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10M16DAF256A7G

Intel

10M16DAF256A7G by Intel

Intel's 10M16DAF256A7G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a package style of grid array and programmable IC type, it is ideal for automotive applications requiring high performance in a compact form factor.

Median Price

$106.570

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DigiKey

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Nova Conductors

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Digiode

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AZTECH Wire

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Advanced Electronics

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Aranea Global

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Continental Prestige Electronics

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

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Microchip USA

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Component Stockers USA

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Aztec Data Supply Inc.

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Argo Parts USA

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Overview

Unlock endless possibilities with the Intel 10M16DAF256A7G Field Programmable Gate Array. Crafted by the renowned manufacturer, Intel, this FPGA offers unparalleled quality and reliability. With 16000 logic cells and 1000 CLBs, this versatile device is perfect for a wide range of applications. Whether you're in automotive, telecommunications, or industrial automation, this FPGA delivers exceptional performance and flexibility. Embrace innovation and efficiency with the Intel 10M16DAF256A7G - your gateway to limitless potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures the FPGA is suitable for various environments and provides reliable performance.

No. of Logic Cells: 16000

With a large number of logic cells, this FPGA has the capability to handle complex applications and processes effectively.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into electronic systems, saving time and effort.

Maximum Supply Voltage: 1.25 V

This low maximum supply voltage helps in reducing power consumption and limiting heat generation for efficient operation.

No. of CLBs: 1000

The ample number of Configurable Logic Blocks (CLBs) provides flexibility and versatility in designing custom logic functions.

No. of Inputs: 320

With a high number of inputs, this FPGA can accommodate a wide range of signals and data inputs for diverse applications.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space and easy placement on circuit boards for optimized design layouts.

Form Of Terminal: BALL

The ball terminal design offers a reliable connection and ease of soldering for secure and stable operation.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures stable and consistent power delivery for reliable performance.

No. of Terminals: 256

The abundant terminals allow for versatile connectivity options and enable the FPGA to interface with multiple components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product offers flexibility in design and customization to suit specific application requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides a robust and reliable mounting solution for the FPGA, ensuring secure placement and connectivity.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage helps in enhancing power efficiency and reducing power consumption for cost-effective operation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this FPGA is suitable for demanding environments and ensures reliable performance under varying conditions.

Pitch Of Terminal: 1 mm

The tight pitch of terminals allows for compact design layouts and efficient use of board space for optimized system integration.

Organization: 1000 CLBS

The organization of 1000 Configurable Logic Blocks (CLBs) provides ample resources for implementing complex logic functions and algorithms.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in extreme cold environments, making it suitable for various applications.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of high-quality finishing materials for terminals ensures durability and reliability in connectivity for long-lasting performance.

Position Of Terminal: BOTTOM

The bottom position of the terminals facilitates easy connection and integration into circuit boards, providing convenience during installation.

Maximum Seated Height: 1.55 mm

The low maximum seated height allows for slim and compact design configurations, making it suitable for space-constrained applications.

Width: 17 mm

The compact width of the FPGA enables efficient placement on circuit boards and allows for flexible design layouts.

No. of Outputs: 320

The high number of outputs allows for extensive data and signal transmission capabilities, making this FPGA suitable for demanding applications.

Length: 17 mm

The compact length of the FPGA enables space-efficient design layouts and accommodates various constraints in electronic systems.

Grading Of Temperature: AUTOMOTIVE

The automotive-grade temperature grading ensures the FPGA can withstand harsh automotive environments and provides reliable performance in vehicle applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M16DAF256A7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

16000

No. of Inputs:

320

No. of Outputs:

320

No. of CLBs:

1000

Organization:

1000 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Trade Compliance

10M16DAF256A7G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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