XC3SD1800A-4FGG676I
Xilinx XC3SD1800A-4FGG676I FPGA offers 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. Ideal for applications requiring high-speed processing with a max clock frequency of 250 MHz. Package style: Grid Array, technology: CMOS, suitable for various electronic designs.
A3P250-PQG208
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XCAU20P-1SFVB784E
Xilinx XCAU20P-1SFVB784E is a FPGA with 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. It operates b/w -40°C to 100°C, with supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance programmable ICs in compact form factors.
10M40DAF256I7G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.2;
M1A3P1000-FGG484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XC7A50T-2FGG484I
Xilinx XC7A50T-2FGG484I FPGA features 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
EP4CE22E22C8N
EP4CE22E22C8N by Intel is a FPGA with 22320 logic cells, 1395 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style including flatpack and low profile options, it offers versatility in design and integration.
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10M16SAU169I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
The Intel 10M16SAU169I7G is a FPGA with 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. It operates at supply voltages b/w 2.85V to 3.15V and temperatures from -40°C to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.
10M16SCU169I7G
Intel's 10M16SCU169I7G FPGA boasts 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a max operating temperature of 100°C.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 130;
10M16SAU169C8G
The Intel 10M16SAU169C8G is a FPGA with 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. It operates b/w -40 to 85°C and has a supply voltage range of 2.85V to 3.15V. Ideal for applications requiring high-speed processing and programmable logic in compact designs.
The Altera 10M16SAU169C8G is a field programmable gate array (FPGA) with 169 terminals in a square BGA package. It can operate between 0 to 85 degrees Celsius and is suitable for various applications that require FPGA functionality.
10M16SAE144I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Position Of Terminal: QUAD;
Intel 10M16SAE144I7G is a FPGA with 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. It operates at 2.85-3.15V, -40 to 100°C, ideal for industrial applications requiring high-performance programmable ICs in compact form factors with low power consumption.
10M16SCU169A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
10M16DAF256A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
10M16SCE144I7G
Intel's 10M16SCE144I7G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a max operating temperature of 100°C and low profile package style.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; No. of Inputs: 101;
10M16SCU169C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
The Altera 10M16SCU169C8G is a Field Programmable Gate Array (FPGA) with 169 terminals. It operates at temperatures ranging from 0 to 85°C and has a plastic/epoxy package body material. This FPGA is surface mountable and features a square package shape with a ball form of terminal. Its package code is BGA and the package style is grid array. The maximum time at peak reflow temperature and peak reflow temperature are not specified. It is commonly used in various applications such as telecommunications, data processing, and industrial control systems.
10M16DAU324I7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
10M16SCE144C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
The Altera 10M16SCE144C8G is a CMOS Field Programmable Gate Array (FPGA) with 16,000 logic cells. It is surface mountable and has 101 inputs and outputs. The package is a square QFP with 144 terminals. Its operating temperature ranges from 0 to 85 degrees Celsius. The top application for this FPGA is in electronic systems that require customizable digital logic functionality.
10M16DAF256C8P
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
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